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公开(公告)号：US20110109000A1
公开(公告)日：2011-05-12
申请号：US12899859
申请日：2010-10-07
申请人： Sang-Uk Kim , Hyo-Chang Ryu , Jin-Woo Park , Dae-young Choi , Mi-yeon Kim
发明人： Sang-Uk Kim , Hyo-Chang Ryu , Jin-Woo Park , Dae-young Choi , Mi-yeon Kim
IPC分类号： H01L23/28
CPC分类号： H01L23/3128 , H01L23/16 , H01L23/562 , H01L24/13 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/13025 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2225/1094 , H01L2924/00014 , H01L2924/01019 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Provided are a semiconductor package and a method of forming the same. The semiconductor package includes a stress reliever disposed on a part (more specifically, a weak part) of a semiconductor chip. The stress reliever relieves thermal and/or physical stresses caused by a molding layer. As a result, the semiconductor chip does not suffer from the thermal and/or physical stresses.
摘要翻译： 提供半导体封装及其形成方法。 半导体封装包括设置在半导体芯片的一部分（更具体地，弱部分）上的应力消除器。 应力释放器减轻了由模制层引起的热和/或物理应力。 结果，半导体芯片不会受到热和/或物理应力的影响。
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公开(公告)号：US08338941B2
公开(公告)日：2012-12-25
申请号：US12805131
申请日：2010-07-14
申请人： Jinho Lee , Choongbin Yim , Jin-woo Park , Dae-young Choi , Mi-yeon Kim
发明人： Jinho Lee , Choongbin Yim , Jin-woo Park , Dae-young Choi , Mi-yeon Kim
IPC分类号： H01L23/48
CPC分类号： H01L21/76898 , H01L23/13 , H01L23/481 , H01L23/49822 , H01L23/49838 , H01L24/05 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/18 , H01L2224/02372 , H01L2224/0401 , H01L2224/05548 , H01L2224/0557 , H01L2224/13025 , H01L2224/16145 , H01L2224/16225 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/73265 , H01L2225/06513 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2225/06572 , H01L2924/00014 , H01L2924/0002 , H01L2924/01033 , H01L2924/014 , H01L2924/078 , H01L2924/09701 , H01L2924/14 , H01L2924/1515 , H01L2924/15153 , H01L2924/15159 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/05552 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package may include a substrate having first and second surfaces, the second surface including a recessed portion, a first semiconductor chip mounted on the first surface, a first ball land outside the recessed portion, a connection pad inside the recessed portion, a second chip in the recessed portion, the second semiconductor chip including a through via electrically connected to the connection pad, and a second ball land electrically connected to the through via. A semiconductor package may include a substrate having first and second surfaces, the second surface including a recessed portion, a first semiconductor chip mounted on the first surface, a first ball land outside the recessed portion, a connection pad inside the recessed portion, a second semiconductor chip in the recessed portion, the second chip including a through via electrically connected to the connection pad, and a second ball land electrically connected to the through via.
摘要翻译： 半导体封装可以包括具有第一表面和第二表面的基板，第二表面包括凹部，安装在第一表面上的第一半导体芯片，凹部外侧的第一球台面，凹部内的连接垫，第二表面 所述第二半导体芯片包括电连接到所述连接焊盘的通孔，以及电连接到所述通孔的第二焊盘。 半导体封装可以包括具有第一表面和第二表面的基板，第二表面包括凹部，安装在第一表面上的第一半导体芯片，凹部外侧的第一球台面，凹部内的连接垫，第二表面 半导体芯片，所述第二芯片包括电连接到所述连接焊盘的通孔，以及电连接到所述通孔的第二焊盘。
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公开(公告)号：US20110018121A1
公开(公告)日：2011-01-27
申请号：US12805131
申请日：2010-07-14
申请人： Jinho Lee , Choongbin Yim , Jin-woo Park , Dae-young Choi , Mi-yeon Kim
发明人： Jinho Lee , Choongbin Yim , Jin-woo Park , Dae-young Choi , Mi-yeon Kim
CPC分类号： H01L21/76898 , H01L23/13 , H01L23/481 , H01L23/49822 , H01L23/49838 , H01L24/05 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/73 , H01L25/0657 , H01L25/18 , H01L2224/02372 , H01L2224/0401 , H01L2224/05548 , H01L2224/0557 , H01L2224/13025 , H01L2224/16145 , H01L2224/16225 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/73265 , H01L2225/06513 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2225/06572 , H01L2924/00014 , H01L2924/0002 , H01L2924/01033 , H01L2924/014 , H01L2924/078 , H01L2924/09701 , H01L2924/14 , H01L2924/1515 , H01L2924/15153 , H01L2924/15159 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/05552 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package may include a substrate having first and second surfaces, the second surface including a recessed portion, a first semiconductor chip mounted on the first surface, a first ball land outside the recessed portion, a connection pad inside the recessed portion, a second chip in the recessed portion, the second semiconductor chip including a through via electrically connected to the connection pad, and a second ball land electrically connected to the through via. A semiconductor package may include a substrate having first and second surfaces, the second surface including a recessed portion, a first semiconductor chip mounted on the first surface, a first ball land outside the recessed portion, a connection pad inside the recessed portion, a second semiconductor chip in the recessed portion, the second chip including a through via electrically connected to the connection pad, and a second ball land electrically connected to the through via.
摘要翻译： 半导体封装可以包括具有第一表面和第二表面的基板，第二表面包括凹部，安装在第一表面上的第一半导体芯片，凹部外侧的第一球台面，凹部内的连接垫，第二表面 所述第二半导体芯片包括电连接到所述连接焊盘的通孔，以及电连接到所述通孔的第二焊盘。 半导体封装可以包括具有第一表面和第二表面的基板，第二表面包括凹部，安装在第一表面上的第一半导体芯片，凹部外侧的第一球台面，凹部内的连接垫，第二表面 半导体芯片，所述第二芯片包括电连接到所述连接焊盘的通孔，以及电连接到所述通孔的第二焊盘。
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公开(公告)号：US20120306075A1
公开(公告)日：2012-12-06
申请号：US13440817
申请日：2012-04-05
申请人： TAE-HUN KIM , Dae-young Choi , Yang-hoon Ahn , Sun-hye Lee
发明人： TAE-HUN KIM , Dae-young Choi , Yang-hoon Ahn , Sun-hye Lee
IPC分类号： H01L23/498
CPC分类号： H01L23/49811 , H01L23/49816 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/13111 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13169 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45157 , H01L2224/45164 , H01L2224/45166 , H01L2224/45169 , H01L2224/45171 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2225/1082 , H01L2924/01047 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/18161 , H01L2924/00012 , H01L2924/0105 , H01L2924/01029 , H01L2924/01013 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor package apparatus includes a first semiconductor package including a first semiconductor chip, a first substrate, a first terminal, and a first signal transfer medium, and a second semiconductor package including a second semiconductor chip, a second substrate, a second terminal, and a second signal transfer medium. At least one package connecting solder ball is located between the first terminal and the second terminal. A first solder ball guide member is positioned around the first terminal of the first substrate and includes a first guide surface for guiding a shape of the package connecting solder ball.
摘要翻译： 半导体封装装置包括：第一半导体封装，包括第一半导体芯片，第一基板，第一端子和第一信号传输介质;以及第二半导体封装，包括第二半导体芯片，第二基板，第二端子和 第二信号传送介质。 至少一个连接焊球的封装位于第一端子和第二端子之间。 第一焊球引导构件围绕第一基板的第一端子定位，并且包括用于引导封装连接焊球的形状的第一引导表面。
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公开(公告)号：US08653640B2
公开(公告)日：2014-02-18
申请号：US13440817
申请日：2012-04-05
申请人： Tae-hun Kim , Dae-young Choi , Yang-hoon Ahn , Sun-hye Lee
发明人： Tae-hun Kim , Dae-young Choi , Yang-hoon Ahn , Sun-hye Lee
IPC分类号： H01L23/488
CPC分类号： H01L23/49811 , H01L23/49816 , H01L24/13 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/73 , H01L25/105 , H01L2224/13111 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13169 , H01L2224/16225 , H01L2224/32225 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45157 , H01L2224/45164 , H01L2224/45166 , H01L2224/45169 , H01L2224/45171 , H01L2224/48227 , H01L2224/73253 , H01L2224/73265 , H01L2225/1023 , H01L2225/1058 , H01L2225/1082 , H01L2924/01047 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/18161 , H01L2924/00012 , H01L2924/0105 , H01L2924/01029 , H01L2924/01013 , H01L2924/00 , H01L2924/00014
摘要： A semiconductor package apparatus includes a first semiconductor package including a first semiconductor chip, a first substrate, a first terminal, and a first signal transfer medium, and a second semiconductor package including a second semiconductor chip, a second substrate, a second terminal, and a second signal transfer medium. At least one package connecting solder ball is located between the first terminal and the second terminal. A first solder ball guide member is positioned around the first terminal of the first substrate and includes a first guide surface for guiding a shape of the package connecting solder ball.
摘要翻译： 半导体封装装置包括：第一半导体封装，包括第一半导体芯片，第一基板，第一端子和第一信号传输介质;以及第二半导体封装，包括第二半导体芯片，第二基板，第二端子和 第二信号传送介质。 至少一个连接焊球的封装位于第一端子和第二端子之间。 第一焊球引导构件围绕第一基板的第一端子定位，并且包括用于引导封装连接焊球的形状的第一引导表面。
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