公开(公告)号：US06651869B2

公开(公告)日：2003-11-25

申请号：US09957532

申请日：2001-09-21

申请人： Raiyomand F. Aspandiar ,  Tom E. Pearson ,  Christopher Combs

发明人： Raiyomand F. Aspandiar ,  Tom E. Pearson ,  Christopher Combs

IPC分类号： B23K3100

CPC分类号： H05K3/3494 ,  B23K1/085 ,  B23K1/20 ,  B23K3/085 ,  B23K2101/42 ,  H05K3/3436 ,  H05K3/3468 ,  H05K2201/0129 ,  H05K2201/0959 ,  H05K2201/10734 ,  H05K2203/0455 ,  H05K2203/0776 ,  H05K2203/122 ,  Y02P70/613

摘要： A method of wave soldering a circuit board while avoiding reflow of a solder joint on the topside of the board from heat conducted from the solder wave through at least one via in the board in heat conducting relation with the topside solder joint, comprises subjecting the circuit board to a solder wave and absorbing heat being conducted from the solder wave through the at least one via with an endothermic material in the via hole which undergoes a heat absorbing reaction. The heat absorbing reaction of the endothermic material is preferably a phase change, such as melting. The melted endothermic material is retained in the via hole during wave soldering by capillary forces and a cap on the lower end of the via hole. A disclosed method of making the circuit board includes locating the endothermic material in the via hole by inserting a preform of the endothermic material into the via hole or hot dispensing the endothermic material into the via hole. An electronic board product for practicing the method/made by the method is also disclosed.

摘要翻译： 一种波形焊接电路板的方法，同时避免了从焊锡波通过板中的至少一个通孔从顶部焊料导热关系的焊盘顶部的焊点的回流焊， 焊接到焊波，并且吸收从焊料波通过至少一个通孔的热量，其中吸热材料在经过吸热反应的通孔中。 吸热材料的吸热反应优选为相变，例如熔融。 熔融的吸热材料通过毛细管的波峰焊和通孔的下端的盖保持在通孔中。 公开的制造电路板的方法包括将吸热材料的预成型件插入通孔中或将吸热材料热分配到通孔中来将吸热材料定位在通孔中。 还公开了用于实施该方法制造的电子板产品。

公开(公告)号：US06501658B2

公开(公告)日：2002-12-31

申请号：US09788128

申请日：2001-02-16

申请人： Tom E. Pearson ,  Arjang Fartash ,  Christopher Combs ,  Raiyomand F. Aspandiar

发明人： Tom E. Pearson ,  Arjang Fartash ,  Christopher Combs ,  Raiyomand F. Aspandiar

IPC分类号： H05K720

CPC分类号： H01L23/4093 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2224/0401

摘要： Shock absorbers or other dampening mechanisms are added to an assembly including a heatsink, a semiconductor device, and a board, to reduce shock and/or vibration induced relative motion between the heatsink and the board.

公开(公告)号：US20050014419A1

公开(公告)日：2005-01-20

申请号：US10918081

申请日：2004-08-12

申请人： Tom Pearson ,  George Arrigotti ,  Christopher Combs ,  Raiyomand Aspandiar

发明人： Tom Pearson ,  George Arrigotti ,  Christopher Combs ,  Raiyomand Aspandiar

IPC分类号： H05K1/14 ,  H05K3/34 ,  H01R9/22

CPC分类号： H05K3/3405 ,  H05K1/142 ,  H05K2201/09127 ,  H05K2201/10204 ,  H05K2201/10446 ,  H05K2201/209 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/5313 ,  Y10T29/53252

摘要： A mechanism and method are provided for assembling a printed circuit board having a first surface, a second surface and an edge. The printed circuit board may include at least one female member to receive a corresponding male member. The mechanism may include an extension board having an edge to couple to the edge of the printed circuit board. The extension board may include a male member to extend from the edge of the extension board and to couple to the at least one male member so as to couple the extension board to the printed circuit board.

摘要翻译： 提供了用于组装具有第一表面，第二表面和边缘的印刷电路板的机构和方法。 印刷电路板可以包括至少一个阴构件以接收相应的阳构件。 该机构可以包括具有连接到印刷电路板的边缘的边缘的延伸板。 延伸板可以包括从延伸板的边缘延伸并连接到至少一个阳构件的阳构件，以便将延伸板耦合到印刷电路板。

公开(公告)号：US06700800B2

公开(公告)日：2004-03-02

申请号：US10173342

申请日：2002-06-14

申请人： Christopher Combs ,  Arjang Fartash ,  Tom E. Pearson ,  Raiyomand F. Aspandiar

发明人： Christopher Combs ,  Arjang Fartash ,  Tom E. Pearson ,  Raiyomand F. Aspandiar

IPC分类号： H02B101

CPC分类号： H05K3/303 ,  H05K3/3415 ,  H05K3/3436 ,  H05K2201/09072 ,  H05K2201/10598 ,  Y02P70/613

摘要： A retainer for a circuit board and method for using the same are provided. In one embodiment, a circuit board assembly includes a circuit board, an electronic component, a plurality of electric contacts between the circuit board and the electronic component, and a retainer. The retainer has a first component secured to the circuit board and a second component secured to the electronic component. The retainer allows for movement of the electronic component in a first direction towards the circuit board while simultaneously preventing movement of the circuit board and the electronic component in a second direction away from one another when the electric contacts melt.

摘要翻译： 提供一种用于电路板的保持器及其使用方法。 在一个实施例中，电路板组件包括电路板，电子部件，电路板和电子部件之间的多个电触头以及保持器。 保持器具有固定到电路板的第一部件和固定到电子部件的第二部件。 保持器允许电子部件沿着第一方向朝着电路板运动，同时防止当电触头熔化时电路板和电子部件在彼此远离彼此的第二方向上移动。