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    Retainer for circuit board assembly and method for using the same
    2.
    发明授权
    Retainer for circuit board assembly and method for using the same 有权
    电路板组装用保持器及其使用方法

    公开(公告)号：US06700800B2

    公开(公告)日：2004-03-02

    申请号：US10173342

    申请日：2002-06-14

    申请人： Christopher Combs ,  Arjang Fartash ,  Tom E. Pearson ,  Raiyomand F. Aspandiar

    发明人： Christopher Combs ,  Arjang Fartash ,  Tom E. Pearson ,  Raiyomand F. Aspandiar

    IPC分类号： H02B101

    CPC分类号： H05K3/303 ,  H05K3/3415 ,  H05K3/3436 ,  H05K2201/09072 ,  H05K2201/10598 ,  Y02P70/613

    摘要： A retainer for a circuit board and method for using the same are provided. In one embodiment, a circuit board assembly includes a circuit board, an electronic component, a plurality of electric contacts between the circuit board and the electronic component, and a retainer. The retainer has a first component secured to the circuit board and a second component secured to the electronic component. The retainer allows for movement of the electronic component in a first direction towards the circuit board while simultaneously preventing movement of the circuit board and the electronic component in a second direction away from one another when the electric contacts melt.

    摘要翻译： 提供一种用于电路板的保持器及其使用方法。 在一个实施例中，电路板组件包括电路板，电子部件，电路板和电子部件之间的多个电触头以及保持器。 保持器具有固定到电路板的第一部件和固定到电子部件的第二部件。 保持器允许电子部件沿着第一方向朝着电路板运动，同时防止当电触头熔化时电路板和电子部件在彼此远离彼此的第二方向上移动。

    Methods and electronic board products utilizing endothermic material for filling vias to absorb heat during wave soldering
    3.
    发明授权
    Methods and electronic board products utilizing endothermic material for filling vias to absorb heat during wave soldering 失效
    方法和电子板产品利用吸热材料填充通孔，以在波峰焊时吸收热量

    公开(公告)号：US06651869B2

    公开(公告)日：2003-11-25

    申请号：US09957532

    申请日：2001-09-21

    申请人： Raiyomand F. Aspandiar ,  Tom E. Pearson ,  Christopher Combs

    发明人： Raiyomand F. Aspandiar ,  Tom E. Pearson ,  Christopher Combs

    IPC分类号： B23K3100

    CPC分类号： H05K3/3494 ,  B23K1/085 ,  B23K1/20 ,  B23K3/085 ,  B23K2101/42 ,  H05K3/3436 ,  H05K3/3468 ,  H05K2201/0129 ,  H05K2201/0959 ,  H05K2201/10734 ,  H05K2203/0455 ,  H05K2203/0776 ,  H05K2203/122 ,  Y02P70/613

    摘要： A method of wave soldering a circuit board while avoiding reflow of a solder joint on the topside of the board from heat conducted from the solder wave through at least one via in the board in heat conducting relation with the topside solder joint, comprises subjecting the circuit board to a solder wave and absorbing heat being conducted from the solder wave through the at least one via with an endothermic material in the via hole which undergoes a heat absorbing reaction. The heat absorbing reaction of the endothermic material is preferably a phase change, such as melting. The melted endothermic material is retained in the via hole during wave soldering by capillary forces and a cap on the lower end of the via hole. A disclosed method of making the circuit board includes locating the endothermic material in the via hole by inserting a preform of the endothermic material into the via hole or hot dispensing the endothermic material into the via hole. An electronic board product for practicing the method/made by the method is also disclosed.

    摘要翻译： 一种波形焊接电路板的方法，同时避免了从焊锡波通过板中的至少一个通孔从顶部焊料导热关系的焊盘顶部的焊点的回流焊， 焊接到焊波，并且吸收从焊料波通过至少一个通孔的热量，其中吸热材料在经过吸热反应的通孔中。 吸热材料的吸热反应优选为相变，例如熔融。 熔融的吸热材料通过毛细管的波峰焊和通孔的下端的盖保持在通孔中。 公开的制造电路板的方法包括将吸热材料的预成型件插入通孔中或将吸热材料热分配到通孔中来将吸热材料定位在通孔中。 还公开了用于实施该方法制造的电子板产品。