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公开(公告)号：US11926917B2
公开(公告)日：2024-03-12
申请号：US17790545
申请日：2020-06-10
发明人： Yukiya Kato , Hirotaka Kotani , Tatsuhiro Doi , Takao Tomiya , Hiroto Narieda
摘要： There is provided a composite plating material and a related technique thereof, the composite plating material including: a base material, and a composite plating layer on the base material, the composite plating layer comprising a composite material containing carbon particles and Sb in an Ag layer, with a carbon content of 6.0 mass % or more and a Sb content of 0.5 mass % or more.
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公开(公告)号：US20230313402A1
公开(公告)日：2023-10-05
申请号：US18024403
申请日：2021-03-24
发明人： Yutaro Hirai , Kentaro Arai , Yosuke Sato
摘要： There are provided a silver-plated product having a more excellent wear resistance than that of conventional silver-plated products, and a method for producing the same. The method comprises the steps of: preparing a silver-plating solution which is an aqueous solution containing silver potassium cyanide or silver cyanide, potassium cyanide or sodium cyanide, and a benzothiazole or a derivative thereof; and forming a surface layer of silver on a base material by electroplating at a liquid temperature and at a current density in the silver-plating solution so as to satisfy (BC/A)2/D≥10 (° C.2·dm2/A) assuming that a concentration of free cyanide in the silver-plating solution is A (g/L), that a concentration of a benzothiazole content of the benzothiazole or derivative thereof in the silver-plating solution is B (g/L), that the liquid temperature of the silver-plating solution is C (° C.) and that the current density during the electroplating is D (A/dm2).
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公开(公告)号：US20230298961A1
公开(公告)日：2023-09-21
申请号：US18009880
申请日：2021-06-29
发明人： Seiya YUKI , Takashi IDENO , Eitarou SATOU , Yukihiro KITAMURA
IPC分类号： H01L23/373 , H01L21/48
CPC分类号： H01L23/3735 , H01L21/4882
摘要： An insulating substrate in which one principal surface of a heat-dissipation-side metal plate is bonded to one principal surface of a ceramic substrate via a brazing material layer provided therebetween, and a solder resist portion is formed on at least one selected from a periphery of the other principal surface of the heat-dissipation-side metal plate, a side surface of the heat-dissipation-side metal plate, and a surface of the brazing material layer. A solder resist prevents solder from wrapping around the brazing material layer, and thereby, what is called “the brazing material layer leaching into solder” no longer occurs and the occurrence of cracks inside the brazing material layer is avoided. This prevents stress concentration from occurring in the ceramic substrate at an inner portion relative to an end portion of the heat-dissipation-side metal plate.
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公开(公告)号：US20230068210A1
公开(公告)日：2023-03-02
申请号：US17914853
申请日：2021-03-18
发明人： Ayumu OZAKI
摘要： Provided are a brazing material in paste form containing a powder mixture that contains titanium powder having an average particle diameter (D50) of 20 μm or less in an amount of 0.7 to 2.0 mass %, copper powder in an amount of 3 to 15 mass %, and silver powder as the remaining portion, and a vehicle, and techniques associated with the brazing material.
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公开(公告)号：US20220033317A1
公开(公告)日：2022-02-03
申请号：US17383541
申请日：2021-07-23
发明人： Koji Kobayashi , Takuma Tsubota , Hideyo Osanai , Daisuke Oya
摘要： There is provided an aluminum/ceramic bonding substrate having a ceramic substrate, an aluminum plate of an aluminum alloy which is bonded directly to one side of the ceramic substrate, an aluminum base plate of the aluminum alloy which is bonded directly to the other side of the ceramic substrate, and a plate-shaped reinforcing member which has a higher strength than that of the aluminum base plate and which is arranged in the aluminum base plate to be bonded directly to the aluminum base plate, wherein the aluminum alloy contains 0.01 to 0.2% by weight of magnesium, 0.01 to 0.1% by weight of silicon, and the balance being aluminum and unavoidable impurities.
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公开(公告)号：US11208730B2
公开(公告)日：2021-12-28
申请号：US16810963
申请日：2020-03-06
发明人： Yuta Sonoda , Yukiya Kato , Hiroto Narieda
摘要： There are provided a composite plated product, which has little uneven appearance and good wear resistance, and a method for producing the same without the need of any cyanide-containing silver-plating solutions and any silver-plating solutions containing silver nitrate as a silver salt. A sulfonic-acid-containing silver-plating solution, to which a carbon particle dispersing solution (preferably containing a silicate) is added, is used for electroplating a base material (preferably made of copper or a copper alloy) to form a composite plating film of a composite material, which contains the carbon particles in a silver layer, on the base material to produce a composite plated product.
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公开(公告)号：US11047023B2
公开(公告)日：2021-06-29
申请号：US16087829
申请日：2016-10-14
发明人： Toshiya Shutoh , Hisashi Suda , Fumiaki Sasaki
摘要： A copper alloy sheet material that is excellent in surface smoothness of an etched surface has a composition containing, (mass %), from 1.0 to 4.5% of Ni, from 0.1 to 1.2% of Si, from 0 to 0.3% of Mg, from 0 to 0.2% of Cr, from 0 to 2.0% of Co, from 0 to 0.1% of P, from 0 to 0.05% of B, from 0 to 0.2% of Mn, from 0 to 0.5% of Sn, from 0 to 0.5% of Ti, from 0 to 0.2% of Zr, from 0 to 0.2% of Al, from 0 to 0.3% of Fe, from 0 to 1.0% of Zn, the balance Cu and unavoidable impurities. A number density of coarse secondary phase particles has a major diameter of 1.0 μm or more of 4.0×103 per square millimeter or less. KAM value measured with a step size of 0.5 μm is more than 3.00.
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公开(公告)号：US20190264313A1
公开(公告)日：2019-08-29
申请号：US16345298
申请日：2017-10-24
摘要： There are provided an inexpensive sheet material of a copper alloy having an excellent bending workability and an excellent stress corrosion cracking resistance while maintaining a high strength, and a method for producing the same. The sheet material of the copper alloy is produced by a method comprising the steps of: melting and casting raw materials of a copper alloy which has a chemical composition comprising 17 to 32% by weight of zinc, 0.1 to 4.5% by weight of tin, 0.01 to 2.0% by weight of silicon, 0.01 to 5.0% by weight of nickel, and the balance being copper and unavoidable impurities; hot-rolling the cast copper alloy in a temperature range of from 900° C. to 400° C.; cooling the hot-rolled copper alloy at a cooling rate of 1 to 15° C./min. from 400° C. to 300° C.; cold-rolling the cooled copper alloy; recrystallization-annealing the cold-rolled copper alloy at a temperature of 300 to 800° C.; and then, ageing-annealing the recrystallization-annealed copper alloy at a temperature of 300 to 600° C.
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公开(公告)号：US20170370015A1
公开(公告)日：2017-12-28
申请号：US15542946
申请日：2016-01-15
CPC分类号： C25D3/46 , B32B15/018 , C25D3/12 , C25D5/00 , C25D5/12 , C25D7/00 , H01H1/025 , H01H2011/046 , H01R4/58 , H01R13/03 , Y10T428/12896
摘要： A silver-plated product is produced by forming a surface layer of silver on a base material by electroplating at a liquid temperature of 10 to 35° C. and a current density of 3 to 15 A/dm2 in a silver plating solution so as to satisfy (32.6x−300)≦y≦(32.6x+200) assuming that a product of a concentration of potassium cyanide in the silver plating solution and a current density is y (g·A/L·dm2) and that a liquid temperature of the silver plating solution is x (° C.), the silver plating solution containing 80 to 110 g/L of silver, 70 to 160 g/L of potassium cyanide and 55 to 70 mg/L of selenium.
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公开(公告)号：US09646739B2
公开(公告)日：2017-05-09
申请号：US14348118
申请日：2012-09-20
IPC分类号： H01B13/00 , H01B5/14 , H01B1/02 , C22C5/06 , C23C30/00 , C25D3/46 , C25D7/00 , C23C28/02 , H01R13/03 , H01H1/023 , H01H11/04 , H01R43/16 , C25D5/34
CPC分类号： H01B5/14 , C22C5/06 , C23C28/02 , C23C28/021 , C23C28/023 , C23C30/00 , C23C30/005 , C25D3/46 , C25D5/34 , C25D7/00 , H01B1/02 , H01B13/00 , H01H1/023 , H01H11/041 , H01R13/03 , H01R43/16 , Y10T428/12882
摘要： There is provided a silver-plated product which has a good bendability and which can restrain the rise of the contact resistance thereof even if it is used in a high-temperature environment, and a method for producing the same. In a silver-plated product wherein a surface layer of silver is formed on the surface of a base material of copper or a copper alloy, or on the surface of an underlying layer of copper or a copper alloy formed on the base material, the percentage of an X-ray diffraction intensity on {200} plane of the surface layer with respect to the sum of X-ray diffraction intensities on {111}, {200}, {220} and {311} planes of the surface layer is 40% or more.
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