利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

15 条记录 (耗时 0.019 秒)

    Enclosed gutter clip
    1.
    发明授权
    Enclosed gutter clip 有权

    公开(公告)号：US10281084B2

    公开(公告)日：2019-05-07

    申请号：US15067119

    申请日：2016-03-10

    申请人： David Russel Felt

    发明人： David Russel Felt

    IPC分类号： F21V21/088 ,  F16B1/00 ,  E04D13/064 ,  F16M13/02 ,  F21W131/10 ,  F21S4/10 ,  F21W121/00

    摘要： A decorative removable lighting enclosed clip made for mounting a light to a support surface such as gutters, shingles or a building structure. The purpose of this enclosed clip is to allow an esthetically pleasing display of lights with rapid and easy installation and removal of the lighting. This eliminates falling debris from broken clips or clips that fall off the lights during the removal process. A support tab is inserted between the side portions of the structure, at longitudinally spaced intervals along the strip, and are frictionally gripped and retained by the facing side portions of the gutter, shingle or structure. The clips have enclosed end portions which support the light elements of a decorative light string along structure. The enclosed clip is capable of mounting onto a wide variety of gutters, eaves and building structures. The spacing is adjustable and provides a plurality of discrete angular positions.

    Field-effect transistor comprising a layer of an organic semiconductor
    3.
    发明申请
    Field-effect transistor comprising a layer of an organic semiconductor 有权
    场效应晶体管，包括有机半导体层

    公开(公告)号：US20060049398A1

    公开(公告)日：2006-03-09

    申请号：US11217410

    申请日：2005-09-02

    申请人： David Russel ,  Christopher Newsome ,  Thomas Kugler ,  Shunpu Li

    发明人： David Russel ,  Christopher Newsome ,  Thomas Kugler ,  Shunpu Li

    IPC分类号： H01L29/08

    CPC分类号： H01L51/0545 ,  H01L51/0019 ,  H01L51/0034 ,  H01L51/0035 ,  H01L51/0036 ,  H01L51/0541 ,  H01L51/105

    摘要： Provided is a field-effect transistor (10) which comprises a metal or carbon source electrode (14) and a layer of a functional organic semiconductor (28). A column of an injection material (48) extends through the layer of the functional organic semiconductor (28), the column being in contact with both the source electrode (14) and the layer of the functional organic semiconductor (28). This column (48) facilitates the transfer charge carriers between the source electrode (14) and semiconductor layer (28). The injection material is preferably an organic compound such as 3-hexylthiophene, polyarylamine, poly(3,4-ethylenedioxythiophene)-polystyrenesulphonic acid or polyaniline.

    摘要翻译： 提供一种场效应晶体管（10），其包括金属或碳源电极（14）和功能性有机半导体（28）层。 注入材料（48）的柱延伸穿过功能性有机半导体（28）的层，该柱与源电极（14）和功能性有机半导体（28）的层接触。 该列（48）便于在源电极（14）和半导体层（28）之间传输电荷载流子。 注射剂优选为3-己基噻吩，聚芳基胺，聚（3,4-亚乙基二氧噻吩） - 聚苯乙烯磺酸或聚苯胺等有机化合物。

    Method of fabricating a desired pattern of electronically functional material
    4.
    发明申请
    Method of fabricating a desired pattern of electronically functional material 有权
    制造电子功能材料所需图案的方法

    公开(公告)号：US20050250244A1

    公开(公告)日：2005-11-10

    申请号：US11102711

    申请日：2005-04-11

    申请人： Shunpu Li ,  Christopher Newsome ,  Thomas Kugler ,  David Russel

    发明人： Shunpu Li ,  Christopher Newsome ,  Thomas Kugler ,  David Russel

    IPC分类号： B41M5/00 ,  B05D1/26 ,  B05D3/12 ,  G03F7/20 ,  H01L21/28 ,  H01L21/288 ,  H01L21/3205 ,  H01L21/336 ,  H01L21/84 ,  H01L29/786 ,  H01L51/00 ,  H01L51/05 ,  H01L51/30 ,  H01L51/40

    CPC分类号： H01L51/0023 ,  H01L51/0022 ,  H01L51/0037 ,  H01L51/0541

    摘要： Provided is a method forming a desired pattern of electronically functional material 3 on a substrate 1. The method comprises the steps of: creating a first layer of patterning material 2 on the substrate whilst leaving areas of the substrate exposed to define said desired pattern; printing a suspension comprising particles of the electronically functional material 3 in a liquid dispersant, to which the patterning material is impervious, on the patterning material and the exposed substrate; removing at least some of the liquid dispersant from the suspension to consolidate the particles; and applying a first solvent to said consolidated particles which is capable of solubilizing the patterning material 2 and to which the consolidated particles are pervious so that the patterning material is removed from the substrate 1 together with any overlying electronically functional material 3.

    摘要翻译： 提供了在基板1上形成电子功能材料3的期望图案的方法。 该方法包括以下步骤：在衬底上创建图案材料材料2的第一层，同时使衬底的区域暴露以限定所述期望图案; 将包含电子功能材料3的颗粒的悬浮液印刷在图案形成材料和暴露的基底上的图案形成材料不可渗透的液体分散剂中; 从悬浮液中除去至少一些液体分散剂以固结颗粒; 以及将第一溶剂施加到能够溶解图案形成材料2并且固结的颗粒可渗透的所述固结颗粒，使得图案材料与任何上覆的电子功能材料3一起从基板1移除。

    Method for fabricating a semiconductor element from a dispersion of semiconductor particles
    6.
    发明授权
    Method for fabricating a semiconductor element from a dispersion of semiconductor particles 有权
    从半导体粒子的分散体制造半导体元件的方法

    公开(公告)号：US07517719B2

    公开(公告)日：2009-04-14

    申请号：US11125138

    申请日：2005-05-10

    申请人： Thomas Kugler ,  Christopher Newsome ,  David Russel ,  Shunpu Li

    发明人： Thomas Kugler ,  Christopher Newsome ,  David Russel ,  Shunpu Li

    IPC分类号： H01L51/40

    CPC分类号： H01L21/02568 ,  H01L21/0256 ,  H01L21/02576 ,  H01L21/02579 ,  H01L21/02601 ,  H01L21/02628 ,  H01L51/0003 ,  H01L51/0037 ,  H01L51/0053 ,  H01L51/007 ,  H01L51/0545

    摘要： Provided is a method for forming a semiconductor element such as film. The method comprises the steps of: (i) depositing a suspension of particles of a first semiconductor and a solution of a second semiconductor or a precursor thereof on a surface of a substrate such that a mixture comprising the particles of the first semiconductor suspended in a liquid phase comprising the second semiconductor or precursor thereof results thereon; and (ii) solidifying the mixture to form the semiconductor element comprising particles of the first semiconductor in a matrix of the second semiconductor which electrically connects adjacent particles of the first semiconductor, the first and second semiconductors being of the same conductivity type and being formed from either the same or different materials. The method does not require any step of vacuum deposition or sintering.Also provided is a semiconductor element itself. The element comprises semiconductor particles in a matrix of a semiconductor binder that has the same conductivity type as the semiconductor particles and which is the same or a different material than that forming the particles, the semiconductor binder electrically connecting adjacent semiconductor particles.

    摘要翻译： 提供了一种形成诸如膜的半导体元件的方法。 该方法包括以下步骤：（i）将第一半导体和第二半导体或其前体的溶液的悬浮液沉积在基板的表面上，使得包含悬浮在基板中的第一半导体颗粒的混合物 在其上产生包含第二半导体或其前体的液相; 和（ii）固化所述混合物以形成所述半导体元件，所述半导体元件包括所述第二半导体的矩阵中的所述第一半导体的粒子，所述第二半导体的矩阵电连接所述第一半导体的相邻颗粒，所述第一和第二半导体具有相同的导电类型，并且由 相同或不同的材料。 该方法不需要真空沉积或烧结的任何步骤。 还提供了半导体元件本身。 该元件包括半导体粘合剂的基质中的半导体颗粒，其具有与半导体颗粒相同的导电类型，并且与形成颗粒的材料相同或不同，所述半导体粘结剂将相邻的半导体颗粒电连接。

    Enclosed Gutter Clip
    7.
    发明申请
    Enclosed Gutter Clip 审中-公开

    公开(公告)号：US20180245733A1

    公开(公告)日：2018-08-30

    申请号：US15067119

    申请日：2016-03-10

    申请人： David Russel Felt

    发明人： David Russel Felt

    IPC分类号： F16M13/02 ,  E04D13/064 ,  F21V21/088 ,  F21V33/00

    CPC分类号： F16M13/022 ,  E04D13/064 ,  F16B1/00 ,  F21S4/10 ,  F21V21/088 ,  F21W2121/004 ,  F21W2131/10

    摘要： A decorative removable lighting enclosed clip made for mounting a light to a support surface such as gutters, shingles or a building structure. The purpose of this enclosed clip is to allow an esthetically pleasing display of lights with rapid and easy installation and removal of the lighting. This eliminates falling debris from broken clips or clips that fall off the lights during the removal process. A support tab is inserted between the side portions of the structure, at longitudinally spaced intervals along the strip, and are frictionally gripped and retained by the facing side portions of the gutter, shingle or structure. The clips have enclosed end portions which support the light elements of a decorative light string along structure. The enclosed clip is capable of mounting onto a wide variety of gutters, eaves and building structures. The spacing is adjustable and provides a plurality of discrete angular positions.