公开(公告)号：US06604988B2

公开(公告)日：2003-08-12

申请号：US10252149

申请日：2002-09-20

申请人： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

发明人： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

IPC分类号： B24B2100

CPC分类号： B24B21/04 ,  B24B21/08 ,  B24B21/22 ,  B24B37/013 ,  B24B37/04 ,  B24B37/205 ,  B24B47/04 ,  B24B49/16

摘要： The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.

公开(公告)号：US06468139B1

公开(公告)日：2002-10-22

申请号：US09684059

申请日：2000-10-06

申请人： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

发明人： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

IPC分类号： B24B2100

CPC分类号： B24B37/205 ,  B24B21/04 ,  B24B37/04 ,  B24B47/04

摘要： The present invention is directed to methods and apparatus for polishing a surface of a semiconductor wafer using a pad or belt moveable in both forward and reverse directions. In both VLSI and ULSI applications, polishing the wafer surface to complete flatness is highly desirable. The forward and reverse movement of the polishing pad or belt provides superior planarity and uniformity to the surface of the wafer. The wafer surface is pressed against the polishing pad or belt as the pad or belt moves in both forward and reverse directions while polishing the wafer surface. During polishing, the wafer is supported by a wafer housing having novel wafer loading and unloading methods.

摘要翻译： 本发明涉及使用可沿前后方向移动的垫或带来抛光半导体晶片的表面的方法和装置。 在VLSI和ULSI应用中，非常需要抛光晶片表面以完成平坦度。 抛光垫或带的向前和向后移动为晶片的表面提供了优异的平面性和均匀性。 当抛光晶片表面时，衬垫或带沿正向和反向移动，晶片表面被压靠在抛光垫或带上。 在抛光期间，晶片由具有新颖的晶片装载和卸载方法的晶片壳体支撑。

公开(公告)号：US06464571B2

公开(公告)日：2002-10-15

申请号：US09880730

申请日：2001-06-12

申请人： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

发明人： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

IPC分类号： B24B2100

CPC分类号： B24B21/04 ,  B24B21/08 ,  B24B21/22 ,  B24B37/013 ,  B24B37/04 ,  B24B37/205 ,  B24B47/04 ,  B24B49/16

摘要： The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.

公开(公告)号：US06932679B2

公开(公告)日：2005-08-23

申请号：US10295197

申请日：2002-11-15

申请人： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

发明人： Homayoun Talieh ,  Konstantin Volodarsky ,  Jalal Ashjaee ,  Douglas W. Young

IPC分类号： B24B21/04 ,  B24B21/08 ,  B24B21/22 ,  B24B37/04 ,  B24B47/04 ,  B24B49/16 ,  B24B1/00

CPC分类号： B24B21/04 ,  B24B21/08 ,  B24B21/22 ,  B24B37/013 ,  B24B37/04 ,  B24B37/205 ,  B24B47/04 ,  B24B49/16

摘要： The present invention includes a polishing pad or belt secured to a mechanism that allows the pad or belt to move in a reciprocating manner, i.e. in both forward and reverse directions, at high speeds. The constant bidirectional movement of the polishing pad or belt as it polishes the wafer provides superior planarity and uniformity across the wafer surface. When a fresh portion of the pad is required, the pad is moved through a drive system containing rollers, such that the rollers only touch a back side of the pad, thereby minimizing sources of friction other than the wafer that is being polished from the polishing side of the pad, and maximizing the lifetime of the polishing pad.

摘要翻译： 本发明包括固定到机构的抛光垫或皮带，该机构允许垫或带以往往的方式即即向前和向后两个方向高速移动。 抛光垫或带在其抛光晶片时恒定的双向运动在晶片表面上提供了优异的平面性和均匀性。 当需要衬垫的新鲜部分时，衬垫移动通过包含辊的驱动系统，使得辊仅接触衬垫的背面，从而最小化除了从抛光抛光的晶片之外的摩擦源 并且使抛光垫的寿命最大化。

公开(公告)号：US06855037B2

公开(公告)日：2005-02-15

申请号：US09910686

申请日：2001-07-20

申请人： Jalal Ashjaee ,  Homayoun Talieh ,  Bulent Basol ,  Konstantin Volodarsky

发明人： Jalal Ashjaee ,  Homayoun Talieh ,  Bulent Basol ,  Konstantin Volodarsky

IPC分类号： B24B37/30 ,  C25D7/12 ,  C25D17/06 ,  H01L21/00 ,  H01L21/683 ,  B24B1/00

CPC分类号： B24B37/30 ,  C25D17/001 ,  C25D17/06 ,  H01L21/6704 ,  H01L21/6715 ,  H01L21/6838

摘要： The present invention provides a wafer carrier that includes an opening, which in one embodiment is a plurality of holes, disposed along the periphery of the wafer carrier. A gas emitted through the holes onto a peripheral back edge of the wafer assists in preventing the processing liquids and contaminants resulting therefrom from reaching the inner region of the base and the backside inner region of the wafer. In another embodiment, a plurality of concentric sealing members are used to prove a better seal, and the outer seal is preferably independently movable to allow cleaning of a peripheral backside of the wafer to occur while the wafer is still attached to the wafer carrier.

摘要翻译： 本发明提供了一种晶片载体，其包括沿着晶片载体的周边设置的开口，其在一个实施例中是多个孔。 通过孔发射到晶片的外围后缘上的气体有助于防止由此产生的处理液体和污染物到达晶片的底部和内侧区域的内部区域。 在另一个实施例中，使用多个同心密封构件来证明更好的密封，并且外部密封件优选地是独立地可移动的，以允许当晶片仍然附接到晶片载体时清洁晶片的周边背面而发生。

公开(公告)号：US06939206B2

公开(公告)日：2005-09-06

申请号：US10159295

申请日：2002-05-31

申请人： Jalal Ashjaee ,  Homayoun Talieh ,  Bulent M. Basol ,  Konstantin Volodarsky

发明人： Jalal Ashjaee ,  Homayoun Talieh ,  Bulent M. Basol ,  Konstantin Volodarsky

IPC分类号： B24B37/30 ,  C25D7/12 ,  C25D17/00 ,  C25D17/06 ,  H01L21/00 ,  H01L21/304 ,  H01L21/306 ,  H01L21/683 ,  B24B1/00

CPC分类号： H01L21/67126 ,  B24B37/30 ,  C25D7/123 ,  C25D17/001 ,  C25D17/004 ,  C25D17/06 ,  H01L21/6704 ,  H01L21/6715 ,  H01L21/6838

摘要： The present invention provides a wafer carrier that includes a plurality of concentric sealing members that provide a seal, with the outer seal independently movable to allow cleaning of a peripheral backside of the wafer to occur while the wafer is still attached to the wafer carrier, and a plurality of vacuum openings that a re disposed only adjacent to an inner side of the inner seal at a location corresponding to the backside periphery of the wafer.

摘要翻译： 本发明提供了一种晶片载体，其包括提供密封的多个同心密封构件，其中外部密封独立地可移动以允许在晶片仍然附接到晶片载体的同时清洁晶片的外围背面，以及 多个真空开口，其在与所述晶片的所述背面周边相对应的位置处重新设置成与所述内部密封件的内侧相邻。

公开(公告)号：US06988932B2

公开(公告)日：2006-01-24

申请号：US10788926

申请日：2004-02-25

申请人： Jalal Ashjaee ,  Homayoun Talieh ,  Bulent Basol ,  Konstantin Volodarsky

发明人： Jalal Ashjaee ,  Homayoun Talieh ,  Bulent Basol ,  Konstantin Volodarsky

IPC分类号： B24B1/00

CPC分类号： B24B37/30 ,  C25D17/001 ,  C25D17/06 ,  H01L21/6704 ,  H01L21/6715 ,  H01L21/6838

摘要： The present invention provides a wafer carrier that includes an opening, which in one embodiment is a plurality of holes, disposed along the periphery of the wafer carrier. A gas emitted through the holes onto a peripheral back edge of the wafer assists in preventing the processing liquids and contaminants resulting therefrom from reaching the inner region of the base and the backside inner region of the wafer. In another embodiment, a plurality of concentric sealing members are used to prove a better seal, and the outer seal is preferably independently movable to allow cleaning of a peripheral backside of the wafer to occur while the wafer is still attached to the wafer carrier.

摘要翻译： 本发明提供了一种晶片载体，其包括沿着晶片载体的周边设置的开口，其在一个实施例中是多个孔。 通过孔发射到晶片的外围后缘上的气体有助于防止由此产生的处理液体和污染物到达晶片的底部和内侧区域的内部区域。 在另一个实施例中，使用多个同心密封构件来证明更好的密封，并且外部密封件优选地是独立地可移动的，以允许当晶片仍然附接到晶片载体时清洁晶片的周边背面而发生。

公开(公告)号：US07059944B2

公开(公告)日：2006-06-13

申请号：US10369118

申请日：2003-02-18

申请人： Jalal Ashjaee ,  Boris Govzman ,  Bernard M. Frey ,  Boguslaw A. Nagorski ,  Douglas W. Young ,  Bulent M. Basol ,  Homayoun Talieh

发明人： Jalal Ashjaee ,  Boris Govzman ,  Bernard M. Frey ,  Boguslaw A. Nagorski ,  Douglas W. Young ,  Bulent M. Basol ,  Homayoun Talieh

IPC分类号： B24B1/00

CPC分类号： H01L21/67745 ,  B24B37/345 ,  G05B19/41865 ,  G05B2219/32272 ,  G05B2219/45031 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67173 ,  H01L21/67219 ,  H01L21/68707 ,  H01L21/68728 ,  Y02P90/20

摘要： An integrated process tool for chemical mechanical processing, cleaning and drying a semiconductor workpiece is provided. The integrated process tool includes a CMP module and a cleaning and drying module. After being processed, the workpiece is transported from the CMP module to the cleaning and drying module using a movable housing. In the cleaning and drying module, a cleaning mechanism is used to clean the workpiece while the workpiece is rotated and held by a support stucture of the movable housing. A drying mechanism of the cleaning and drying module picks up the workpiece from the moveable housing and spin dries it. Throughout the CMP process, cleaning and drying, the processed surface of the wafer faces down.

公开(公告)号：US20110239450A1

公开(公告)日：2011-10-06

申请号：US12906988

申请日：2010-10-18

申请人： Bulent M. Basol ,  Jalal Ashjaee ,  Douglas Young ,  Homayoun Talieh

发明人： Bulent M. Basol ,  Jalal Ashjaee ,  Douglas Young ,  Homayoun Talieh

IPC分类号： H01L31/18

CPC分类号： H01L31/0504 ,  B32B37/1018 ,  B32B37/22 ,  B32B2457/12 ,  H01L31/02 ,  H01L31/048 ,  H01L31/05 ,  Y02E10/50 ,  Y10T29/5313 ,  Y10T29/5317 ,  Y10T29/53261 ,  Y10T29/534 ,  Y10T29/53526

摘要： Described in one embodiment is a system that has a multiple number of different stations for forming solar cell modules. Described in another embodiment is a system that includes a cutting station, a setting station, and an interconnection station to create different series-connected flexible solar cell modules. Described in still another embodiment is a monolithically integrated multi-module power supply.

摘要翻译： 在一个实施例中描述的是具有用于形成太阳能电池模块的多个不同站的系统。 在另一实施例中描述的是包括切割站，设置站和互连站以创建不同串联的柔性太阳能电池模块的系统。 在又一实施例中描述的是单片集成多模块电源。

公开(公告)号：US06482307B2

公开(公告)日：2002-11-19

申请号：US09735546

申请日：2000-12-14

申请人： Jalal Ashjaee ,  Boguslaw A. Nagorski ,  Bulent M. Basol ,  Homayoun Talieh ,  Cyprian Uzoh

发明人： Jalal Ashjaee ,  Boguslaw A. Nagorski ,  Bulent M. Basol ,  Homayoun Talieh ,  Cyprian Uzoh

IPC分类号： C25D518

CPC分类号： C25D17/001 ,  C25D7/123 ,  C25D17/005 ,  C25F7/00 ,  H01L21/2885

摘要： Deposition of conductive material on or removal of conductive material from a wafer frontal side of a semiconductor wafer is performed by providing an anode having an anode area which is to face the wafer frontal side, and electrically connecting the wafer frontal side with at least one electrical contact, outside of the anode area, by pushing the electrical contact and the wafer frontal side into proximity with each other. A potential is applied between the anode and the electrical contact, and the wafer is moved with respect to the anode and the electrical contact. Full-face electroplating or electropolishing over the wafer frontal side surface, in its entirety, is thus permitted.

摘要翻译： 通过提供具有面向晶片正面的阳极区域的阳极和将晶片正面与至少一个电气电连接来进行导电材料沉积在半导体晶片的晶片正面上或从晶片正面去除导电材料 通过将电接触和晶片正面推动到彼此靠近来接触阳极区域外部。 在阳极和电接触之间施加电势，并且晶片相对于阳极和电触点移动。 因此允许在整个晶片正面侧面上进行全面电镀或电解抛光。