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    POWER SOURCES SUITABLE FOR USE IN IMPLANTABLE MEDICAL DEVICES AND CORRESPONDING FABRICATION METHODS
    2.
    发明申请
    POWER SOURCES SUITABLE FOR USE IN IMPLANTABLE MEDICAL DEVICES AND CORRESPONDING FABRICATION METHODS 有权
    适用于可植入医疗器械和相关制造方法的电源

    公开(公告)号：US20130337313A1

    公开(公告)日：2013-12-19

    申请号：US13524304

    申请日：2012-06-15

    申请人： Mohsen Askarinya ,  Andreas A. Fenner ,  Erik J. Herrmann ,  David A. Ruben ,  John K. Day

    发明人： Mohsen Askarinya ,  Andreas A. Fenner ,  Erik J. Herrmann ,  David A. Ruben ,  John K. Day

    IPC分类号： H01M2/22 ,  H01M10/04

    CPC分类号： H01M2/204 ,  A61N1/3758 ,  A61N1/378 ,  H01M2/1066 ,  H01M2/202 ,  H01M2/22 ,  H01M2/24 ,  H01M2/266 ,  H01M6/40 ,  H01M6/46 ,  H01M10/0436 ,  H01M10/0525 ,  H01M10/0562 ,  H01M10/0585 ,  H01M10/647 ,  Y02E60/122 ,  Y10T29/49112

    摘要： Arrays of planar solid state batteries are stacked in an aligned arrangement for subsequent separation into individual battery stacks. Prior to stacking, a redistribution layer (RDL) is formed over a surface of each wafer that contains an array; each RDL includes first and second groups of conductive traces, each of the first extending laterally from a corresponding positive battery contact, and each of the second extending laterally from a corresponding negative battery contact. Conductive vias, formed before or after stacking, ultimately couple together corresponding contacts of aligned batteries. If before, each via extends through a corresponding battery contact of each wafer and is coupled to a corresponding conductive layer that is included in another RDL formed over an opposite surface of each wafer. If after, each via extends through corresponding aligned conductive traces and, upon separation of individual battery stacks, becomes an exposed conductive channel of a corresponding battery stack.

    摘要翻译： 平面固态电池的阵列以对准的布置堆叠，以便随后分离成单独的电池堆叠。 在堆叠之前，在包含阵列的每个晶片的表面上形成重分布层（RDL）; 每个RDL包括第一和第二组导电迹线，每个导体迹线首先从对应的正电池触点横向延伸，并且每个第二组从相应的负电池触点横向延伸。 在堆叠之前或之后形成的导电通孔最终将对准的电池的相应触点耦合在一起。 如果之前，每个通孔延伸穿过每个晶片的对应的电池触点并且耦合到相应的导电层，该导电层被包括在形成于每个晶片的相对表面上的另一个RDL中。 如果之后，每个通孔延伸通过对应的对准的导电迹线，并且在单独的电池堆分离时，成为相应电池堆的暴露的导电通道。

    Implantable medical device including a surface-mount terminal array
    5.
    发明授权
    Implantable medical device including a surface-mount terminal array 有权
    可植入医疗器械，包括表面安装端子阵列

    公开(公告)号：US06963780B2

    公开(公告)日：2005-11-08

    申请号：US10061718

    申请日：2002-01-31

    申请人： David A. Ruben ,  Andrew J. Ries ,  Juan G. Milla ,  Randy S. Roles ,  Terry W. Bruneau ,  Steve Craig Warren ,  David W. Parkin ,  John V. Anderson, II ,  John K. Day ,  Robert V. Hemann, Jr.

    发明人： David A. Ruben ,  Andrew J. Ries ,  Juan G. Milla ,  Randy S. Roles ,  Terry W. Bruneau ,  Steve Craig Warren ,  David W. Parkin ,  John V. Anderson, II ,  John K. Day ,  Robert V. Hemann, Jr.

    IPC分类号： A61N1/375

    CPC分类号： A61N1/3754

    摘要： An implantable medical device comprises an enclosure, a first plurality of electrical contacts disposed within the enclosure, at least a first electrical component secured within the enclosure, a second plurality of electrical contacts on the first electrical component, and a terminal array for providing electrical coupling between the first and second plurality of electrical contacts. The terminal array comprises a housing having a plurality of apertures therethrough, the housing having a first side and a second opposite side. Each of a plurality of conductive terminals is positioned within one of the plurality of apertures and has a first contact region proximate the first side of the housing and a second contact region proximate the second side of the housing. The first contact region is electrically coupled to one of the first plurality of electrical contacts, and the second contact region is electrically coupled to one of the second plurality of contacts.

    摘要翻译： 可植入医疗装置包括外壳，设置在外壳内的第一多个电触点，固定在外壳内的至少第一电气部件，第一电气部件上的第二多个电触点，以及用于提供电耦合的端子阵列 在第一和第二多个电触头之间。 端子阵列包括具有穿过其中的多个孔的壳体，壳体具有第一侧和第二相对侧。 多个导电端子中的每一个定位在多个孔中的一个孔内，并且具有靠近壳体的第一侧的第一接触区域和靠近壳体的第二侧的第二接触区域。 第一接触区域电耦合到第一多个电触头中的一个，并且第二接触区域电耦合到第二多个触点中的一个。

    Freeform substrates and devices
    9.
    发明授权
    Freeform substrates and devices 有权
    自由形成基材和设备

    公开(公告)号：US07335530B2

    公开(公告)日：2008-02-26

    申请号：US10902539

    申请日：2004-07-29

    申请人： David A. Ruben

    发明人： David A. Ruben

    IPC分类号： H01L21/00

    CPC分类号： H01L21/304 ,  A61N1/375 ,  A61N1/3758 ,  H05K1/0284

    摘要： An implantable medical device substrate is free form cut to the shape of the interior of the device. The free form shape allows more efficient use of not only the interior space of the device but also of the substrate itself. Integrated circuit components are formed to fit the shape of the substrate, freeing areas in the device for additional components, or allowing the device to be made smaller through a maximized use of the available space-volume.

    摘要翻译： 植入式医疗装置基板是自由形式切割成装置内部的形状。 自由形状允许不仅使器件的内部空间更有效地使用，而且还可以更有效地利用衬底本身。 集成电路部件形成为适合基板的形状，释放设备中的附加部件的区域，或者允许通过最大限度地利用可用的空间体积来使装置更小。

    Freeform substrates and devices
    10.
    发明授权
    Freeform substrates and devices 有权
    自由形成基材和设备

    公开(公告)号：US06787891B2

    公开(公告)日：2004-09-07

    申请号：US09731121

    申请日：2000-12-06

    申请人： David A. Ruben

    发明人： David A. Ruben

    IPC分类号： H01L2306

    CPC分类号： H01L21/304 ,  A61N1/375 ,  A61N1/3758 ,  H05K1/0284

    摘要： An implantable medical device substrate is free form cut to the shape of the interior of the device. The free form shape allows more efficient use of not only the interior space of the device but also of the substrate itself. Integrated circuit components are formed to fit the shape of the substrate, freeing areas in the device for additional components, or allowing the device to be made smaller through a maximized use of the available space-volume.

    摘要翻译： 植入式医疗装置基板是自由形式切割成装置内部的形状。 自由形状允许不仅使器件的内部空间更有效地使用，而且还可以更有效地利用衬底本身。 集成电路部件形成为适合基板的形状，释放设备中的附加部件的区域，或者允许通过最大限度地利用可用的空间体积来使装置更小。