Abstract:
Provided is a thin film transistor that may be manufactured using Metal Induced Crystallization (MIC) and method for fabricating the same. Also provided is an active matrix flat panel display using the thin film transistor, which may be created by forming a crystallization inducing metal layer below a buffer layer and diffusing the crystallization inducing metal layer. The thin film transistor may include a crystallization inducing metal layer formed on an insulating substrate, a buffer layer formed on the crystallization inducing metal layer, and an active layer formed on the buffer layer and including source/drain regions, and including polycrystalline silicon crystallized by the MIC process.
Abstract:
Provided is an optimized system voltage control method through coordinated control of reactive power source, which analyzes the location for reactive power compensation and the effect of applying compensation equipment by calculating the reactive power and voltage sensitivity of a power system, thus improving the voltage quality of the power system.The optimized system voltage control method includes verifying a voltage violation substation having a voltage exceeding a predetermined voltage reference value among buses of a test system on a computer program, configuring a local system with eight to ten substations with respect to the verified voltage violation substation, generating a reduced local system using a reduced local algorithm with respect to the buses within the configured local system, calculating a power flow by determining a voltage control amount for restoring the voltage of the voltage violation substation to a normal value with respect to the reduced local system, and calculating an optimization objective function value based on the voltage control amount and control operation.
Abstract:
A thin film transistor according to the present invention may include a gate insulating layer; and a lower pattern placed below the gate insulating layer to contact therewith and having an edge with a taper angle of at most about 80°. With this design, dielectric strength of the gate insulating layer can be enhanced. The lower pattern can be a gate electrode layer.
Abstract:
A thin film transistor with a GOLDD structure may include an active layer formed on an insulating substrate including source/drain regions and a channel region. A gate insulating film may be formed on the active layer and a gate electrode may be formed on the gate insulating film. The gate electrode may include a first gate pattern and a second gate pattern formed at sides of the first gate pattern. The source/drain regions may each have an LDD region, and the LDD regions may overlaps-the gate electrode.
Abstract:
An object of the present invention is to crystallize and activate the doped amorphous semiconductor layer at the same time. It is also an object to provide the TFT with good electrical connection between the source or drain electrodes and the semiconductor layer. The inventive method of fabricating TFT for a liquid crystal display device, includes forming a buffer layer on a substrate; forming an amorphous semiconductor layer on the whole buffer layer, the semiconductor layer having a channel region and source and drain ohmic contact regions, each positioned at opposing ends of the channel region; doping n+ (or p+) ions on the source and drain ohmic contact regions of the semiconductor layer while covering the channel region with a photoresist; patterning the semiconductor layer to have an island shape, the island shape including the channel region and the source and drain ohmic contact regions; irradiating laser beams on the semiconductor layer having the island shape, thereby crystallizing and activating the semiconductor layer; forming a first insulating layer on the semiconductor layer; forming a gate electrode on the first insulating layer; forming a second insulating layer on the first insulating layer while covering the gate electrode; forming source and drain contact holes penetrating both the first and second insulating layers to the source and drain ohmic contact regions of the semiconductor layer, respectively; and forming the source and drain electrodes on the second insulating layer, while the source and drain electrodes having electrical connection to the source and drain ohmic contact regions of the semiconductor layer.
Abstract:
A method for forming a polycrystalline silicon layer for TFT according to the present invention includes steps of: depositing an amorphous silicon layer and a silicon oxidation layer on a substrate in this order; and implanting semiconductor ions into the amorphous silicon layer and the silicon oxidation layer while heating the substrate, thereby converting the amorphous silicon layer into a polycrystalline silicon layer, and forming an amorphous oxidation layer between the amorphous silicon layer and the silicon oxidation layer.
Abstract:
Fabrication of a polysilicon TFT having a lightly doped drain or offset structure. Fabrication includes forming a semiconductor layer, a gate insulating film, and a gate electrode on a substrate. Then, forming lightly doped impurity regions in the semiconductor layer on both sides of the gate electrode. Next, forming an insulating film having a thickness that gradually becomes thinner away from the gate electrode. Then, forming heavily doped impurity regions in the lightly doped impurity regions in the semiconductor layer on both sides of the gate, resulting in regions with continuously varied impurity concentrations.
Abstract:
A fiber resin composite member manufacturing method includes the steps of: selectively distinguishing waste rubber and synthetic resins containing waste tires and waste PET bottles, waste fibers, waste timbers, waste paper, waste plant straws, waste shells from shellfish or clams and so on from industrial waste materials in accordance with their physical chemical features; disintegrating the waste rubber and synthetic resins containing the waste tires and the waste PET bottles in a super low temperature cooling method, disintegrating the waste fibers in an appropriate size by using a scutcher, and distintegrating the other waste materials by means of a general crusher; pouring the disintegrated waste materials into a molding machine in a predetermined composition ratio and melting-molding them in a desired type at a high temperature of about 150 to 300.degree. C. and a high pressure of about 150 to 3,000 ton; and cooling the molded fiber resin composite member at a temperature of about 40 to 70.degree. C. and pressure under about 500 to 800 ton to manufacture a complete product.
Abstract:
A method is provided for fabricating a thin film transistor on a substrate. The method includes the steps of forming an active layer having a channel region on the substrate, forming an impurity-blocking mask covering the channel region and portions of the active layer outside the channel region adjacent the channel region, and doping impurities of a first conductivity type at a high density into portions of the active layer uncovered by the impurity-blocking mask to form impurity-doped regions in the active layer. The method further includes the steps of removing the impurity-blocking mask and thereafter performing a plasma treatment on the resultant structure using a plasma gas containing impurities of the first conductivity type to form LDD regions in the active layer between the channel region and the impurity-doped regions.
Abstract:
A thin-film transistor liquid crystal display includes a substrate, an active layer on the substrate, having first and second impurity regions and first, second, and third non-impurity regions, gate insulating layer on the active layer, first and second electric field control layers on the second and third non-impurity regions, respectively, first and second subsidiary gate electrodes on the first and second electric field control layers, respectively, and a main gate electrode on the gate insulating layer, the main gate electrode contacting the first and second subsidiary gate electrodes and the first and second electric field control layers, respectively.