Plasma etching device
    1.
    发明授权

    公开(公告)号:US06585851B1

    公开(公告)日:2003-07-01

    申请号:US09380520

    申请日:1999-11-26

    IPC分类号: C23F108

    摘要: A plasma etching device which has an auxiliary electrode enabling realization of a uniform plasma density of generated plasma on the surface of a base and which enables uniform etching with respect to the base without depending upon pressure and without rotating a magnetic field applying means. The plasma etching device has magnetic field applying means which has two parallel plate electrodes I and II and RF power applying means, with the base set on the electrode I, and which is horizontal and unidirectional with respect to the surface of the base where plasma etching is carried out. In this plasma etching device, an auxiliary electrode is provided at least on the upstream side of the base in a flow of electron current generated by the magnetic field applying means. The auxiliary electrode includes a local electrode arranged on the side facing the electrode II and means for adjusting impedance provided at a part of the local electrode to be electrically connected with the electrode I.

    Plasma device
    2.
    发明授权
    Plasma device 有权
    等离子体装置

    公开(公告)号:US06357385B1

    公开(公告)日:2002-03-19

    申请号:US09355229

    申请日:1999-10-05

    IPC分类号: C23C1600

    摘要: A plasma device which is provided with a container, a gas supply system, and an exhaust system. The container is composed of a first dielectric plate made of a material capable of transmitting microwaves. An antenna for radiating microwaves is located on the outside of the container, and an electrode for holding an object to be treated is located inside the container. The microwave radiating surface of the antenna and the surface of the object to be treated with plasma are positioned in parallel and opposite to each other. A wall section of the container other than that constituting the first dielectric plate is composed of a member of a material having electrical conductivity higher than that of aluminum, or the internal surface of the wall section is covered with the member. The thickness (d) of the member is larger that (2/&mgr;0&sgr;)½, where &sgr;, &mgr;0 and &ohgr; respectively represent the electrical conductivity of the member, the permeability of vacuum and the angular frequency of the microwaves radiated from the antenna.

    摘要翻译: 设置有容器,气体供给系统和排气系统的等离子体装置。 容器由能够传输微波的材料制成的第一电介质板组成。 用于辐射微波的天线位于容器的外部,并且用于保持待处理物体的电极位于容器内部。 天线的微波辐射表面和待处理物体的表面等离子体彼此平行并相对定位。 容器的除构成第一电介质板之外的壁部分由导电率高于铝的材料的构件构成,或者壁部的内表面被构件覆盖。 构件的厚度(d)大于(2 / mu0sigma)1/2,其中σ,μ0和ω分别表示构件的导电性,真空的磁导率和从天线辐射的微波的角频率。

    Parallel plate sputtering device with RF powered auxiliary electrodes
and applied external magnetic field
    3.
    发明授权
    Parallel plate sputtering device with RF powered auxiliary electrodes and applied external magnetic field 失效
    具有RF供电辅助电极并应用外部磁场的平行板溅射装置

    公开(公告)号:US6153068A

    公开(公告)日:2000-11-28

    申请号:US35325

    申请日:1998-03-05

    摘要: The present invention provides a sputtering device provided with two electrodes I and II of parallel plate type within a vessel inside which pressure can be reduced, wherein: a target to be sputtered is placed on said electrode I, and a base body on which a film is to be deposited is placed on said electrode II, with the target and the base body being opposed to each other; a process gas is introduced into said vessel from a gas supply system; radio frequency power is applied to said target through at least said electrode I so as to excite plasma between the electrode I and the electrode II; characterized in that: outside said vessel, is provided a means for introducing magnetic field horizontal at least to a surface to be sputtered of said target.

    摘要翻译: 本发明提供了一种溅射装置,其在容器内设置有平行板型的两个电极I和II,其中压力可以减小,其中:将被溅射的靶放置在所述电极I上, 被放置在所述电极II上,其中靶和基体彼此相对; 从气体供应系统将工艺气体引入所述容器中; 通过至少所述电极I向所述靶施加射频功率,以激发电极I和电极II之间的等离子体; 其特征在于,在所述容器外部设置有至少水平地将磁场引入要溅射所述靶的表面的装置。

    Plasma method with high input power
    4.
    发明授权
    Plasma method with high input power 失效
    具有高输入功率的等离子体方法

    公开(公告)号:US07312415B2

    公开(公告)日:2007-12-25

    申请号:US10706423

    申请日:2003-11-10

    IPC分类号: B23K10/00

    摘要: A plasma device which is provided with a container, a gas supply system, and an exhaust system. The container is composed of a first dielectric plate made of a material capable of transmitting microwaves. An antenna for radiating microwaves is located on the outside of the container, and an electrode for holding an object to be treated is located inside the container. The microwave radiating surface of the antenna and the surface of the object to be treated with plasma are positioned in parallel and opposite to each other. A wall section of the container other than that constituting the first dielectric plate is composed of a member of a material having electrical conductivity higher than that of aluminum, or the internal surface of the wall section is covered with the member. The thickness (d) of the member is larger that (2/μ0σ)1/2, where σ, μ0 and ω respectively represent the electrical conductivity of the member, the permeability of vacuum and the angular frequency of the microwaves radiated from the antenna.

    摘要翻译: 设置有容器,气体供给系统和排气系统的等离子体装置。 容器由能够传输微波的材料制成的第一电介质板组成。 用于辐射微波的天线位于容器的外部,并且用于保持待处理物体的电极位于容器内部。 天线的微波辐射表面和待处理物体的表面等离子体彼此平行并相对定位。 容器的除构成第一电介质板之外的壁部分由导电率高于铝的材料的构件构成,或者壁部的内表面被构件覆盖。 该部件的厚度(d)大于(2 /μS≤Sigma)1/2,其中σ,μ0和ω 分别表示构件的导电性,真空的磁导率和从天线辐射的微波的角频率。

    Plasma device
    5.
    发明申请
    Plasma device 失效
    等离子体装置

    公开(公告)号:US20050250338A1

    公开(公告)日:2005-11-10

    申请号:US10706423

    申请日:2003-11-10

    摘要: A plasma device which is provided with a container, a gas supply system, and an exhaust system. The container is composed of a first dielectric plate made of a material capable of transmitting microwaves. An antenna for radiating microwaves is located on the outside of the container, and an electrode for holding an object to be treated is located inside the container. The microwave radiating surface of the antenna and the surface of the object to be treated with plasma are positioned in parallel and opposite to each other. A wall section of the container other than that constituting the first dielectric plate is composed of a member of a material having electrical conductivity higher than that of aluminum, or the internal surface of the wall section is covered with the member. The thickness (d) of the member is larger that (2/μ0σ)1/2, where σ, μ0 and ω respectively represent the electrical conductivity of the member, the permeability of vacuum and the angular frequency of the microwaves radiated from the antenna.

    摘要翻译: 设置有容器,气体供给系统和排气系统的等离子体装置。 容器由能够传输微波的材料制成的第一电介质板组成。 用于辐射微波的天线位于容器的外部,并且用于保持待处理物体的电极位于容器内部。 天线的微波辐射表面和待处理物体的表面等离子体彼此平行并相对定位。 容器的除构成第一电介质板之外的壁部分由导电率高于铝的材料的构件构成,或者壁部的内表面被构件覆盖。 该部件的厚度(d)大于(2 /μS≤Sigma)1/2,其中σ,μ0和ω 分别表示构件的导电性,真空的磁导率和从天线辐射的微波的角频率。

    Plasma etching device
    6.
    发明授权
    Plasma etching device 失效
    等离子体蚀刻装置

    公开(公告)号:US08114245B2

    公开(公告)日:2012-02-14

    申请号:US10304869

    申请日:2002-11-26

    摘要: A plasma etching device which has an auxiliary electrode enabling realization of a uniform plasma density of generated plasma on the surface of a base and which enables uniform etching with respect to the base without depending upon pressure and without rotating a magnetic field applying means. The plasma etching device has magnetic field applying means which has two parallel plate electrodes I and II and RF power applying means, with the base set on the electrode I, and which is horizontal and unidirectional with respect to the surface of the base where plasma etching is carried out. In this plasma etching device, an auxiliary electrode is provided at least on the upstream side of the base in a flow of electron current generated by the magnetic field applying means. The auxiliary electrode includes a local electrode arranged on the side facing the electrode II and means for adjusting impedance provided at a part of the local electrode to be electrically connected with the electrode I.

    摘要翻译: 一种等离子体蚀刻装置,其具有能够实现基底表面上产生的等离子体的均匀等离子体密度的辅助电极,并且能够相对于基座进行均匀蚀刻而不依赖于压力而不旋转磁场施加装置。 等离子体蚀刻装置具有磁场施加装置,其具有两个平行板电极I和II以及RF功率施加装置,其基极设置在电极I上,并且相对于基板的表面是水平和单向的,其中等离子体蚀刻 完成了。 在该等离子体蚀刻装置中,在由磁场施加装置产生的电流的流动中,至少在基座的上游侧设置有辅助电极。 辅助电极包括布置在面向电极II的一侧的局部电极和用于调节局部电极的一部分以与电极I电连接的阻抗的装置。