摘要:
Semiconductor devices required forming a stress control film to handle different stresses on each side when optimizing the stress on the respective P channel and N channel sections. A unique feature of the semiconductor device of this invention is that P and N channel stress are respectively optimized by making use of a stress control film jointly for the P and N channels that conveys stress in different directions by utilizing the film thickness.
摘要:
A semiconductor device having a semiconductor substrate, an impurity diffused layer formed in a principal surface of the semiconductor substrate, a conductive member formed on the semiconductor substrate adjacent to the impurity diffused layer and having a sloped surface inclined to the principal surface of the semiconductor substrate, an insulator film deposited to cover the impurity diffused layer and the conductive member, and a common contact hole formed through the insulator film to extend over a surface of the impurity diffused layer and the sloped surface of the conductive member.
摘要:
A semiconductor integrated circuit device includes a substrate having a PROM formed thereon in which the data memory state of the PROM is changed by the irradiation of light, and a multilayer wiring structure formed on the same side of the substrate as the PROM is formed. The multilayer wiring structure includes a transparent area, a shield area, and a PAD portion. The transparent area is formed from transparent material at a position opposite to the PROM area where the PROM is formed, and used as a light guiding path from the outside of the multilayer wiring structure to the PROM. The shield area is formed continuously from shielding materials arranged in several layers in the periphery of the transparent area. The PAD portion is formed on the outside of the shield area in regard to the transparent area, and controls the memory state of the PROM.
摘要:
An information processing unit controls a plurality of electronic devices. The information processing unit includes a storage unit for storing input graphical-user-interface data on the electronic devices, a display unit for displaying graphical user interfaces corresponding to the graphical-user-interface data stored in the storage unit, a detecting unit for detecting user operations corresponding to the graphical user interfaces displayed on the display unit, and a transmitting unit for transmitting control signals controlling the electronic devices in accordance with the results of detection by the detecting unit.
摘要:
The invention provides a method of fabricating a semiconductor device, including the steps of (a) forming an impurity region at a surface of a silicon substrate, (b) depositing an insulative film over the silicon substrate, (c) forming a contact hole through the insulative film to expose the impurity region of the silicon substrate, (d) forming an electrode wiring over the contact hole, the electrode wiring comprising a refractory metal silicide film and a silicon film overlying on the metal silicide film, the metal silicide film overlying the exposed impurity region, (e) depositing a second insulative film over a resultant, (f) depositing a polysilicon film on the second insulative film, (g) patterning the polysilicon film to form an element, and (h) heat-treating a resultant at high temperature in oxidizing atmosphere. The step (h) is to be carried out at any time after the step (f) has been completed. In the method, even if a semiconductor device is heat-treated at high temperature in oxidizing atmosphere, there occurs no voids in the silicon substrate below the refractory metal silicide film. This is because silicon atoms are supplied from the silicon film overlying on the refractory metal silicide film to the metal silicide film. Thus, reliable electrical connection between the electrode wiring and the silicon substrate is ensured.
摘要:
In an SRAM cell including two cross-coupled inverters each having a first resistance element and a drive MOS transistor, a second resistance element is connected between the first and the drive MOS transistor. A gate electrode of the drive MOS transistor of one of the inverters is connected between the first and second resistance elements of the other.
摘要:
A system collects fluid waste within a closed waste vessel where a waste disposal cycle is determined based upon the pressure level within the waste vessel. In the preferred embodiment, a closed liquid waste vessel accepts waste solutions through conduits having valves controlling conduit fluid communication with treatment vessels. A pressure sensor determines the level of pressure within the waste vessel. A pressurizing device reduces the level of pressure within the vessel. When the pressure within the vessel is lowered to a predetermined level, the valve is opened. When the pressure sensed within the liquid waste vessel then rises above an appointed value, the valve is closed, completing the waste collection of a treated sample. This corresponds to the point in time when the treatment vessel is empty, allowing a sudden rush of air into the waste vessel, raising the vessel pressure to ambient and closing the valve. When the pressure in the waste vessel does not rise to the appointed value after the lapse of a preset length of time, a warning signal is provided advising that the system is not working properly.
摘要:
An imaging device includes an imaging unit configured to execute processing to capture image data, a global positioning system (GPS) device configured to execute position calculation processing based on data received from a satellite, and a main controller configured to measure an imaging frequency of the imaging unit, to determine or update a control parameter as a condition for a transition of an operation state of the GPS device based on the measured imaging frequency, and to cause a transition of the operation state of the GPS device based on the determined or updated control parameter.
摘要:
Provided is a semiconductor chip (1) including: at least one fuse element (21); a fuse opening (17) formed above the fuse element (21); and a discharge electrode (31) that is formed below a bottom portion (17a) of the fuse opening (17), and is formed in one of the same layer with the fuse element (21) and the above layer of the fuse element (21). Accordingly, the current caused to flow due to the electrostatic discharge generated at the time of assembling the semiconductor chip can be discharged through the discharge electrode (31). As a result, the current caused to flow due to the electrostatic discharge generated at the time of assembling the semiconductor chip can be prevented from being discharged through the fuse element, whereby a problem in that a functional failure occurs in the semiconductor chip can be solved.
摘要:
A semiconductor integrated circuit device includes a substrate having a PROM formed thereon in which the data memory state of the PROM is changed by the irradiation of light, and a multilayer wiring structure formed on the same side of the substrate as the PROM is formed. The multilayer wiring structure includes a transparent area, a shield area, and a PAD portion. The transparent area is formed from transparent material at a position opposite to the PROM area where the PROM is formed, and used as a light guiding path from the outside of the multilayer wiring structure to the PROM. The shield area is formed continuously from shielding materials arranged in several layers in the periphery of the transparent area. The PAD portion is formed on the outside of the shield area in regard to the transparent area, and controls the memory state of the PROM.