公开(公告)号：US08805063B2

公开(公告)日：2014-08-12

申请号：US13337364

申请日：2011-12-27

申请人： Hyung-jun Park ,  Seong-wook Han

发明人： Hyung-jun Park ,  Seong-wook Han

IPC分类号： G06K9/00

CPC分类号： G06K9/3216 ,  H04N5/23229 ,  H04N5/2351 ,  H04N9/68

摘要： A method and apparatus for detecting and compensating for a backlight frame are provided. The method includes receiving data regarding a current frame comprising pixels that are expressed by a luminance component and one or more chrominance components; and determining whether the current frame is a backlight frame based on values of the one or more chrominance components of the pixels.

摘要翻译： 提供了一种用于检测和补偿背光框架的方法和装置。 该方法包括接收关于包括由亮度分量和一个或多个色度分量表示的像素的当前帧的数据; 并且基于像素的一个或多个色度分量的值来确定当前帧是否是背光帧。

公开(公告)号：US08794778B2

公开(公告)日：2014-08-05

申请号：US13608391

申请日：2012-09-10

申请人： Dong-Hyun Yoo ,  Bo-Yeong Kim ,  Jae-Won Kim ,  Kyung-Ho Park ,  Hyung-Jun Park

发明人： Dong-Hyun Yoo ,  Bo-Yeong Kim ,  Jae-Won Kim ,  Kyung-Ho Park ,  Hyung-Jun Park

IPC分类号： G09F13/04

CPC分类号： G06F1/16 ,  G02F1/13452 ,  G02F2001/13332 ,  H05K1/118 ,  H05K3/361 ,  H05K2201/056 ,  H05K2201/10128 ,  H05K2201/10136

摘要： A top chassis assembly includes a top chassis and a contact unit. The top chassis surrounds a non-display area of a display panel. The non-display area includes a pad part through which a signal is provided to the display panel. The contact unit is disposed at an inner surface of the top chassis and contacts the pad part on the non-display area of the display panel.

摘要翻译： 顶部底盘组件包括顶部底盘和接触单元。 顶部底盘围绕显示面板的非显示区域。 非显示区域包括将信号提供给显示面板的焊盘部分。 接触单元设置在顶部机架的内表面处，并与显示面板的非显示区域上的焊盘部分接触。

公开(公告)号：US20130135572A1

公开(公告)日：2013-05-30

申请号：US13592525

申请日：2012-08-23

申请人： Kyung-Ho PARK ,  Bo-Yeong KIM ,  Jae-Won KIM ,  Byoung-Sun NA ,  Hyung-Jun PARK ,  Dong-Hyun YOO ,  Kye-Uk LEE

发明人： Kyung-Ho PARK ,  Bo-Yeong KIM ,  Jae-Won KIM ,  Byoung-Sun NA ,  Hyung-Jun PARK ,  Dong-Hyun YOO ,  Kye-Uk LEE

IPC分类号： G02F1/1343

CPC分类号： G02F1/13624 ,  G02F1/134336 ,  G02F1/136209 ,  G02F1/136286 ,  G02F1/1368 ,  G02F2001/134345 ,  G02F2201/123 ,  H01L27/1244 ,  H01L27/1255

摘要： A liquid crystal display device includes upper and lower pixels; gate lines in electrical connection with the adjacent pixels and extending in a row direction, and data lines which cross the gate lines; and a reference voltage line including a vertical portion which passes through the adjacent pixels, and horizontal portions which alternately extend from the vertical portion. Each of the adjacent pixels includes first and second thin film transistors (TFTs) each in electrical connection with a gate line and a data line which correspond to a respective pixel; and a pixel electrode including a first subpixel electrode in connection with an output terminal of the first TFT, and a second subpixel electrode in connection with an output terminal of the second TFT. The horizontal portions of the reference voltage line are in electrical connection with the second subpixel electrodes of the adjacent pixels.

摘要翻译： 液晶显示装置包括上下像素; 栅极线与相邻像素电连接并沿行方向延伸，以及跨越栅极线的数据线; 以及包括穿过相邻像素的垂直部分的参考电压线以及从垂直部分交替延伸的水平部分。 每个相邻像素包括与栅极线和对应于相应像素的数据线电连接的第一和第二薄膜晶体管（TFT）; 以及与第一TFT的输出端子连接的第一子像素电极和与第二TFT的输出端子连接的第二子像素电极的像素电极。 参考电压线的水平部分与相邻像素的第二子像素电极电连接。

公开(公告)号：US20120100049A1

公开(公告)日：2012-04-26

申请号：US13280280

申请日：2011-10-24

申请人： Lawrence Tavlarides ,  Hyung-Jun Park

发明人： Lawrence Tavlarides ,  Hyung-Jun Park

IPC分类号： C01F17/00

CPC分类号： B01J20/3204 ,  B01J20/103 ,  B01J20/28083 ,  B01J20/3248 ,  B01J20/3257 ,  C01F17/0006 ,  C01F17/0075 ,  C02F1/285 ,  C02F2101/20 ,  C02F2209/06

摘要： The present invention relates to methods for the separation of rare earth elements from aqueous solutions and, more particularly, to the separation of lanthanides (e.g., neodymium(III)) from aqueous solutions using an organo phosphorus functionalized adsorbent.

摘要翻译： 本发明涉及从水溶液中分离稀土元素的方法，更具体地涉及使用有机磷功能化吸附剂从水溶液中分离镧系元素（例如钕（III））。

公开(公告)号：US07125747B2

公开(公告)日：2006-10-24

申请号：US10873152

申请日：2004-06-23

申请人： Yong-gill Lee ,  Hyung-Jun Park ,  Sang-Bae Park

发明人： Yong-gill Lee ,  Hyung-Jun Park ,  Sang-Bae Park

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/568 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85001 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A process for manufacturing a plurality of leadless semiconductor packages includes an electrically testing step to test encapsulated chips in a matrix of a leadless leadframe. Firstly, a leadless leadframe having at least a packaging matrix is provided. The packaging matrix defines a plurality of units and a plurality of cutting streets between the units. The leadless leadframe has a plurality of leads in the units and a plurality of connecting bars connecting the leads along the cutting streets. A plated metal layer is formed on the upper surfaces of the leads and the upper surfaces of the connecting bars. After die-attaching, wire-bonding connection, and encapsulation, the leadless leadframe is etched to remove the connecting bars, then two sawing steps are performed. During the first sawing step, the plated metal layer on the upper surface of the connecting bars is cut out to electrically isolate the leads. Therefore, a plurality of chips sealed by an encapsulant on the packaging matrix can be electrically tested by probing which is performed between the first sawing and the second sawing. Thereafter, the encapsulant is cut to form a plurality of individual package bodies of the leadless semiconductor packages during the second sawing.

摘要翻译： 一种用于制造多个无引线半导体封装的工艺包括电测试步骤，用于测试无引线框架的矩阵中的封装芯片。 首先，提供至少具有封装矩阵的无引线框架。 包装矩阵在单元之间定义多个单元和多个切割街道。 无引线框架在单元中具有多个引线，并且多个连接条沿着切割街道连接引线。 在引线的上表面和连接条的上表面上形成电镀金属层。 在裸片安装，引线键合连接和封装之后，对无引线框架进行蚀刻以去除连接条，然后执行两个锯切步骤。 在第一锯切步骤期间，切断连接条的上表面上的电镀金属层以使引线电隔离。 因此，可以通过在第一锯切和第二锯切之间执行的探测来电测试由包装基质上的密封剂密封的多个芯片。 此后，在第二次锯切期间，密封剂被切割以形成多个无引线半导体封装的单个封装体。

公开(公告)号：US20060199308A1

公开(公告)日：2006-09-07

申请号：US11068799

申请日：2005-03-02

申请人： Yong-Gill Lee ,  Jin-Young Hong ,  Hyung-Jun Park ,  Jin-Hee Won

发明人： Yong-Gill Lee ,  Jin-Young Hong ,  Hyung-Jun Park ,  Jin-Hee Won

IPC分类号： H01L21/50

CPC分类号： H01L21/6835 ,  H01L21/4828 ,  H01L21/561 ,  H01L21/568 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A process for manufacturing sawing type leadless semiconductor packages includes a post mold-curing step, which is performed after an encapsulant is formed and after connecting bars of a leadframe are removed. The connecting bars are formed between a plurality of package units of the leadframe to connect a plurality of leads in the package units. After die attachment and electrical connection, the encapsulant is formed over the package units and the connecting bars to encapsulate the chips. The connecting bars are removed prior to the post mold-curing step. Therefore the encapsulant can be cured without deformation or warpage, thereby facilitating the sequent processes.

摘要翻译： 一种用于制造锯切型无引线半导体封装件的方法，包括在形成密封剂之后并且在引线框架的连接条被移除之后进行的后模具固化步骤。 连接杆形成在引线框架的多个封装单元之间，以连接封装单元中的多个引线。 在管芯附接和电连接之后，密封剂形成在封装单元和连接条上以封装芯片。 在后模具固化步骤之前移除连接杆。 因此，密封剂可以在没有变形或翘曲的情况下固化，从而便于后续处理。

公开(公告)号：US07056459B2

公开(公告)日：2006-06-06

申请号：US10602893

申请日：2003-06-25

申请人： Hyung Jun Park

发明人： Hyung Jun Park

IPC分类号： B29C44/02

CPC分类号： C08J5/18 ,  B29D35/0054 ,  B29D35/12 ,  B29D35/122 ,  B29D35/142 ,  C08J2331/04

摘要： A method for manufacturing shoe components using EVA copolymer of film shape having a thickness of 0.01 to 2 mm, preferably 0.1 to 1.0 mm and a surface roughness variations which cannot be easily discriminated through touch or sight, and a shoe component manufactured by the method are provided. The method overcomes the drawbacks caused during the process of manufacturing a shoe component with different mechanical physical properties or colors. The method allows for ease of manufacture of a shoe component with two or more types of colors or physical properties, through a single foam molding process using a film with less variation and ease of processing, to thereby simplify manufacturing procedures and reduce manufacturing costs. In addition, a high quality shoe component with no additional seam-line is obtained.

摘要翻译： 使用厚度为0.01〜2mm，优选为0.1〜1.0mm的膜状的EVA共聚物和通过触摸或视觉不能容易地判别的表面粗糙度变化以及通过该方法制造的鞋部件来制造鞋部件的方法是： 提供。 该方法克服了在制造具有不同机械物理性质或颜色的鞋部件的过程中引起的缺点。 该方法允许通过使用具有较小变化和易于加工的膜的单一泡沫模制方法容易地制造具有两种或更多种颜色或物理性质的鞋部件，从而简化制造程序并降低制造成本。 另外，获得了没有附加缝线的高质量的鞋部件。

公开(公告)号：US20050287709A1

公开(公告)日：2005-12-29

申请号：US10873152

申请日：2004-06-23

申请人： Yong-Gill Lee ,  Hyung-Jun Park ,  Sang-Bae Park

发明人： Yong-Gill Lee ,  Hyung-Jun Park ,  Sang-Bae Park

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495

CPC分类号： H01L21/568 ,  H01L21/56 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85001 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A process for manufacturing a plurality of leadless semiconductor packages includes an electrically testing step to test encapsulated chips in a matrix of a leadless leadframe. Firstly, a leadless leadframe having at least a packaging matrix is provided. The packaging matrix defines a plurality of units and a plurality of cutting streets between the units. The leadless leadframe has a plurality of leads in the units and a plurality of connecting bars connecting the leads along the cutting streets. A plated metal layer is formed on the upper surfaces of the leads and the upper surfaces of the connecting bars. After die-attaching, wire-bonding connection, and encapsulation, the leadless leadframe is etched to remove the connecting bars, then two sawing steps are performed. During the first sawing step, the plated metal layer on the upper surface of the connecting bars is cut out to electrically isolate the leads. Therefore, a plurality of chips sealed by an encapsulant on the packaging matrix can be electrically tested by probing which is performed between the first sawing and the second sawing. Thereafter, the encapsulant is cut to form a plurality of individual package bodies of the leadless semiconductor packages during the second sawing.

摘要翻译： 一种用于制造多个无引线半导体封装的工艺包括电测试步骤，用于测试无引线框架的矩阵中的封装芯片。 首先，提供至少具有封装矩阵的无引线框架。 包装矩阵在单元之间定义多个单元和多个切割街道。 无引线框架在单元中具有多个引线，并且多个连接条沿着切割街道连接引线。 在引线的上表面和连接条的上表面上形成电镀金属层。 在裸片安装，引线键合连接和封装之后，对无引线框架进行蚀刻以去除连接条，然后执行两个锯切步骤。 在第一锯切步骤期间，切断连接条的上表面上的电镀金属层以使引线电隔离。 因此，可以通过在第一锯切和第二锯切之间执行的探测来电测试由包装基质上的密封剂密封的多个芯片。 此后，在第二次锯切期间，密封剂被切割以形成多个无引线半导体封装的单个封装体。

公开(公告)号：US20050260795A1

公开(公告)日：2005-11-24

申请号：US10973385

申请日：2004-10-27

申请人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Kyung-Soo Rho ,  Jin-Hee Won

发明人： Sang-Bae Park ,  Yong-Gill Lee ,  Hyung-Jun Park ,  Kyung-Soo Rho ,  Jin-Hee Won

IPC分类号： H01L21/58 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L24/97 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49568 ,  H01L23/49582 ,  H01L24/15 ,  H01L24/48 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/484 ,  H01L2224/85399 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for fabricating leadless packages with mold locking characteristics is disclosed. A provided leadless leadframe has a plurality of units in a matrix, each unit includes an improved die pad with a plurality of indentations, such as semi-vias in the sidewall thereof and a plurality of leads around the die pad. After chip attachment and electrical connection, a plurality of package bodies for semiconductor packages are individually formed on the corresponding units and covered the indentations in order to enhance the horizontal mold locking capability of the die pad. Using punching, connecting bars of the leadless leadframe are removed to isolate the leadless packages.

摘要翻译： 公开了一种用于制造具有锁模特性的无引线封装的方法。 提供的无引线框架具有矩阵中的多个单元，每个单元包括具有多个凹口的改进的管芯焊盘，例如其侧壁中的半通孔和围绕管芯焊盘的多个引线。 在芯片附接和电连接之后，用于半导体封装的多个封装主体分别形成在相应的单元上并覆盖压痕，以便提高芯片焊盘的水平模具锁定能力。 使用无引线框架的冲孔，连接条来拆除无引线封装。

公开(公告)号：US06773961B1

公开(公告)日：2004-08-10

申请号：US10641094

申请日：2003-08-15

申请人： Jun Hong Lee ,  Hyung Jun Park ,  Hyeong No Kim ,  Kun A Kang

发明人： Jun Hong Lee ,  Hyung Jun Park ,  Hyeong No Kim ,  Kun A Kang

IPC分类号： H01L2144

CPC分类号： H01L21/561 ,  H01L21/4828 ,  H01L21/566 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A singulation method used in leadless packaging process is disclosed. An array of molded products on an upper surface of a lead frame is utilized in the singulation method. The lead frame has a plurality of dambars between the molded products. The lower surface of the lead frame is attached with a tape. Each of the molded products includes a semiconductor chip encapsulated in a package body and electrically coupled to the upper surface of the lead frame. The singulation method is accomplished by etching the upper surface of the lead frame with the package bodies as mask until each dambar is etched away.

摘要翻译： 公开了一种在无引线封装工艺中使用的切割方法。 在切割方法中使用在引线框架的上表面上的成型产品的阵列。 引线框架在模制产品之间具有多个堤坝。 引线框架的下表面附有带子。 每个模制产品包括封装在封装主体中并电耦合到引线框架的上表面的半导体芯片。 通过用封装体作为掩模蚀刻引线框架的上表面，直到每个阻挡层被蚀刻掉为止，完成了分割方法。