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公开(公告)号：US20070205327A1
公开(公告)日：2007-09-06
申请号：US11368838
申请日：2006-03-06
Applicant: Charles Gioffre , James Healy
Inventor： Charles Gioffre , James Healy
IPC: B64C1/20
CPC classification number: B64D47/08
Abstract: The invention is sensor pod assembly for mounting sensor systems for an aircraft, the aircraft having a fuselage with a longitudinal axis. In detail the sensor pod includes an elongated pod having front and rear ends, the pod removable mountable to the underside of the fuselage of the aircraft aligned with the longitudinal axis. A mounting system is includes to mount at least one container capable of being pressurized in a plurality of locations within the pod along the longitudinal axis, the at least one container including means to mount the sensor systems there within.
Abstract translation: 本发明是用于安装用于飞行器的传感器系统的传感器盒组件，该飞机具有具有纵向轴线的机身。 详细地，传感器盒包括具有前端和后端的细长的盒，可拆卸地安装到飞行器的机身的下侧的荚可以与纵向轴线对齐。 安装系统包括安装至少一个能够沿着纵向轴线在容器内的多个位置加压的容器，所述至少一个容器包括用于将传感器系统安装在其中的装置。
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2.发明申请公开(公告)号：US20100314433A1
公开(公告)日：2010-12-16
申请号：US12482668
申请日：2009-06-11
Applicant: Christopher James Healy
Inventor： Christopher James Healy
IPC: B23K31/02
CPC classification number: H01L24/16 , H01L21/4867 , H01L21/6835 , H01L24/11 , H01L24/75 , H01L24/81 , H01L2224/11003 , H01L2224/1131 , H01L2224/1182 , H01L2224/11822 , H01L2224/13099 , H01L2224/75 , H01L2224/7515 , H01L2224/7901 , H01L2224/81011 , H01L2224/8102 , H01L2224/81024 , H01L2224/81191 , H01L2224/81815 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2224/0401
Abstract: A flip chip packaging method to attach a die to a package substrate, the method including dipping the die into solder paste; placing the die onto the package substrate; and reflowing the solder paste to attach the die to the package substrate. Other embodiments are described and claimed.
Abstract translation: 一种用于将管芯附接到封装衬底的倒装芯片封装方法，所述方法包括将所述管芯浸入焊膏中; 将管芯放置在封装衬底上; 并回流焊膏以将管芯附接到封装衬底。 描述和要求保护其他实施例。
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3.发明申请Method and apparatus for removing and/or preventing surface contamination of a probe 失效用于去除和/或防止探针表面污染的方法和装置公开(公告)号：US20050241175A1
公开(公告)日：2005-11-03
申请号：US10834320
申请日：2004-04-28
Applicant: William Howland , James Healy
Inventor： William Howland , James Healy
IPC: G01R31/26 , B08B5/00 , F26B7/00 , F26B25/00 , G01Q10/00 , G01Q60/10 , G01Q60/14 , G01Q70/02 , G01Q70/06 , G01R1/06 , G01R3/00 , G01R31/28 , H01L21/66
Abstract: To remove and/or prevent contamination of a probe, at least a portion of the probe is positioned in a chamber having an inlet passage and an outlet passage, with a distal end of the probe extending through the outlet passage and terminating on a side thereof opposite the chamber. A gas is caused to flow through the inlet passage into the chamber and out the outlet passage, thereby modifying an environment surrounding the distal end of the probe. The gas may be heated prior to injection.
Abstract translation: 为了去除和/或防止探针的污染，探针的至少一部分定位在具有入口通道和出口通道的腔室中，探针的远端延伸穿过出口通道并在其一侧终止 在房间对面 使气体通过入口通道流入腔室并从出口通道流出，从而改变探针远端周围的环境。 注射前可以加热气体。
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公开(公告)号：US6141777A
公开(公告)日：2000-10-31
申请号：US924208
申请日：1997-09-05
Applicant: George M. Cutrell , James Healy , William C. Holford , Dennis L. Maino , Michael J. O'Connor , Milton A. Steiner
Inventor： George M. Cutrell , James Healy , William C. Holford , Dennis L. Maino , Michael J. O'Connor , Milton A. Steiner
CPC classification number: H04Q3/0075 , G06F11/327 , H04L41/0213 , H04L41/024 , H04L41/06 , H04L41/14 , H04L41/18 , H04L41/22 , H04L41/28 , H04L41/5061 , H04L69/16 , G06F2201/86 , H04L41/0803 , H04L41/0879
Abstract: A system and method for reporting, directly to a customer, conditions of telecommunications services to which the customer subscribes. The system includes a server for collecting fault information from the telecommunications network management system and a customer workstation for viewing the information. The customer can use the workstation to define a view of the data he wishes to receive. The server builds reports using the view, and provides the reports to the customer.
Abstract translation: 一种直接向客户报告客户订阅的电信服务条件的系统和方法。 该系统包括用于从电信网络管理系统收集故障信息的服务器和用于查看信息的客户工作站。 客户可以使用工作站来定义他希望接收的数据的视图。 服务器使用该视图构建报告，并向客户提供报告。
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公开(公告)号：US2584348A
公开(公告)日：1952-02-05
申请号：US74583247
申请日：1947-05-03
Applicant: JOHN A HEALY JR , EDWARD JAMES HEALY , MRS W F DONAIS , JOSEPHINE HEALY DE RUIZ
Inventor： HEALY JOHN A
IPC: A01D7/10
CPC classification number: A01D7/10
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Patent Agency Ranking
6.发明授权公开(公告)号：US08371497B2
公开(公告)日：2013-02-12
申请号：US12482668
申请日：2009-06-11
Applicant: Christopher James Healy
Inventor： Christopher James Healy
IPC: B23K31/02 , B23K35/34 , B23K101/40
CPC classification number: H01L24/16 , H01L21/4867 , H01L21/6835 , H01L24/11 , H01L24/75 , H01L24/81 , H01L2224/11003 , H01L2224/1131 , H01L2224/1182 , H01L2224/11822 , H01L2224/13099 , H01L2224/75 , H01L2224/7515 , H01L2224/7901 , H01L2224/81011 , H01L2224/8102 , H01L2224/81024 , H01L2224/81191 , H01L2224/81815 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2224/0401
Abstract: A flip chip packaging method to attach a die to a package substrate, the method including dipping the die into solder paste; placing the die onto the package substrate; and reflowing the solder paste to attach the die to the package substrate. Other embodiments are described and claimed.
Abstract translation: 一种用于将管芯附接到封装衬底的倒装芯片封装方法，所述方法包括将所述管芯浸入焊膏中; 将管芯放置在封装衬底上; 并回流焊膏以将管芯附接到封装衬底。 描述和要求保护其他实施例。
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公开(公告)号：US20060183989A1
公开(公告)日：2006-08-17
申请号：US11332767
申请日：2006-01-13
Applicant: James Healy
Inventor： James Healy
CPC classification number: A61B5/04087 , A61B5/04 , A61B2562/0209 , A61N1/0492
Abstract: A biomedical electrode for transmitting and/or receiving electrical signals to/from a patient is disclosed. The electrode includes a metallized fabric, wherein metallization of the fabric is connected at least on a top side and a bottom side of the fabric so as to uniformly transmit or receive the electrical signals. A conductive gel adhesive in contact with the metallized fabric. The electrode can be fabricated using a continuous web process, thereby reducing the cost of manufacturing the electrode.
Abstract translation: 公开了一种用于向/从患者发送和/或接收电信号的生物医学电极。 电极包括金属化织物，其中织物的金属化至少连接到织物的顶侧和底侧，以均匀地传输或接收电信号。 与金属化织物接触的导电凝胶粘合剂。 可以使用连续卷材工艺制造电极，从而降低制造电极的成本。
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8.发明授权公开(公告)号：US07063992B2
公开(公告)日：2006-06-20
申请号：US10637447
申请日：2003-08-08
Applicant: Michael J. Adams , James Healy, Jr. , William H. Howland, Jr.
Inventor： Michael J. Adams , James Healy, Jr. , William H. Howland, Jr.
IPC: H01L21/66
CPC classification number: H01L21/67253 , H01L21/67109 , Y10S438/928
Abstract: A method of processing a semiconductor wafer includes utilizing a heated gas to heat at least one part of a semiconductor wafer by convection whereupon at least one contaminant is desorbed therefrom. A stream of cooling gas is caused to pass over the one part of the semiconductor wafer in the absence of heated gas to cool the one part of the semiconductor wafer. A metrology tool is then caused to measure at least one part of the semiconductor wafer to determine at least one characteristic thereof.
Abstract translation: 一种处理半导体晶片的方法包括利用加热的气体来通过对流加热至少一部分半导体晶片，因此至少一种污染物从其脱离。 在没有加热气体的情况下使冷却气体流过半导体晶片的一部分，以冷却半导体晶片的一部分。 然后使计量工具测量半导体晶片的至少一部分，以确定其至少一个特性。
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9.发明申请公开(公告)号：US20050028836A1
公开(公告)日：2005-02-10
申请号：US10637447
申请日：2003-08-08
Applicant: Michael Adams , James Healy , William Howland
Inventor： Michael Adams , James Healy , William Howland
IPC: H01L21/66 , H01L21/00 , H01L21/304 , C25F1/00 , B08B3/12
CPC classification number: H01L21/67253 , H01L21/67109 , Y10S438/928
Abstract: A method of processing a semiconductor wafer includes utilizing a heated gas to heat at least one part of a semiconductor wafer by convection whereupon at least one contaminant is desorbed therefrom. A stream of cooling gas is caused to pass over the one part of the semiconductor wafer in the absence of heated gas to cool the one part of the semiconductor wafer. A metrology tool is then caused to measure at least one part of the semiconductor wafer to determine at least one characteristic thereof.
Abstract translation: 一种处理半导体晶片的方法包括利用加热的气体来通过对流加热至少一部分半导体晶片，因此至少一种污染物从其脱离。 在没有加热气体的情况下，使冷却气体流过半导体晶片的一部分，以冷却半导体晶片的一部分。 然后使计量工具测量半导体晶片的至少一部分，以确定其至少一个特性。
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公开(公告)号：US2799279A
公开(公告)日：1957-07-16
申请号：US37688053
申请日：1953-08-27
Applicant: JAMES HEALY
Inventor： JAMES HEALY
IPC: A24F19/00
CPC classification number: A24F19/0035
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