Abstract:
A system, method, and apparatus for mitigating contamination associated with ion implantation are provided. An ion source, end station, and mass analyzer positioned between the ion source and the end station are provided, wherein an ion beam is formed from the ion source and selectively travels through the mass analyzer to the end station, based on a position of a beam stop assembly. The beam stop assembly selectively prevents the ion beam from entering and/or exiting the mass analyzer, therein minimizing contamination associated with an unstable ion source during transition periods such as a start-up of the ion implantation system.
Abstract:
Apparatus for monitoring an externally applied parameter to selected products. The invention involves a housing enclosing a sensor, and a monitoring and output network. The sensor has a characteristic that varies in some predetermined manner with variation in the monitored parameter. The monitoring and output network involves a sensor which produces a signal representative of the monitored characteristic. Values associated with the signal are stored in a memory device for subsequent, selected retrieval.
Abstract:
The system processes one or more wafers from a FOUP to an ion processing chamber. A group of wafers from the FOUP is removed by a first end effector and loaded into a load lock through a lower door in an atmosphere opened position. The load lock is sealed, evacuated, and an upper door is opened to a vacuum opened position. A second end effector connected to a 3-axis robot moves one of the wafers from the load lock to the ion processing chamber. A wafer alignment robot can also be used. Wafers are sequentially processed from the load lock to the processing chamber until complete; and then the wafers within the load lock are sealed, pressurized, and moved back to the FOUP. A second load lock, and multiple FOUPs, are used to increase throughput.
Abstract:
Apparatus for monitoring an externally applied parameter to selected products. The invention involves a housing enclosing a sensor, and a monitoring and output network. The sensor has a characteristic that varies in some predetermined manner with variation in the monitored parameter. The monitoring and output network involves a sensor which produces a signal representative of the monitored characteristic. Values associated with the signal are stored in a memory device for subsequent, selected retrieval.
Abstract:
A system, method, and apparatus for mitigating contamination during ion implantation are provided. An ion source, end station, and mass analyzer positioned between the ion source and the end station are provided, wherein an ion beam is formed from the ion source and travels through the mass analyzer to the end station. An ion beam dump assembly comprising a particle collector, particle attractor, and shield are associated with the mass analyzer, wherein an electrical potential of the particle attractor is operable to attract and constrain contamination particles within the particle collector, and wherein the shield is operable to shield the electrical potential of the particle attractor from an electrical potential of an ion beam within the mass analyzer.
Abstract:
A method for reciprocally transporting a workpiece on a scan arm through an ion beam is provided, wherein the scan arm is operably coupled to a motor comprising a rotor and stator that are individually rotatable about a first axis. An electromagnetic force applied between the rotor and stator rotates the rotor about the first axis and translates the workpiece through the ion beam along a first scan path. A position of the workpiece is sensed and the electromagnetic force between the rotor and stator is controlled in order to reverse the direction of motion of the workpiece along the first scan path, and wherein the control is based, at least in part, on the sensed position of the workpiece. The stator further rotates about the first axis in reaction to the rotation of the rotor, particularly in the reversal of direction of motion of the workpiece, thus acting as a reaction mass to the rotation of one or more of the rotor, scan arm, and workpiece.
Abstract:
An ion implantation system contains, in the ion implantation chamber, a workpiece holder that scans vertically while tilting a wafer at an angle of rotation that is rotated out of a perpendicular orientation with respect to the axis of projection in an ion beam. The implant angle into an implant surface on wafer that is retained by the workpiece holder is adjusted by selective rotation of the workpiece holder about its path of motion. A Faraday cup scans the ion beam along the intended location of the implant surface to form a setup measurement plane. The ion beam quality is adjusted to enhance beam uniformity along the setup plane according to these tilt-angle measurements. A charge neutralizing device, such as a flood gun, is moved in operational alignment with the workpiece.
Abstract:
An ion beam scanning system includes an ion beam processing chamber and a shaft extending through two opposing walls of the chamber. Linear gas bearings couple the shaft through the walls to provide for rotational and linear movement of the shaft. An ion source and scanning unit generates an ion beam and scans a workpiece mounted on the shaft. The ion beam irradiates the workpiece at a selected angle, relative to the surface normal of the workpiece, defined by rotation of the shaft. A linear drive linearly moves the shaft so that the ion beam creates a raster pattern on the workpiece. The system can include counter-balancing of the shaft to ease the work of the drive units. Batch processing can be achieved through a rotatable disc mounted to the shaft, whereby each workpiece is processed by rotation of the disc and simultaneous linear motion of the shaft. One processing system can also include two mounting structures, one for loading/unloading during simultaneous processing of workpieces on another structure.
Abstract:
An ion beam scanning method and apparatus produce a parallel, scanned ion beam with a magnetic deflector having, in one instance, wedge-shaped pole pieces that develop a uniform magnetic field. A beam accelerator for the scanned beam has a slot-shaped passage which the scanned beam traverses. The beam scan and the beam traverse over a target object are controlled to attain a selected beam current and corresponding ion dose on a target object. Methods and apparatus are disclosed for increasing ion beam utilization efficiency without adversely effecting dose accuracy.
Abstract:
A substrate positioning system is provided to facilitate the performing of certain processing on the substrate, such as ion implantation. The system comprises a linkage rotatably mounted to a base and an end effector member rotatably mounted to the linkage and configured for receiving a substrate. Through the synchronized rotation of the linkage about the base and the end effector member about the linkage, the system acts as a robotic unit to move the substrate to the desired location for performing processing thereon. In another aspect, the base is movable along an axis such that the system maintains a constant distance of travel for an ion beam incident on the substrate as the linkage and end effector member travel in a curved path.