摘要:
A connecting component is provided. The connecting component includes an elastic contact and a base. The base includes a substrate, a sheet member, and a fixed contact. At least one of the substrate, the sheet member, and the fixed contact is formed using a damping alloy.
摘要:
The present invention relates to a semiconductor device and a method for manufacturing the same that prevent deformation or cracking caused by a difference in coefficient of thermal expansion. Elastic contacts provided on upper and lower surfaces of an interposer are elastically biased against the relatively displaced electrodes. The interposer thus compensates for displacement caused by different coefficients of thermal expansion so that an electrical connection between the electrodes of the first electronic component and the electrodes of the second electronic component is constantly maintained. Accordingly, this prevents separation or cracking in electrode connection areas.
摘要:
In order to be able to prevent devices from being degraded in high frequency property and to prevent damages to respective junction terminals, thereby achieving lengthening of the junction terminals in service life, a connector device comprising a plurality of substantially semi-spherical junction terminals arranged on one surface of a board, substantially semi-spherical junction terminals arranged in positions on the other surface of the board, corresponding to those positions, in which the respective junction terminals are arranged, to be conducted to the respective junction terminals, and a plurality of contactors corresponding to the respective junction terminals, and wherein the respective contactors comprise a through-hole and contact pieces arranged in the through-hole, and each of the junction terminals are inserted into the through-hole whereby a surface of each of the junction terminals is brought into contact with surfaces of the contact pieces.
摘要:
The electrical equipment of the present invention is operated such that the ON operating member for the primary power supply supplying circuit is manually operated, the switch device S is turned ON and when a supplying of electrical power for the primary power supply supplying circuit is shut off, the circuit for the control system is operated and upon performing a predetermined security processing, the driving source is driven, the OFF operating member is automatically operated, the switch device S is automatically turned OFF and supplying of an electrical power to the primary power supply supplying circuit is automatically shut off, so that it is possible to perform an appropriate processing before shutting off the primary power supply supplying circuit and thus it is also possible to provide electrical equipment showing a high safety characteristic.
摘要:
In the present invention, a microphone body 20 has recesses 20b. Bases 22 included in terminal portions are embedded in the recesses so that element-side terminals 23 fixed to the bases are electrically connected to the microphone body 20. The element-side terminals 23 are resiliently deformable terminals. Thus, the element-side terminals 23 are resiliently deformed to become conductively connected to the microphone body 20. This eliminates the need for joining the element-side terminals 23 to the microphone body 20 by soldering or the like, whereby the microphone body 20 can be properly protected from influence of heat. In addition, the terminal portions can be readily and properly attached to the element body by automatic mounting.
摘要:
By mounting a semiconductor carrier tray in an accommodating portion of a housing of a burn-in board and then closing a lid member, a large number of semiconductors can be placed on the burn-in board. By putting the burn-in board in this state into a burn-in tester, the plurality of semiconductors can be collectively tested. Accordingly, the semiconductors and sockets for holding the semiconductors need not be provided in the one-to-one relation, whereby a larger number of semiconductors can be tested at once.
摘要:
A cordinate input device is provided in which z-coordinate of an image object and a command to scroll the image can be inputted, a positive manipulation feeling can be obtained when changing scrolling speed (the amount of scrolling) of an image, and an accurate scrolling adjustment is enabled. The coordinate input device includes a casing, an (x, y) coordinate information input unit 6, push-button switches 7 and 8 for inputting the (x, y) coordinate information detected by the (x, y) coordinate information input unit 6, and an input manipulation unit for inputting z-coordinate information and image scrolling information in addition to the (x, y) coordinate information. The input manipulation unit includes a jog/shuttle switch 9 having a jog dial and a shuttle dial coaxially disposed.
摘要:
An electronically functioning device module, an input device having the electronically functioning device module, and electronic equipment having the input device is provided. LEDs or a microphone device are mounted to a back surface of a seat member on which reversing plates are mounted.
摘要:
A substrate is formed with a plurality of spiral contactors on an upper surface serving as a first surface and a plurality of connecting terminals on a lower surface serving as a second surface. Since the spiral contactors are arranged in a matrix on the upper surface serving as the first surface, a lot of spiral contactors can be provided on the substrate of the present invention, and a mount area can be enlarged, and the size of the connector can be decreased. Also, the spiral contact terminal can improve a high-frequency characteristic.
摘要:
By mounting a semiconductor carrier tray in an accommodating portion of a housing of a burn-in board and then closing a lid member, a large number of semiconductors can be placed on the burn-in board. By putting the burn-in board in this state into a burn-in tester, the plurality of semiconductors can be collectively tested. Accordingly, the semiconductors and sockets for holding the semiconductors need not be provided in the one-to-one relation, whereby a larger number of semiconductors can be tested at once.