公开(公告)号：US06187114B1

公开(公告)日：2001-02-13

申请号：US08950284

申请日：1997-10-14

申请人： Toshinori Ogashiwa ,  Takatoshi Arikawa ,  Masami Yokozawa ,  Kazuhiro Aoi ,  Yoshiharu Sawada

发明人： Toshinori Ogashiwa ,  Takatoshi Arikawa ,  Masami Yokozawa ,  Kazuhiro Aoi ,  Yoshiharu Sawada

IPC分类号： B22K3526

CPC分类号： H01L24/48 ,  B23K35/262 ,  B23K2101/42 ,  C22C13/00 ,  H01L23/488 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L2224/04026 ,  H01L2224/05073 ,  H01L2224/05624 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29211 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29386 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48655 ,  H01L2224/48699 ,  H01L2224/48724 ,  H01L2224/48755 ,  H01L2224/73265 ,  H01L2224/83455 ,  H01L2224/85455 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01083 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01082 ,  H01L2924/01026 ,  H01L2924/01046 ,  H01L2924/01049 ,  H01L2924/3512 ,  H01L2924/053 ,  H01L2924/045 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/2075 ,  H01L2924/20754

摘要： This invention provides a lead-free high temperature solder material comprising 0.005-3.0 wt % of palladium (Pd) and 97.0-99.995 wt % of tin (Sn) whose liquidus temperature is 200-350° C. The solder material is environmentally-friendly, improved in thermal fatigue property, and it can improve the reliability of electronic apparatuses. A predetermined amount of Sn material and Pd is mixed, vacuum-melted and cast to prepare an ingot. The ingot is rolled to be a tape that is later pressed to obtain a solder pellet. In a preferable composition, at least 95 wt % of Sn and 0.005-3.0 wt 5 of Pd are contained, and 0.1-5.0 wt % of metallic (e.g. Cu, Ni) or alloy particles are added. The average particle diameter is about 40 &mgr;m. A substrate and an IC chip (electronic element) are die-bonded substantially in parallel by a solder material provided between an Ni plating on the lower side of an IC chip (semiconductor) and an Ni plating on a die.

摘要翻译： 本发明提供一种无铅高温焊料材料，其包含0.005-3.0重量％的钯（Pd）和97.0-99.995重量％的液相线温度为200-350℃的锡（Sn）。焊料材料是环境友好的 ，提高了热疲劳性能，可提高电子设备的可靠性。 将预定量的Sn材料和Pd混合，真空熔融并铸造以制备锭。 将锭轧制成随后压制以获得焊料丸的带。 在优选的组成中，含有至少95重量％的Sn和0.005-3.0重量％的Pd，并且加入0.1-5.0重量％的金属（例如Cu，Ni）或合金颗粒。 平均粒径约40μm。 基板和IC芯片（电子元件）通过设置在IC芯片（半导体）的下侧的Ni镀层和模具上的Ni镀层之间的焊料材料大致平行地进行芯片焊接。