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公开(公告)号：US06187114B1
公开(公告)日：2001-02-13
申请号：US08950284
申请日：1997-10-14
IPC分类号： B22K3526
CPC分类号： H01L24/48 , B23K35/262 , B23K2101/42 , C22C13/00 , H01L23/488 , H01L24/29 , H01L24/32 , H01L24/45 , H01L2224/04026 , H01L2224/05073 , H01L2224/05624 , H01L2224/29 , H01L2224/29101 , H01L2224/29109 , H01L2224/29111 , H01L2224/29211 , H01L2224/29347 , H01L2224/29355 , H01L2224/29386 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48655 , H01L2224/48699 , H01L2224/48724 , H01L2224/48755 , H01L2224/73265 , H01L2224/83455 , H01L2224/85455 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01083 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/15787 , H01L2924/19043 , H01L2924/00014 , H01L2924/00 , H01L2924/01082 , H01L2924/01026 , H01L2924/01046 , H01L2924/01049 , H01L2924/3512 , H01L2924/053 , H01L2924/045 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2924/20752 , H01L2924/20753 , H01L2924/20755 , H01L2924/20756 , H01L2924/2075 , H01L2924/20754
摘要： This invention provides a lead-free high temperature solder material comprising 0.005-3.0 wt % of palladium (Pd) and 97.0-99.995 wt % of tin (Sn) whose liquidus temperature is 200-350° C. The solder material is environmentally-friendly, improved in thermal fatigue property, and it can improve the reliability of electronic apparatuses. A predetermined amount of Sn material and Pd is mixed, vacuum-melted and cast to prepare an ingot. The ingot is rolled to be a tape that is later pressed to obtain a solder pellet. In a preferable composition, at least 95 wt % of Sn and 0.005-3.0 wt 5 of Pd are contained, and 0.1-5.0 wt % of metallic (e.g. Cu, Ni) or alloy particles are added. The average particle diameter is about 40 &mgr;m. A substrate and an IC chip (electronic element) are die-bonded substantially in parallel by a solder material provided between an Ni plating on the lower side of an IC chip (semiconductor) and an Ni plating on a die.
摘要翻译： 本发明提供一种无铅高温焊料材料，其包含0.005-3.0重量％的钯（Pd）和97.0-99.995重量％的液相线温度为200-350℃的锡（Sn）。焊料材料是环境友好的 ，提高了热疲劳性能，可提高电子设备的可靠性。 将预定量的Sn材料和Pd混合，真空熔融并铸造以制备锭。 将锭轧制成随后压制以获得焊料丸的带。 在优选的组成中，含有至少95重量％的Sn和0.005-3.0重量％的Pd，并且加入0.1-5.0重量％的金属（例如Cu，Ni）或合金颗粒。 平均粒径约40μm。 基板和IC芯片（电子元件）通过设置在IC芯片（半导体）的下侧的Ni镀层和模具上的Ni镀层之间的焊料材料大致平行地进行芯片焊接。
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公开(公告)号：US09136295B2
公开(公告)日：2015-09-15
申请号：US13364994
申请日：2012-02-02
申请人： Yoshiharu Sawada , Sho Suzuki , Takehito Okabe , Masatsugu Itahashi , Takashi Usui , Junji Iwata
发明人： Yoshiharu Sawada , Sho Suzuki , Takehito Okabe , Masatsugu Itahashi , Takashi Usui , Junji Iwata
IPC分类号： H01L27/146
CPC分类号： H01L27/14625 , H01L27/14632 , H01L27/14685 , H01L27/14687
摘要： There are provided a first waveguide member in an imaging region and a peripheral region of a semiconductor substrate and a via plug penetrating the first waveguide member.
摘要翻译： 提供了成像区域中的第一波导构件和半导体衬底的周边区域和穿过第一波导构件的通孔插头。
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公开(公告)号：US20120199928A1
公开(公告)日：2012-08-09
申请号：US13364994
申请日：2012-02-02
申请人： Yoshiharu Sawada , Sho Suzuki , Takehito Okabe , Masatsugu Itahashi , Takashi Usui , Junji Iwata
发明人： Yoshiharu Sawada , Sho Suzuki , Takehito Okabe , Masatsugu Itahashi , Takashi Usui , Junji Iwata
IPC分类号： H01L31/0232 , H01L21/31 , H01L21/768
CPC分类号： H01L27/14625 , H01L27/14632 , H01L27/14685 , H01L27/14687
摘要： There are provided a first waveguide member in an imaging region and a peripheral region of a semiconductor substrate and a via plug penetrating the first waveguide member.
摘要翻译： 提供了成像区域中的第一波导构件和半导体衬底的周边区域和穿过第一波导构件的通孔插头。
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