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公开(公告)号:US07042087B2
公开(公告)日:2006-05-09
申请号:US10622997
申请日:2003-07-18
申请人: Noriaki Sakamoto , Yoshiyuki Kobayashi , Eiju Maehara , Noriyasu Sakai , Hitoshi Takagishi , Kouji Takahashi , Kazuhisa Kusano
发明人: Noriaki Sakamoto , Yoshiyuki Kobayashi , Eiju Maehara , Noriyasu Sakai , Hitoshi Takagishi , Kouji Takahashi , Kazuhisa Kusano
IPC分类号: H01L23/52 , H01L23/495 , B23K31/00
CPC分类号: H01L25/16 , H01L21/4832 , H01L23/3107 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2221/68377 , H01L2224/04042 , H01L2224/05556 , H01L2224/05624 , H01L2224/05647 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48472 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/49171 , H01L2224/73265 , H01L2224/85201 , H01L2224/85205 , H01L2224/85424 , H01L2224/85447 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01059 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12035 , H01L2924/12036 , H01L2924/12042 , H01L2924/1301 , H01L2924/13055 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/2076 , H05K1/185 , H05K3/06 , H05K3/202 , H01L2924/00 , H01L2924/00012 , H01L2924/20754 , H01L2924/00015
摘要: The semiconductor elements for the small signal type circuits and the Au wire for connection are integrated as one package to produce the semiconductor devices 30A, 31A, 32, 33A, 34A and 38. In this way, the wire bonding of Au can be omitted, and the wire bonding of the small diameter Al wire and the large diameter Al wire is only required to complete the connection of the fine metal wire.These semiconductor devices have a plurality of circuit elements as one package, so that the mounting operation on the mounting board can be significantly reduced.
摘要翻译: 用于小信号电路的半导体元件和用于连接的Au线被集成为一个封装以制造半导体器件30A,31A,32,3AA,34A和38。 以这种方式,可以省略Au的引线键合,仅需要小直径Al线和大直径Al线的引线接合才能完成金属细线的连接。 这些半导体器件具有作为一个封装的多个电路元件,从而可以显着地减少对安装板的安装操作。
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公开(公告)号:US06624511B2
公开(公告)日:2003-09-23
申请号:US09821447
申请日:2001-03-29
申请人: Noriaki Sakamoto , Yoshiyuki Kobayashi , Eiju Maehara , Noriyasu Sakai , Hitoshi Takagishi , Kouji Takahashi , Kazuhisa Kusano
发明人: Noriaki Sakamoto , Yoshiyuki Kobayashi , Eiju Maehara , Noriyasu Sakai , Hitoshi Takagishi , Kouji Takahashi , Kazuhisa Kusano
IPC分类号: H01L2348
CPC分类号: H01L25/16 , H01L21/4832 , H01L23/3107 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2221/68377 , H01L2224/04042 , H01L2224/05556 , H01L2224/05624 , H01L2224/05647 , H01L2224/32245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48472 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/49171 , H01L2224/73265 , H01L2224/85201 , H01L2224/85205 , H01L2224/85424 , H01L2224/85447 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01028 , H01L2924/01029 , H01L2924/01047 , H01L2924/0105 , H01L2924/01059 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12035 , H01L2924/12036 , H01L2924/12042 , H01L2924/1301 , H01L2924/13055 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/18301 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/2076 , H05K1/185 , H05K3/06 , H05K3/202 , H01L2924/00 , H01L2924/00012 , H01L2924/20754 , H01L2924/00015
摘要: The semiconductor elements for the small signal type circuits and the Au wire for connection are integrated as one package to produce the semiconductor devices 30A, 31A, 32, 33A, 34A and 38. In this way, the wire bonding of Au can be omitted, and the wire bonding of the small diameter Al wire and the large diameter Al wire is only required to complete the connection of the fine metal wire. These semiconductor devices have a plurality of circuit elements as one package, so that the mounting operation on the mounting board can be significantly reduced.
摘要翻译: 用于小信号电路的半导体元件和用于连接的Au线被集成为一个封装以制造半导体器件30A,31A,32,33A,34A和38.这样,可以省略Au的引线接合, 并且仅需要小直径Al线和大直径Al线的引线接合来完成细金属线的连接。这些半导体器件具有作为一个封装的多个电路元件,从而在安装上的安装操作 板可以大大减少。
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公开(公告)号:US07053492B2
公开(公告)日:2006-05-30
申请号:US10632623
申请日:2003-08-01
CPC分类号: H01L24/83 , C25D7/12 , H01L21/4832 , H01L23/3107 , H01L23/49582 , H01L23/498 , H01L23/49838 , H01L24/06 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05555 , H01L2224/05647 , H01L2224/26175 , H01L2224/291 , H01L2224/29101 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49171 , H01L2224/73265 , H01L2224/8319 , H01L2224/83801 , H01L2224/85205 , H01L2224/92247 , H01L2224/97 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01059 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2224/83 , H01L2224/85 , H01L2924/00014 , H01L2924/00 , H01L2924/01026 , H01L2224/83205 , H01L2924/00012
摘要: The overflow of a brazing material (19) from a die pad (11) is prevented by forming a second plating film (14B) on the surface of the die pad (11). The second plating film (14B) is provided around the surface of the die pad 11 so as to enclose an area where a semiconductor element (13) is mounted. In a step of mounting the semiconductor element (13) on the die pad (11) with the brazing material (19), the brazing material (19) overflows from the first plating film (14A) when the semiconductor element (13) is mounted on the upper part of the molten brazing material. However, the second plating film (14B) functions as a blocking area by which the overflow of the brazing material is prevented. Therefore, a short circuit can be prevented from arising between the die pad (11) and the bonding pad (12) because of the brazing material that has spread.
摘要翻译: 通过在管芯焊盘(11)的表面上形成第二镀膜(14B)来防止钎焊材料(19)从管芯焊盘(11)溢出。 第二电镀膜(14B)设置在芯片焊盘11的表面周围,以包围安装半导体元件(13)的区域。 在利用钎料(19)将半导体元件(13)安装在芯片焊盘(11)上的步骤中,半导体元件(13)为半导体元件(13)时,钎焊材料(19)从第一镀膜(14A)溢出 安装在熔融钎焊材料的上部。 然而,第二电镀膜(14B)用作防止钎焊材料的溢出的阻挡区域。 因此,由于已经扩展的钎焊材料,可以防止在芯片焊盘(11)和焊盘(12)之间产生短路。
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