公开(公告)号：US5320409A

公开(公告)日：1994-06-14

申请号：US798333

申请日：1991-11-06

申请人： Kazuhito Katoh ,  Hideyuki Nagashima ,  Yoichi Kishi

发明人： Kazuhito Katoh ,  Hideyuki Nagashima ,  Yoichi Kishi

IPC分类号： A47C7/14 ,  A47C7/46 ,  B60N2/02 ,  B60N2/90 ,  A47C3/00

CPC分类号： B60N2/4415 ,  B60N2/0232 ,  B60N2/0244 ,  Y10S297/03

摘要： A seat apparatus for a vehicle includes a seat which is composed of a seat cushion and a seat back. A plurality of actuators are provided in the seat, for altering a bearing-surface configuration of the seat. The actuators are driven by an air compressor which is controlled by a controller in a predetermined pattern. The controller judges oscillation transmitted to a passenger seated on the seat, on the basis of a signal from an acceleration sensor, and regulates the predetermined pattern of the control, in accordance with the judged oscillation. The controller may be so arranged as to judge the oscillation transmitted to the passenger, on the basis of signals from a speed sensor and a road-surface-condition detecting sensor.

摘要翻译： 用于车辆的座椅装置包括由座垫和座椅靠背构成的座椅。 多个致动器设置在座椅中，用于改变座椅的轴承表面构型。 致动器由空气压缩机驱动，空气压缩机由控制器以预定模式控制。 控制器基于来自加速度传感器的信号来判断发送到坐在座椅上的乘客的振动，并且根据所判断的振荡来调节控制的预定模式。 控制器可以根据来自速度传感器和路面状态检测传感器的信号来布置成判断发送给乘客的振动。

公开(公告)号：US08405218B2

公开(公告)日：2013-03-26

申请号：US12887874

申请日：2010-09-22

申请人： Manabu Tomisaka ,  Michio Kameyama ,  Terukazu Fukaya ,  Kazuhito Katoh ,  Akira Tai ,  Kazuo Akamatsu ,  Yoshiko Fukuda ,  Yuji Fukuda ,  Mika Ootsuki

发明人： Manabu Tomisaka ,  Michio Kameyama ,  Terukazu Fukaya ,  Kazuhito Katoh ,  Yutaka Fukuda ,  Akira Tai ,  Kazuo Akamatsu

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L21/76804 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/5226 ,  H01L24/03 ,  H01L24/11 ,  H01L24/741 ,  H01L2224/02166 ,  H01L2224/0384 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/0517 ,  H01L2224/05171 ,  H01L2224/05172 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/05582 ,  H01L2224/05583 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0566 ,  H01L2224/05669 ,  H01L2224/11505 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/749 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/01026 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2224/05552

摘要： In a method of manufacturing a semiconductor device, an electrode layer is formed on a surface of a semiconductor substrate, and a resin insulation layer is formed on the surface of the semiconductor substrate so that the electrode layer can be covered with the resin insulation layer. A tapered hole is formed in the insulation layer by using a tool bit having a rake angle of zero or a negative value. The tapered hole has an opening defined by the insulation layer, a bottom defined by the electrode layer, and a side wall connecting the opening to the bottom.

摘要翻译： 在制造半导体器件的方法中，在半导体衬底的表面上形成电极层，并且在半导体衬底的表面上形成树脂绝缘层，使得可以用树脂绝缘层覆盖电极层。 通过使用前角为零或负值的工具钻头，在绝缘层中形成锥形孔。 锥形孔具有由绝缘层限定的开口，由电极层限定的底部和将开口连接到底部的侧壁。

公开(公告)号：US20110198733A1

公开(公告)日：2011-08-18

申请号：US12887874

申请日：2010-09-22

申请人： Manabu Tomisaka ,  Michio Kameyama ,  Terukazu Fukaya ,  Kazuhito Katoh ,  Yutaka Fukuda ,  Akira Tai ,  Kazuo Akamatsu ,  Yoshiko Fukuda ,  Yuji Fukuda ,  Mika Ootsuki ,  Mayu Fukuda

发明人： Manabu Tomisaka ,  Michio Kameyama ,  Terukazu Fukaya ,  Kazuhito Katoh ,  Yutaka Fukuda ,  Akira Tai ,  Kazuo Akamatsu ,  Yoshiko Fukuda ,  Yuji Fukuda ,  Mika Ootsuki ,  Mayu Fukuda

IPC分类号： H01L29/06 ,  H01L21/66

CPC分类号： H01L21/76804 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/5226 ,  H01L24/03 ,  H01L24/11 ,  H01L24/741 ,  H01L2224/02166 ,  H01L2224/0384 ,  H01L2224/0391 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/0517 ,  H01L2224/05171 ,  H01L2224/05172 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/05582 ,  H01L2224/05583 ,  H01L2224/05611 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0566 ,  H01L2224/05669 ,  H01L2224/11505 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/749 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/01026 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2224/05552

摘要： In a method of manufacturing a semiconductor device, an electrode layer is formed on a surface of a semiconductor substrate, and a resin insulation layer is formed on the surface of the semiconductor substrate so that the electrode layer can be covered with the resin insulation layer. A tapered hole is formed in the insulation layer by using a tool bit having a rake angle of zero or a negative value. The tapered hole has an opening defined by the insulation layer, a bottom defined by the electrode layer, and a side wall connecting the opening to the bottom.

摘要翻译： 在制造半导体器件的方法中，在半导体衬底的表面上形成电极层，并且在半导体衬底的表面上形成树脂绝缘层，使得可以用树脂绝缘层覆盖电极层。 通过使用前角为零或负值的工具钻头，在绝缘层中形成锥形孔。 锥形孔具有由绝缘层限定的开口，由电极层限定的底部和将开口连接到底部的侧壁。