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25 条记录 (耗时 0.014 秒)

    INTEGRATED CIRCUIT CHIP INCORPORATING EMBEDDED THERMAL RADIATORS FOR LOCALIZED, ON-DEMAND, HEATING AND A SYSTEM AND METHOD FOR DESIGNING SUCH AN INTEGRATED CIRCUIT CHIP
    2.
    发明申请
    INTEGRATED CIRCUIT CHIP INCORPORATING EMBEDDED THERMAL RADIATORS FOR LOCALIZED, ON-DEMAND, HEATING AND A SYSTEM AND METHOD FOR DESIGNING SUCH AN INTEGRATED CIRCUIT CHIP 失效
    集成电路芯片，用于本地化，点燃，加热和系统的嵌入式热分解器以及用于设计这种集成电路芯片的方法

    公开(公告)号：US20120168416A1

    公开(公告)日：2012-07-05

    申请号：US12984638

    申请日：2011-01-05

    申请人： Richard S. Graf ,  Keishi Okamoto ,  Faraydon Pakbaz ,  Jack R. Smith ,  Sebastian T. Ventrone

    发明人： Richard S. Graf ,  Keishi Okamoto ,  Faraydon Pakbaz ,  Jack R. Smith ,  Sebastian T. Ventrone

    IPC分类号： H05B3/00 ,  G06F17/50

    CPC分类号： H05B1/0227 ,  G05D23/1934

    摘要： Disclosed are embodiments of an integrated circuit chip designed for reliability at low ambient temperatures. The chip substrate can be divided into zones, including at least one temperature-sensitive zone (TSZ) that contains one or more temperature-sensitive circuits. Temperature sensor(s) can be positioned in the semiconductor substrate adjacent to the TSZ. Thermal radiator(s) can be embedded in a metal wiring layer and aligned above the TSZ. The temperature sensor(s) can be operatively connected to the thermal radiator(s) and can trigger operation of the thermal radiator(s) when the temperature in the TSZ is below a predetermined threshold temperature. Additionally, an on-chip power control system can be operatively connected to the thermal radiator(s) so that operation of the thermal radiator(s) is only triggered when a circuit within the TSZ is about to be powered up. Also disclosed are associated embodiments of a system and method for designing such an integrated circuit chip.

    摘要翻译： 公开了设计用于在低环境温度下可靠性的集成电路芯片的实施例。 芯片基板可以分为包括至少一个包含一个或多个温度敏感电路的至少一个温度敏感区（TSZ）的区域。 温度传感器可以位于与TSZ相邻的半导体衬底中。 热辐射器可以嵌入在金属布线层中，并在TSZ上方对齐。 温度传感器可以可操作地连接到散热器，并且当TSZ中的温度低于预定阈值温度时，可以触发热辐射器的操作。 此外，片上功率控制系统可以可操作地连接到散热器，使得热辐射器的操作仅在TSZ内的电路即将被加电时触发。 还公开了用于设计这种集成电路芯片的系统和方法的相关实施例。

    MEMORY DEVICE AND MEMORY DEVICE CONTROLLER
    3.
    发明申请
    MEMORY DEVICE AND MEMORY DEVICE CONTROLLER 审中-公开
    存储器件和存储器件控制器

    公开(公告)号：US20100268897A1

    公开(公告)日：2010-10-21

    申请号：US12760842

    申请日：2010-04-15

    申请人： Keishi OKAMOTO ,  Takeshi Otsuka ,  Hideaki Yamashita

    发明人： Keishi OKAMOTO ,  Takeshi Otsuka ,  Hideaki Yamashita

    IPC分类号： G06F12/00

    CPC分类号： G06F13/1689

    摘要： A memory device controller interposed between a memory device and a host device includes a data communication unit configured to transfer data to and from the memory device in synchronization with a clock signal. The data communication unit supports a single edge synchronization mode in which data is transferred in synchronization with either one of a rising edge and a falling edge of the clock signal, and a double edge synchronization mode in which data is transferred in synchronization with both the rising edge and the falling edge. The data communication unit transfers data in the double edge synchronization mode when data is transferred by the memory device operating as a bus master.

    摘要翻译： 插入存储器件和主机之间的存储器件控制器包括数据通信单元，被配置为与时钟信号同步地将数据传送到存储器件和从存储器件传送数据。 数据通信单元支持与时钟信号的上升沿和下降沿中的任一个同步地传送数据的单边沿同步模式，以及双边沿同步模式，其中数据与上升沿同步地传送 边缘和下降边缘。 当作为总线主机工作的存储器件传送数据时，数据通信单元以双边沿同步模式传送数据。

    Shuffling device, coding device, decoding device of video signal and medium recording the programs of shuffling, coding and decoding
    5.
    发明授权
    Shuffling device, coding device, decoding device of video signal and medium recording the programs of shuffling, coding and decoding 失效
    改组装置，编码装置，视频信号解码装置和媒体记录洗牌，编码和解码程序

    公开(公告)号：US06847685B1

    公开(公告)日：2005-01-25

    申请号：US09589800

    申请日：2000-06-08

    申请人： Yuji Fujiwara ,  Masakazu Nishino ,  Mitsuhiro Miyashita ,  Kazuhiro Wake ,  Seiichi Takeuchi ,  Keishi Okamoto

    发明人： Yuji Fujiwara ,  Masakazu Nishino ,  Mitsuhiro Miyashita ,  Kazuhiro Wake ,  Seiichi Takeuchi ,  Keishi Okamoto

    IPC分类号： H04N7/24 ,  H04N7/30 ,  H04N7/12 ,  H04N7/64

    CPC分类号： H04N19/33 ,  H04N19/124 ,  H04N19/139 ,  H04N19/15 ,  H04N19/172 ,  H04N19/176 ,  H04N19/186 ,  H04N19/44 ,  H04N19/61

    摘要： A video signal shuffling device forms a segment with blocks having a given offset value in horizontal and vertical directions from a given starting point uniquely determined on the screen, the offset value being identical in every region. The segment is formed in a unit of one frame or two frames. The shuffling device divides one frame comprising blocks into a plurality of regions. A coding device determines a final priority as well as a final quantizer thereby quantizing a segment and providing the segment with a variable-length-coding based on a first priority, coding-quantity obtained from a plurality of quantizers, second priority and a quantizer. A coding device and its decoder, the coding device carries out a hierarchical coding by only a motion vector in a compressed stream at a lower resolution side and by agreeing a motion detected and a DCT block size with a size on the screen.

    摘要翻译： 视频信号混洗装置从在屏幕上唯一确定的给定起始点在水平和垂直方向上形成具有给定偏移值的块的段，每个区域的偏移值相同。 该段以一帧或两帧的单位形成。 洗牌装置将包括块的一个帧分成多个区域。 编码装置确定最终优先级以及最终量化器，从而量化段，并且基于从多个量化器获得的第一优先级，第二优先级和量化器获得的编码量，为段提供可变长度编码。 一种编码装置及其解码器，编码装置仅通过较低分辨率侧的压缩流中的运动矢量进行分层编码，并使检测到的运动和DCT块尺寸与屏幕上的尺寸一致。

    Recording and reproducing apparatus
    7.
    发明授权
    Recording and reproducing apparatus 失效
    记录和再现设备

    公开(公告)号：US5625461A

    公开(公告)日：1997-04-29

    申请号：US255804

    申请日：1994-06-07

    申请人： Keishi Okamoto ,  Tatsushi Bannai

    发明人： Keishi Okamoto ,  Tatsushi Bannai

    IPC分类号： G11B27/28 ,  G11B20/10 ,  G11B27/032 ,  G11B27/036 ,  H04N5/782 ,  H04N5/7826 ,  H04N5/91 ,  H04N5/92 ,  H04N5/926 ,  H04N5/93 ,  H04N5/76 ,  G11B5/02 ,  G11B27/02

    CPC分类号： G11B20/10527 ,  G11B27/032 ,  G11B27/036 ,  H04N5/9201 ,  G11B2220/216 ,  G11B2220/90 ,  H04N5/926

    摘要： A recording and reproducing apparatus is capable of editing video signals and audio signals recording additional information data for controlling the reproduction output level. The recording side includes an additional information data generating circuit, a time division multiplexing circuit for time-division multiplexing a video signal data and audio signal data and the additional information data, and a recording head. In independent areas on a recording medium, the video signal data, audio signal data and additional information data are individually recorded. The reproduction side includes a reproduction head, a data separation circuit for separating the video, audio and additional information, an additional information data detecting circuit for producing output level data, and a circuit for controlling the levels of the reproduced video and audio signals depending on the output level data.

    摘要翻译： 记录和再现装置能够编辑记录用于控制再现输出电平的附加信息数据的视频信号和音频信号。 记录侧包括附加信息数据生成电路，用于对视频信号数据和音频信号数据和附加信息数据进行时分多路复用的时分复用电路和记录头。 在记录介质上的独立区域中，分别记录视频信号数据，音频信号数据和附加信息数据。 再现侧包括再现头，用于分离视频，音频和附​​加信息的数据分离电路，用于产生输出电平数据的附加信息数据检测电路，以及用于控制根据重放视频和音频信号的电平的电路 输出电平数据。

    Electronic package for millimeter wave semiconductor dies
    10.
    发明授权
    Electronic package for millimeter wave semiconductor dies 有权
    毫米波半导体芯片的电子封装

    公开(公告)号：US09219041B2

    公开(公告)日：2015-12-22

    申请号：US13433317

    申请日：2012-03-29

    申请人： Danny Elad ,  Noam Kaminski ,  Keishi Okamoto ,  Evgeny Shumaker ,  Kazushige Toriyama

    发明人： Danny Elad ,  Noam Kaminski ,  Keishi Okamoto ,  Evgeny Shumaker ,  Kazushige Toriyama

    IPC分类号： H01L23/34 ,  H01L23/52 ,  H01L23/58 ,  H01L23/66

    CPC分类号： H01L23/66 ,  H01L2223/6616 ,  H01L2223/6633 ,  H01L2223/6683 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A mmWave electronics package constructed from common Printed Circuit Board (PCB) technology and a metal cover. Assembly of the package uses standard pick and place technology and heat is dissipated directly to a pad on the package. Input/output of mmWave signal(s) is achieved through a rectangular waveguide. Mounting of the electronic package to an electrical printed circuit board (PCB) is performed using conventional reflow soldering processes and includes a waveguide I/O connected to an mmWave antenna. The electronic package provides for transmission of low frequency, dc and ground signals from the semiconductor chip inside the package to the PCB it is mounted on. An impedance matching scheme matches the chip to high frequency board transition by altering the ground plane within the chip. A ground plane on the high frequency board encircles the high frequency signal bump to confine the electromagnetic fields to the bump region reducing radiation loss.

    摘要翻译： 由通用印刷电路板（PCB）技术和金属盖构成的mmWave电子封装。 封装的组装使用标准的拾放技术，热量直接耗散到封装上的焊盘上。 mm波形信号的输入/输出通过矩形波导实现。 使用常规回流焊工艺将电子封装安装到电气印刷电路板（PCB）上，并包括连接到mmWave天线的波导管I / O。 电子封装提供从封装内的半导体芯片到其所安装的PCB的低频，直流和地信号的传输。 阻抗匹配方案通过改变芯片内的接地平面将芯片与高频板转换相匹配。 高频板上的接地层包围高频信号突起，将电磁场限制在凸点区域，减少辐射损耗。