公开(公告)号：US08847356B2

公开(公告)日：2014-09-30

申请号：US13884340

申请日：2011-12-07

申请人： Kenichi Saita ,  Shinya Miyamoto ,  Daisuke Yamashita ,  Shinya Suzuki ,  Hirohito Hashimoto

发明人： Kenichi Saita ,  Shinya Miyamoto ,  Daisuke Yamashita ,  Shinya Suzuki ,  Hirohito Hashimoto

IPC分类号： H01L21/02 ,  H05K3/46 ,  H05K1/18 ,  H01L49/02 ,  H05K1/02

CPC分类号： H01L28/40 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K1/186 ,  H05K3/4602 ,  H05K2201/09154 ,  H05K2201/10015

摘要： Embodiments of the present invention provide a component-built-in wiring board capable of preventing a defect, such as a crack, resulting from stress concentration at a corner, when a component is accommodated in a housing portion of a core material with resin filler filled therebetween. The component-built-in wiring board can include a component accommodated in the housing portion of a core material, and a laminate portion in which insulating layers and conductor layers are laminated alternately on the core material. A gap between the housing portion of the core material and the component can be filled with a resin filler. In an inner circumferential portion of the housing portion of the core material a first straight chamfered portion is formed at each corner of a rectangle, and in an outer circumferential portion of the component a second straight chamfered portion is formed at each corner of a rectangle.

摘要翻译： 本发明的实施例提供了一种组件内置线路板，其能够防止当将部件容纳在具有填充树脂填充物的芯材的壳体部分中时由拐角处的应力集中引起的诸如裂纹的缺陷 之间。 构成部件的布线基板可以包括容纳在芯材的壳体部分中的部件和层叠部分，绝缘层和导体层交替地层叠在芯材上。 芯材的壳体部分和部件之间的间隙可以填充树脂填料。 在芯材的壳体部的内周部，在矩形的每个角部形成有第一直角倒角部，在该部件的外周部，在矩形的每个角部形成有第二直角倒角部。

公开(公告)号：US20100084175A1

公开(公告)日：2010-04-08

申请号：US12575504

申请日：2009-10-08

申请人： Shinya SUZUKI ,  Kenichi SAITA ,  Shinya MIYAMOTO ,  Shinji YURI

发明人： Shinya SUZUKI ,  Kenichi SAITA ,  Shinya MIYAMOTO ,  Shinji YURI

IPC分类号： H05K1/16

CPC分类号： H05K1/185 ,  H01L21/4857 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15312 ,  H05K1/0231 ,  H05K1/113 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/068 ,  H05K2201/096 ,  H05K2201/10674 ,  H05K2201/10712 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A component built-in wiring substrate (10) which includes: a core substrate (11); a plate-shaped component (101); a resin filling portion (92); and a wiring stacking portion (31), wherein, when viewed from the core principal surface (12) side, the projected area of the mounting area (32) is larger than the projected area of the plate-shaped component (101) and the resin filling portion, and the plate-shaped component and the resin filling portion are positioned directly below the mounting area (23), and wherein a value of the coefficient of thermal expansion (CTE α2) for a temperature range that is equal to or higher than the glass transition temperature of the resin filling portion is set to be larger than a value of the coefficient of thermal expansion of the plate-shaped component and smaller than a value of the coefficient of thermal expansion of the core substrate for the subject temperature range.

摘要翻译： 一种组件内置布线基板（10），包括：芯基板（11）; 板状部件（101）; 树脂填充部分（92）; 以及布线堆叠部（31），其中，当从所述芯主表面（12）侧观察时，所述安装区域（32）的所述投影面积大于所述板状部件（101）的投影面积，并且 树脂填充部分，并且板状部件和树脂填充部分位于安装区域（23）的正下方，并且其中等于或等于更高的温度范围的热膨胀系数（CTEα2）的值 将树脂填充部的玻璃化转变温度设定为大于板状部件的热膨胀系数的值，并且小于本体温度范围内的芯基板的热膨胀系数的值 。

公开(公告)号：US08183465B2

公开(公告)日：2012-05-22

申请号：US12575504

申请日：2009-10-08

申请人： Shinya Suzuki ,  Kenichi Saita ,  Shinya Miyamoto ,  Shinji Yuri

发明人： Shinya Suzuki ,  Kenichi Saita ,  Shinya Miyamoto ,  Shinji Yuri

IPC分类号： H05K1/16

CPC分类号： H05K1/185 ,  H01L21/4857 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15312 ,  H05K1/0231 ,  H05K1/113 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/068 ,  H05K2201/096 ,  H05K2201/10674 ,  H05K2201/10712 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A component built-in wiring substrate (10) which includes: a core substrate (11); a plate-shaped component (101); a resin filling portion (92); and a wiring stacking portion (31), wherein, when viewed from the core principal surface (12) side, the projected area of the mounting area (32) is larger than the projected area of the plate-shaped component (101) and the resin filling portion, and the plate-shaped component and the resin filling portion are positioned directly below the mounting area (23), and wherein a value of the coefficient of thermal expansion (CTE α2) for a temperature range that is equal to or higher than the glass transition temperature of the resin filling portion is set to be larger than a value of the coefficient of thermal expansion of the plate-shaped component and smaller than a value of the coefficient of thermal expansion of the core substrate for the subject temperature range.

摘要翻译： 一种组件内置布线基板（10），包括：芯基板（11）; 板状部件（101）; 树脂填充部分（92）; 以及布线堆叠部（31），其中，当从所述芯主表面（12）侧观察时，所述安装区域（32）的所述投影面积大于所述板状部件（101）的投影面积，并且 树脂填充部分，并且板状部件和树脂填充部分位于安装区域（23）的正下方，并且其中等于或等于更高的温度范围的热膨胀系数（CTEα2）的值 将树脂填充部的玻璃化转变温度设定为大于板状部件的热膨胀系数的值，并且小于本体温度范围内的芯基板的热膨胀系数的值 。

公开(公告)号：US20100163168A1

公开(公告)日：2010-07-01

申请号：US12647791

申请日：2009-12-28

申请人： Kenichi SAITA ,  Shinji Yuri ,  Shinya Miyamoto ,  Shinya Suzuki

发明人： Kenichi SAITA ,  Shinji Yuri ,  Shinya Miyamoto ,  Shinya Suzuki

IPC分类号： B32B38/10 ,  B32B37/00

CPC分类号： H05K1/185 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/1461 ,  H05K1/0231 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/10674 ,  H05K2201/10712 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method for manufacturing a wiring board includes a core substrate preparation step, a component preparation step, an accommodation step, a resin layer formation step, a fixing step, an insulation layer and a surface modification step. In the accommodation step, a component is held in an accommodation hole of a core substrate. In the resin layer formation step, a gap between an inner wall surface of the accommodation hole and a side surface of the component is filled with a resin layer. In the fixing step, the resin layer is hardened. In the insulation layer formation step, a resin insulation layer is formed on a second major surface and a second component major surface. In the surface modification step, a surface of the resin layer is modified, after the fixing step but before the insulation layer formation step.

摘要翻译： 制造布线板的方法包括芯基板制备步骤，组分制备步骤，调节步骤，树脂层形成步骤，定影步骤，绝缘层和表面改性步骤。 在接合步骤中，将部件保持在芯基板的容纳孔中。 在树脂层形成工序中，将填充孔的内壁面与部件的侧面之间的间隙填充树脂层。 在定影步骤中，树脂层硬化。 在绝缘层形成步骤中，在第二主表面和第二组分主表面上形成树脂绝缘层。 在表面改性工序中，树脂层的表面在固定步骤之后，但在绝缘层形成步骤之前被改变。

公开(公告)号：US20100163172A1

公开(公告)日：2010-07-01

申请号：US12647771

申请日：2009-12-28

申请人： Kenichi Saita ,  Shinji Yuri ,  Shinya Miyamoto ,  Shinya Suzuki

发明人： Kenichi Saita ,  Shinji Yuri ,  Shinya Miyamoto ,  Shinya Suzuki

IPC分类号： B32B38/00

CPC分类号： B32B38/0008 ,  B32B37/02 ,  B32B2457/08 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/1461 ,  H05K1/0231 ,  H05K1/185 ,  H05K3/3436 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/096 ,  H05K2201/10674 ,  H05K2201/10712 ,  H05K2203/0156 ,  H05K2203/0191 ,  H05K2203/095 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method for manufacturing a wiring board includes a core substrate preparation step, a component preparation step, an accommodation step, a resin layer formation step, a fixing step, an insulation layer and a surface activation step. In the accommodation step, a component is held in an accommodation hole of a core substrate. In the resin layer formation step, a gap between an inner wall surface of the accommodation hole and a side surface of the component is filled with a resin layer. In the fixing step, the resin layer is hardened. In the insulation layer formation step, a resin insulation layer is formed on a second major surface and a second component major surface. In the surface activation step, a surface of the resin layer is activated by means of plasma treatment, after the fixing step but before the insulation layer formation step.

摘要翻译： 制造布线板的方法包括芯基板制备步骤，组分制备步骤，调节步骤，树脂层形成步骤，定影步骤，绝缘层和表面活化步骤。 在接合步骤中，将部件保持在芯基板的容纳孔中。 在树脂层形成工序中，将填充孔的内壁面与部件的侧面之间的间隙填充树脂层。 在定影步骤中，树脂层硬化。 在绝缘层形成步骤中，在第二主表面和第二组分主表面上形成树脂绝缘层。 在表面活化步骤中，树脂层的表面通过等离子体处理，在固定步骤之后，但在绝缘层形成步骤之前被激活。

公开(公告)号：US20130285204A1

公开(公告)日：2013-10-31

申请号：US13884340

申请日：2011-12-07

申请人： Kenichi Saita ,  Shinya Miyamoto ,  Daisuke Yamashita ,  Shinya Suzuki ,  Hirohito Hashimoto

发明人： Kenichi Saita ,  Shinya Miyamoto ,  Daisuke Yamashita ,  Shinya Suzuki ,  Hirohito Hashimoto

IPC分类号： H01L49/02

CPC分类号： H01L28/40 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K1/186 ,  H05K3/4602 ,  H05K2201/09154 ,  H05K2201/10015

摘要： Embodiments of the present invention provide a component-built-in wiring board capable of preventing a defect, such as a crack, resulting from stress concentration at a corner, when a component is accommodated in a housing portion of a core material with resin filler filled therebetween. The component-built-in wiring board can include a component accommodated in the housing portion of a core material, and a laminate portion in which insulating layers and conductor layers are laminated alternately on the core material. A gap between the housing portion of the core material and the component can be filled with a resin filler. In an inner circumferential portion of the housing portion of the core material a first straight chamfered portion is formed at each corner of a rectangle, and in an outer circumferential portion of the component a second straight chamfered portion is formed at each corner of a rectangle.

摘要翻译： 本发明的实施例提供了一种组件内置线路板，其能够防止当将部件容纳在具有填充树脂填充物的芯材的壳体部分中时由拐角处的应力集中引起的诸如裂纹的缺陷 之间。 构成部件的布线基板可以包括容纳在芯材的壳体部分中的部件和层叠部分，绝缘层和导体层交替地层叠在芯材上。 芯材的壳体部分和部件之间的间隙可以填充树脂填料。 在芯材的壳体部的内周部，在矩形的每个角部形成有第一直角倒角部，在该部件的外周部，在矩形的每个角部形成有第二直角倒角部。