Semiconductor apparatus
    9.
    发明授权
    Semiconductor apparatus 有权
    半导体装置

    公开(公告)号:US07462928B2

    公开(公告)日:2008-12-09

    申请号:US11270495

    申请日:2005-11-10

    申请人: Kensho Sakano

    发明人: Kensho Sakano

    IPC分类号: H01L23/02

    摘要: A semiconductor apparatus according to the present invention comprises a support member that has a recessed portion, one pair of positive and negative conductive wiring members that are provided on the support member, a semiconductor device that is electrically connected to the conductive wiring members and is disposed in the recessed portion, and a coating member that seals at least the semiconductor device. Side walls of the recessed portion has a first side wall 105 that surrounds the semiconductor device 103, and the second side wall 106 that protrudes from the first side wall. At least a first wall surface 106a in the bottom side of the recessed portion in wall surfaces of the second side wall 106 is coated with a metallic material. Consequently, a highly reliable semiconductor apparatus with improved light-outgoing efficiency is provided.

    摘要翻译: 根据本发明的半导体装置包括:支撑构件,其具有凹部,设置在支撑构件上的一对正负导电布线构件,与导电布线构件电连接的半导体装置, 在凹部中,以及至少密封半导体器件的涂覆部件。 凹部的侧壁具有围绕半导体器件103的第一侧壁105和从第一侧壁突出的第二侧壁106。 在第二侧壁106的壁表面中的凹部的底侧中的至少第一壁表面106a涂覆有金属材料。 因此,提供了具有改善的光输出效率的高度可靠的半导体装置。