公开(公告)号：US09184067B1

公开(公告)日：2015-11-10

申请号：US14039276

申请日：2013-09-27

申请人： KyungHwan Kim ,  DeokKyung Yang ,  SeongHun Mun ,  KeoChang Lee

发明人： KyungHwan Kim ,  DeokKyung Yang ,  SeongHun Mun ,  KeoChang Lee

IPC分类号： H01L21/56

CPC分类号： H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

摘要： Semiconductor packages with multiple substrates can incorporate apertures or slots between devices to minimize or reduce formation of defects during a molding process. The apertures or slots can be formed adjacent a top substrate in alignment with removable regions adjacent a bottom substrate whereby the apertures or slots can facilitate outflow of materials from cavities between the substrates. The apertures or slots may subsequently be removed in conjunction with the removable regions during a singulation process thereby producing the desired semiconductor packages with improved device reliability and yield.

摘要翻译： 具有多个基板的半导体封装可以在器件之间引入孔或槽，以在模制过程中最小化或减少缺陷的形成。 孔或槽可以与顶部衬底相邻地形成，与邻近底部衬底的可移除区域对齐，由此孔或槽可以有助于材料从衬底之间的空腔流出。 随后可以在切割过程期间结合可去除区域去除孔或槽，由此产生期望的半导体封装，具有改进的器件可靠性和产量。

公开(公告)号：US20160190054A1

公开(公告)日：2016-06-30

申请号：US14792447

申请日：2015-07-06

申请人： SooSan Park ,  KyuSang Kim ,  YeoChan Ko ,  KeoChang Lee ,  HeeJo Chi ,  HeeSoo Lee

发明人： SooSan Park ,  KyuSang Kim ,  YeoChan Ko ,  KeoChang Lee ,  HeeJo Chi ,  HeeSoo Lee

IPC分类号： H01L23/498 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00 ,  H01L23/538

CPC分类号： H01L23/49833 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/4828 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83104 ,  H01L2224/92 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15331 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/05442 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A system and method of manufacture of an integrated circuit packaging system includes: a base substrate, the base substrate includes a base terminal; an integrated circuit device on the base substrate; a bottom conductive joint on the base terminal; a conductive ball on the bottom conductive joint, the conductive ball includes a core body; and an interposer over the conductive ball.

摘要翻译： 一种集成电路封装系统的制造方法和制造方法，其特征在于，包括：基底基板，所述基底基板包括基底; 在基底基板上的集成电路器件; 基端子上的底部导电接头; 底部导电接头上的导电球，导电球包括芯体; 以及导电球上的插入件。

公开(公告)号：US09076802B1

公开(公告)日：2015-07-07

申请号：US14037320

申请日：2013-09-25

申请人： WonJun Ko ,  GwangTae Kim ,  KeoChang Lee

发明人： WonJun Ko ,  GwangTae Kim ,  KeoChang Lee

IPC分类号： H01L23/28 ,  H01L21/00 ,  H01L21/56

CPC分类号： H01L21/56 ,  H01L21/565 ,  H01L23/3121 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00

摘要： Simultaneous semiconductor packages can be produced using a dual-sided film-assist molding process. The process involves using a film or membrane having opposing surfaces for receiving un-encapsulated semiconductor packages on both surfaces. A slot can be formed in the film or membrane to facilitate introduction and passage of the encapsulation therethrough such that upon removal of the film or membrane, increased throughput and productivity of the completed semiconductor packages can be carried out to achieve considerable cost savings.

摘要翻译： 可以使用双面胶片辅助成型工艺制造同时半导体封装。 该方法涉及使用具有相对表面的膜或膜来在两个表面上接收未封装的半导体封装。 可以在膜或膜中形成狭槽以便于通过其中的封装的引入和通过，使得在去除膜或膜时，可以进行完成的半导体封装的增加的生产率和生产率以实现显着的成本节约。