公开(公告)号：US09076802B1

公开(公告)日：2015-07-07

申请号：US14037320

申请日：2013-09-25

申请人： WonJun Ko ,  GwangTae Kim ,  KeoChang Lee

发明人： WonJun Ko ,  GwangTae Kim ,  KeoChang Lee

IPC分类号： H01L23/28 ,  H01L21/00 ,  H01L21/56

CPC分类号： H01L21/56 ,  H01L21/565 ,  H01L23/3121 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00

摘要： Simultaneous semiconductor packages can be produced using a dual-sided film-assist molding process. The process involves using a film or membrane having opposing surfaces for receiving un-encapsulated semiconductor packages on both surfaces. A slot can be formed in the film or membrane to facilitate introduction and passage of the encapsulation therethrough such that upon removal of the film or membrane, increased throughput and productivity of the completed semiconductor packages can be carried out to achieve considerable cost savings.

摘要翻译： 可以使用双面胶片辅助成型工艺制造同时半导体封装。 该方法涉及使用具有相对表面的膜或膜来在两个表面上接收未封装的半导体封装。 可以在膜或膜中形成狭槽以便于通过其中的封装的引入和通过，使得在去除膜或膜时，可以进行完成的半导体封装的增加的生产率和生产率以实现显着的成本节约。

公开(公告)号：US20110266656A1

公开(公告)日：2011-11-03

申请号：US12771833

申请日：2010-04-30

申请人： JaEun Yun ,  HunTeak Lee ,  SeungYong Chai ,  WonJun Ko

发明人： JaEun Yun ,  HunTeak Lee ,  SeungYong Chai ,  WonJun Ko

IPC分类号： H01L21/78 ,  H01L21/56 ,  H01L23/544

CPC分类号： H01L23/544 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6836 ,  H01L23/3114 ,  H01L23/3121 ,  H01L24/02 ,  H01L24/11 ,  H01L24/16 ,  H01L24/32 ,  H01L25/0655 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/02317 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05548 ,  H01L2224/05611 ,  H01L2224/05616 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1416 ,  H01L2224/16225 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/4805 ,  H01L2224/48091 ,  H01L2224/481 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/01014 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/11

摘要： A semiconductor device has a build-up interconnect structure formed over an active surface of a semiconductor wafer containing a plurality of semiconductor die separated by a saw street. An insulating layer is formed over the interconnect structure. Bumps are formed over the interconnect structure. A protective coating material is deposited over the insulating layer and saw street. A lamination tape is applied over the coating material. A portion of a back surface of the semiconductor wafer is removed. A mounting tape is applied over the back surface. The lamination tape is removed while leaving the coating material over the insulating layer and saw street. A first channel is formed through the saw street extending partially through the semiconductor wafer. The coating material is removed after forming the first channel. A second channel is formed through the saw street and the mounting tape is removed to singulate the semiconductor wafer.

摘要翻译： 半导体器件具有形成在半导体晶片的有源表面上的积聚互连结构，该半导体晶片包含由锯街隔开的多个半导体管芯。 在互连结构上形成绝缘层。 在互连结构上形成凸起。 保护涂层材料沉积在绝缘层和锯条之上。 层压胶带涂在涂料上。 去除半导体晶片的背面的一部分。 安装带应用在背面上。 除去层压带，同时将涂层材料留在绝缘层和锯条上。 通过部分穿过半导体晶片延伸的锯条形成第一通道。 在形成第一通道之后去除涂层材料。 通过锯道形成第二通道，并且去除安装带以划分半导体晶片。

公开(公告)号：US10163744B2

公开(公告)日：2018-12-25

申请号：US13226767

申请日：2011-09-07

申请人： OhHan Kim ,  WonJun Ko ,  DaeSik Choi

发明人： OhHan Kim ,  WonJun Ko ,  DaeSik Choi

IPC分类号： H01L23/14 ,  H01L23/00 ,  H01L25/065 ,  H01L23/495 ,  H01L21/56 ,  H01L23/552 ,  H01L23/31 ,  H01L25/10 ,  H01L23/13 ,  H01L23/367 ,  H01L23/36 ,  H01L23/498

摘要： A semiconductor device has a substrate including a recess and a peripheral portion with through conductive vias. A first semiconductor die is mounted over the substrate and within the recess. A planar heat spreader is mounted over the substrate and over the first semiconductor die. The planar heat spreader has openings around a center portion of the planar heat spreader and aligned over the peripheral portion of the substrate. A second semiconductor die is mounted over the center portion of the planar heat spreader. A third semiconductor die is mounted over the second semiconductor die. First and second pluralities of bond wires extend from the second and third semiconductor die, respectively, through the openings in the planar heat spreader to electrically connect to the through conductive vias. An encapsulant is deposited over the substrate and around the planar heat spreader.

公开(公告)号：US08618653B2

公开(公告)日：2013-12-31

申请号：US12022296

申请日：2008-01-30

申请人： WonJun Ko ,  Taeg Ki Lim ,  Sungmin Song

发明人： WonJun Ko ,  Taeg Ki Lim ,  Sungmin Song

IPC分类号： H01L23/10 ,  H01L21/44

CPC分类号： H01L23/4334 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： An integrated circuit package system includes: providing a singulated, layered structure equivalent in size to an integrated circuit die and having an adhesive layer, an electrical insulator layer, and a heat slug; attaching the integrated circuit die to a base; attaching bond wires to a top of the base for electrical connection between the integrated circuit die and the base; attaching the singulated, layered structure to the integrated circuit die wherein the bond wires are surrounded by the adhesive layer; and encapsulating the integrated circuit die and a portion of the heat slug with a molding compound.

摘要翻译： 集成电路封装系统包括：提供尺寸相当于集成电路管芯并具有粘合剂层，电绝缘层和散热片的单个分层结构; 将集成电路管芯连接到基座上; 将接合线附接到基座的顶部以在集成电路管芯和基座之间进行电连接; 将所述单分层结构连接到所述集成电路管芯，其中所述接合线被所述粘合剂层包围; 并用模塑料封装集成电路管芯和一部分热段。

公开(公告)号：US08536718B2

公开(公告)日：2013-09-17

申请号：US12822405

申请日：2010-06-24

申请人： WonJun Ko ,  Oh Han Kim

发明人： WonJun Ko ,  Oh Han Kim

IPC分类号： H01L23/31

CPC分类号： H01L21/563 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a substrate with a material layer including grooves in a fillet region that are substantially parallel and adjacent an integrated circuit; and forming a resin between the substrate and the integrated circuit that contacts a trench trace exposed by the grooves.

摘要翻译： 一种制造集成电路封装系统的方法，包括：向基片提供材料层，该材料层包括基本上平行并邻近集成电路的圆角区域中的凹槽; 以及在所述基板和所述集成电路之间形成树脂，所述树脂与所述凹槽暴露的沟槽迹线接触。

公开(公告)号：US20120146246A1

公开(公告)日：2012-06-14

申请号：US12964577

申请日：2010-12-09

申请人： WonJun Ko ,  DeokKyung Yang ,  Yeongbeom Ko

发明人： WonJun Ko ,  DeokKyung Yang ,  Yeongbeom Ko

IPC分类号： H01L23/12 ,  H01L21/52

CPC分类号： H01L21/563 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15192 ,  H01L2924/00

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package substrate having an outer pad at a substrate top side; forming a resist layer directly on the substrate top side, the resist layer having a resist top side with a channel array adjacent the outer pad exposed from the resist layer; mounting an integrated circuit having an active side facing the resist top side, the integrated circuit having a non-horizontal side adjacent the outer pad; and forming a dielectric between the active side and the resist top side, the dielectric having a fillet extended from the non-horizontal side to the substrate top side inside an inner extent of the channel array.

摘要翻译： 一种集成电路封装系统的制造方法，包括：在基板顶侧提供具有外焊盘的封装基板; 在基板顶侧直接形成抗蚀剂层，抗蚀剂层具有邻近从抗蚀剂层暴露的外焊盘的沟道阵列的抗蚀剂顶侧; 安装具有面向抗蚀剂顶侧的有效侧的集成电路，所述集成电路具有与所述外部焊盘相邻的非水平侧; 并且在活性侧和抗蚀剂顶侧之间形成电介质，电介质具有在通道阵列的内部范围内从非水平侧延伸到衬底顶侧的圆角。

公开(公告)号：US20100244236A1

公开(公告)日：2010-09-30

申请号：US12412315

申请日：2009-03-26

申请人： JaEun Yun ,  Jong Wook Ju ,  WonJun Ko ,  Hye Ran Lee

发明人： JaEun Yun ,  Jong Wook Ju ,  WonJun Ko ,  Hye Ran Lee

IPC分类号： H01L23/34 ,  H01L21/50

CPC分类号： H01L23/3733 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/3025 ,  H01L2224/0401

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package substrate; mounting an integrated circuit die on the package substrate; and attaching a heat spreader assembly, having a thermal adhesive layer formed therein, to the package substrate and the integrated circuit die.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供封装基板; 将集成电路管芯安装在封装衬底上; 以及将其中形成有热粘合剂层的散热器组件附接到封装基板和集成电路管芯。

公开(公告)号：US20090155961A1

公开(公告)日：2009-06-18

申请号：US11957845

申请日：2007-12-17

申请人： WonJun Ko ,  Jong Wook Ju ,  SeungYong Chai ,  Taeg Ki Lim ,  Ja Eun Yun

发明人： WonJun Ko ,  Jong Wook Ju ,  SeungYong Chai ,  Taeg Ki Lim ,  Ja Eun Yun

IPC分类号： H01L21/56 ,  H01L23/495

CPC分类号： H01L23/3121 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06568 ,  H01L2225/06575 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system comprising: providing a base substrate; attaching a base integrated circuit die over the base substrate; forming a support over the base substrate near only one edge of the base substrate; and attaching a stack substrate over the support and the base integrated circuit die.

摘要翻译： 一种集成电路封装系统，包括：提供基底基板; 将基底集成电路芯片附接到基底基板上; 在基底基板的仅一个边缘附近在基底基板上形成支撑件; 以及将堆叠衬底附接在所述支撑件和所述基底集成电路管芯上。

公开(公告)号：US09252032B2

公开(公告)日：2016-02-02

申请号：US13566872

申请日：2012-08-03

申请人： DaeSik Choi ,  WonJun Ko ,  JaEun Yun

发明人： DaeSik Choi ,  WonJun Ko ,  JaEun Yun

IPC分类号： H01L23/52 ,  H01L21/56 ,  H01L25/065 ,  H01L25/10 ,  H01L25/00 ,  H01L25/16 ,  H01L23/00 ,  H01L21/683

CPC分类号： H01L21/565 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6836 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/20 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2224/02371 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/06182 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/221 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73209 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/81005 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2225/1035 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1088 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/1434 ,  H01L2924/14364 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor wafer contains a plurality of first semiconductor die. The semiconductor wafer is mounted to a carrier. A channel is formed through the semiconductor wafer to separate the first semiconductor die. A second semiconductor die is mounted to the first semiconductor die. An encapsulant is deposited over the carrier and first semiconductor die and into the channel while a side portion and surface portion of the second semiconductor die remain exposed from the encapsulant. A first conductive via is formed through the encapsulant in the channel. A second conductive via is formed through the encapsulant over a contact pad of the first semiconductor die. A conductive layer is formed over the encapsulant between the first and second conductive vias. An insulating layer is formed over the conductive layer and encapsulant. The carrier is removed. An interconnect structure is formed over the first conductive via.

摘要翻译： 半导体晶片包含多个第一半导体管芯。 半导体晶片安装在载体上。 通过半导体晶片形成通道以分离第一半导体管芯。 第二半导体管芯安装到第一半导体管芯。 密封剂沉积在载体和第一半导体管芯上并进入沟道，同时第二半导体管芯的侧部和表面部分保持暴露于密封剂。 通过通道中的密封剂形成第一导电通孔。 第二导电通孔在第一半导体管芯的接触焊盘上穿过密封剂形成。 在第一和第二导电通孔之间的密封剂之上形成导电层。 在导电层和密封剂之上形成绝缘层。 载体被移除。 互连结构形成在第一导电通孔上。

公开(公告)号：US08609463B2

公开(公告)日：2013-12-17

申请号：US11687357

申请日：2007-03-16

申请人： WonJun Ko ,  SeungYun Ahn ,  DongSoo Moon

发明人： WonJun Ko ,  SeungYun Ahn ,  DongSoo Moon

IPC分类号： H01L25/065 ,  H01L25/18

CPC分类号： H01L25/18 ,  H01L23/3128 ,  H01L23/552 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system that includes: providing a first package including a first package first device and a first package second device both adjacent a first package substrate; and mounting and electrically interconnecting a second package over an electrical interconnect array formed on a substrate of the first package second device.

摘要翻译： 一种集成电路封装系统，包括：提供包括第一封装第一器件的第一封装和与第一封装衬底相邻的第一封装第二器件; 以及在形成在所述第一封装第二器件的衬底上的电互连阵列上安装和互连第二封装。