METHOD FOR FORMING DIODE IN PHASE CHANGE RANDOM ACCESS MEMORY DEVICE
    2.
    发明申请
    METHOD FOR FORMING DIODE IN PHASE CHANGE RANDOM ACCESS MEMORY DEVICE 审中-公开
    在相位变化随机访问存储器件中形成二极管的方法

    公开(公告)号:US20100099243A1

    公开(公告)日:2010-04-22

    申请号:US12493263

    申请日:2009-06-29

    IPC分类号: H01L21/265

    摘要: A method for forming a diode of a phase change random access memory device includes preparing a semiconductor substrate having a dopant area formed thereon. An insulating layer on the semiconductor substrate is formed and a contact hole is formed by etching a part of the insulating layer such that a specific region of the dopant area is exposed. A silicon layer doped with a first-type dopant is formed in the contact hole. A part of the silicon layer is doped with a second-type dopant source gas through a gas cluster ion beam process.

    摘要翻译: 一种形成相变随机存取存储器件的二极管的方法包括制备其上形成有掺杂区的半导体衬底。 形成半导体衬底上的绝缘层,并通过蚀刻绝缘层的一部分使得暴露出掺杂剂区域的特定区域而形成接触孔。 在接触孔中形成掺杂有第一种掺杂剂的硅层。 硅层的一部分通过气体簇离子束工艺掺杂有第二类型的掺杂剂源气体。

    METHOD OF FABRICATING NON-VOLATILE MEMORY DEVICE
    3.
    发明申请
    METHOD OF FABRICATING NON-VOLATILE MEMORY DEVICE 有权
    制造非易失性存储器件的方法

    公开(公告)号:US20100062581A1

    公开(公告)日:2010-03-11

    申请号:US12432187

    申请日:2009-04-29

    IPC分类号: H01L21/336 H01L21/762

    CPC分类号: H01L27/11519 H01L27/11521

    摘要: Provided is a method of fabricating a non-volatile semiconductor device. The method includes: forming a first hard mask layer over a substrate; etching the first hard mask layer and the substrate to form a plurality of isolation trenches extending in parallel to one another in a first direction; burying a dielectric layer in the isolation trenches to form a isolation layer; forming a plurality of floating gate mask patterns extending in parallel to one another in a second direction intersecting with the first direction over a resulting structure where the isolation layer is formed; etching the first hard mask layer by using the floating gate mask patterns as an etch barrier to form a plurality of island-shaped floating gate electrode trenches; and burying a conductive layer in the floating gate electrode trenches to form a plurality of island-shaped floating gate electrodes.

    摘要翻译: 提供了制造非易失性半导体器件的方法。 该方法包括:在衬底上形成第一硬掩模层; 蚀刻第一硬掩模层和衬底以形成在第一方向上彼此平行延伸的多个隔离沟槽; 在隔离沟槽中埋置介电层以形成隔离层; 在形成所述隔离层的结果上形成在与所述第一方向相交的第二方向上彼此平行延伸的多个浮置栅极掩模图案; 通过使用浮栅掩模图案作为蚀刻势垒来蚀刻第一硬掩模层,以形成多个岛状浮栅电极沟槽; 并在所述浮栅电极沟槽中埋设导电层以形成多个岛状浮栅。

    CAPACITOR AND METHOD FOR FABRICATING THE SAME
    4.
    发明申请
    CAPACITOR AND METHOD FOR FABRICATING THE SAME 有权
    电容器及其制造方法

    公开(公告)号:US20100014212A1

    公开(公告)日:2010-01-21

    申请号:US12569769

    申请日:2009-09-29

    IPC分类号: H01G4/10 B32B37/14 B05D5/12

    摘要: A capacitor includes a lower electrode, a dielectric structure over the lower electrode, the dielectric structure including at least one crystallized zirconium oxide ZrO2) layer and at least one amorphous aluminum oxide (Al2O3) layer, and an upper electrode formed over the dielectric structure. A method for fabricating a capacitor includes forming a lower electrode over a certain structure, forming a dielectric structure including at least one crystallized zirconium oxide (ZrO2) layer and at least one amorphous aluminum oxide (Al2O3) layer over the lower electrode, and forming an upper electrode over the dielectric structure.

    摘要翻译: 电容器包括下电极,下电极上的电介质结构,包括至少一个结晶的氧化锆ZrO 2的电介质结构)层和至少一个非晶形氧化铝(Al 2 O 3)层,以及形成在电介质结构上的上电极。 一种制造电容器的方法包括在一定结构上形成下电极,在下电极上形成包括至少一个结晶氧化锆(ZrO 2)层和至少一个非晶形氧化铝(Al 2 O 3)层的电介质结构, 介电结构上的上电极。

    Semiconductor device with dielectric structure and method for fabricating the same
    6.
    发明授权
    Semiconductor device with dielectric structure and method for fabricating the same 失效
    具有介电结构的半导体器件及其制造方法

    公开(公告)号:US07501320B2

    公开(公告)日:2009-03-10

    申请号:US11285161

    申请日:2005-11-23

    IPC分类号: H01L21/8234 H01L21/8242

    摘要: A semiconductor device with a dielectric structure and a method for fabricating the same are provided. A capacitor in the semiconductor device includes: a bottom electrode formed on a substrate; a first dielectric layer made of titanium dioxide (TiO2) in rutile phase and formed on the bottom electrode; and an upper electrode formed on the first dielectric layer.

    摘要翻译: 提供具有介电结构的半导体器件及其制造方法。 半导体器件中的电容器包括:形成在基板上的底部电极; 由金红石相中的二氧化钛(TiO 2)形成的第一电介质层,并形成在底部电极上; 以及形成在所述第一介电层上的上电极。

    METHOD OF FABRICATING NON-VOLATILE MEMORY DEVICE HAVING CHARGE TRAPPING LAYER
    7.
    发明申请
    METHOD OF FABRICATING NON-VOLATILE MEMORY DEVICE HAVING CHARGE TRAPPING LAYER 失效
    制造具有电荷捕获层的非易失性存储器件的方法

    公开(公告)号:US20090004802A1

    公开(公告)日:2009-01-01

    申请号:US11966231

    申请日:2007-12-28

    IPC分类号: H01L21/336

    摘要: A method of fabricating a non-volatile memory device having a charge trapping layer includes forming a tunneling layer, a charge trapping layer, a blocking layer and a control gate electrode layer over a substrate, forming a mask layer pattern on the control gate electrode layer, performing an etching process using the mask layer pattern as an etching mask to remove an exposed portion of the control gate electrode layer, wherein the etching process is performed as excessive etching to remove the charge trapping layer by a specified thickness, forming an insulating layer for blocking charges from moving on the control gate electrode layer and the mask layer pattern, performing anisotropic etching on the insulating layer to form an insulating layer pattern on a sidewall of the control gate electrode layer and a partial upper sidewall of the blocking layer, and performing an etching process on the blocking layer exposed by the anisotropic etching, wherein the etching process is performed as excessive etching to remove the charge trapping layer by a specified thickness.

    摘要翻译: 一种制造具有电荷捕获层的非易失性存储器件的方法包括在衬底上形成隧道层,电荷俘获层,阻挡层和控制栅电极层,在控制栅电极层上形成掩模层图案 使用掩模层图案作为蚀刻掩模进行蚀刻处理以去除控制栅电极层的暴露部分,其中蚀刻工艺作为过度蚀刻进行,以将电荷捕获层除去指定厚度,形成绝缘层 用于阻止电荷在控制栅电极层和掩模层图案上移动,对绝缘层进行各向异性蚀刻,以在控制栅电极层的侧壁和阻挡层的一部分上侧壁上形成绝缘层图案,以及 对通过各向异性蚀刻暴露的阻挡层进行蚀刻处理,其中执行蚀刻处理 作为过量蚀刻以将电荷捕获层除去指定的厚度。

    Method for fabricating capacitor in semiconductor device
    8.
    发明授权
    Method for fabricating capacitor in semiconductor device 有权
    在半导体器件中制造电容器的方法

    公开(公告)号:US07361544B2

    公开(公告)日:2008-04-22

    申请号:US11448797

    申请日:2006-06-08

    IPC分类号: H01L21/8242

    摘要: A method for fabricating a capacitor in a semiconductor device is provided. The method includes forming an insulation layer over a substrate; flushing a metal source onto the insulation layer to change a characteristic of a surface of the insulation layer to improve adherence of a metal-based material to the surface of the insulation layer; forming a storage node comprising the metal-based material over the flushed insulation layer; and sequentially forming a dielectric layer and a plate electrode over the metal-based storage node.

    摘要翻译: 提供了一种在半导体器件中制造电容器的方法。 该方法包括在衬底上形成绝缘层; 将金属源冲洗到绝缘层上以改变绝缘层的表面的特性,以改善金属基材料对绝缘层表面的粘附性; 在所述冲洗绝缘层上形成包括所述金属基材料的存储节点; 并且在金属基存储节点上依次形成电介质层和平板电极。

    Capacitor and method for fabricating the same
    9.
    发明申请
    Capacitor and method for fabricating the same 有权
    电容器及其制造方法

    公开(公告)号:US20070102742A1

    公开(公告)日:2007-05-10

    申请号:US11595548

    申请日:2006-11-10

    IPC分类号: H01L29/94

    摘要: A capacitor includes a lower electrode, a dielectric structure over the lower electrode, the dielectric structure including at least one crystallized zirconium oxide (ZrO2) layer and at least one amorphous aluminum oxide (Al2O3) layer, and an upper electrode formed over the dielectric structure. A method for fabricating a capacitor includes forming a lower electrode over a certain structure, forming a dielectric structure including at least one crystallized zirconium oxide (ZrO2) layer and at least one amorphous aluminum oxide (Al2O3) layer over the lower electrode, and forming an upper electrode over the dielectric structure.

    摘要翻译: 电容器包括下电极,在下电极上的电介质结构,所述电介质结构包括至少一个结晶的氧化锆(ZrO 2 O 2)层和至少一种无定形氧化铝(Al 2 在上述电介质结构上形成上层电极。 制造电容器的方法包括在特定结构上形成下电极,形成包括至少一种结晶的氧化锆(ZrO 2 O 2)层和至少一种无定形氧化铝(Al

    Semiconductor device with dielectric structure and method for fabricating the same
    10.
    发明申请
    Semiconductor device with dielectric structure and method for fabricating the same 失效
    具有介电结构的半导体器件及其制造方法

    公开(公告)号:US20070048929A1

    公开(公告)日:2007-03-01

    申请号:US11285161

    申请日:2005-11-23

    IPC分类号: H01L21/8244

    摘要: A semiconductor device with a dielectric structure and a method for fabricating the same are provided. A capacitor in the semiconductor device includes: a bottom electrode formed on a substrate; a first dielectric layer made of titanium dioxide (TiO2) in rutile phase and formed on the bottom electrode; and an upper electrode formed on the first dielectric layer.

    摘要翻译: 提供具有介电结构的半导体器件及其制造方法。 半导体器件中的电容器包括:形成在基板上的底部电极; 由金红石相中的二氧化钛(TiO 2)构成的第一电介质层,并形成在底部电极上; 以及形成在所述第一介电层上的上电极。