公开(公告)号：US20110266671A1

公开(公告)日：2011-11-03

申请号：US12949267

申请日：2010-11-18

申请人： Kwang Seop Youm ,  Young Hwan Shin ,  Kyoung Ro Yoon ,  Sang Duck Kim ,  Kyo Min Jung ,  Bong Hie Jung

发明人： Kwang Seop Youm ,  Young Hwan Shin ,  Kyoung Ro Yoon ,  Sang Duck Kim ,  Kyo Min Jung ,  Bong Hie Jung

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L23/49827 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/49883 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/3478 ,  H05K3/421 ,  H05K2201/09563 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein are a substrate for a semiconductor package and a manufacturing method thereof. The substrate for the semiconductor package, which has a single-sided substrate structure including circuit patterns having a connection pad formed on only an electronic component mounting surface, can directly connect a connection pad on the top of the substrate to external connection terminals on the bottom of the substrate through a connection via formed of a metal plating layer formed in an inner wall of the via hole and a conductive metal paste filled in the via hole.

摘要翻译： 本发明公开了一种半导体封装用基板及其制造方法。 具有包括仅形成在电子部件安装面上的连接焊盘的电路图案的单面基板结构的半导体封装用基板能够将基板顶部的连接焊盘与底部的外部连接端子直接连接 通过由形成在通孔的内壁中的金属镀层形成的连接通孔和填充在通孔中的导电金属浆料构成。

公开(公告)号：US08253032B2

公开(公告)日：2012-08-28

申请号：US12761828

申请日：2010-04-16

申请人： Ki-Gon Kim ,  Kwang-Seop Youm ,  Hyoung-Won Kang

发明人： Ki-Gon Kim ,  Kwang-Seop Youm ,  Hyoung-Won Kang

IPC分类号： H05K1/11

CPC分类号： H05K3/242 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/09263 ,  H05K2203/175 ,  H01L2924/00

摘要： A printed circuit board strip and a printed circuit board panel are disclosed. In accordance with an embodiment of the present invention, the printed circuit board strip includes an unit area, a plating lead-in wire, which is for plating the unit area, and a mold gate, which is disposed on an outer side of the unit area. Here, the plating lead-in wire and the mold gate are electrically connected to each other through a lead line having a shape that is bent plural times. This can significantly save the production cost by preventing an excessive plated layer from being formed in an unnecessary area.

摘要翻译： 公开了印刷电路板条和印刷电路板面板。 根据本发明的实施例，印刷电路板条包括单元区域，用于电镀单元区域的电镀引入线，以及设置在单元的外侧上的模具门 区。 这里，电镀引入线和模具栅极通过多次弯曲形状的引线彼此电连接。 这可以通过防止在不必要的区域中形成过量的镀层来显着地节省生产成本。

公开(公告)号：US20100288535A1

公开(公告)日：2010-11-18

申请号：US12546502

申请日：2009-08-24

申请人： Suk Chang HONG ,  Kwang Seop Youm ,  Bong Kyu Choi

发明人： Suk Chang HONG ,  Kwang Seop Youm ,  Bong Kyu Choi

IPC分类号： H05K1/02 ,  H05K3/30

CPC分类号： H05K1/0203 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H05K1/0207 ,  H05K1/111 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/1028 ,  H05K2201/10439 ,  H05K2201/10674 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2224/05599

摘要： Disclosed herein is an electronic component-embedded printed circuit board, in which a cooling member connecting with an inner circuit layer of a printed circuit board is provided on one side of an electronic component, so that the heat radiation performance thereof can be improved and the thickness thereof can be decreased, and a method of manufacturing the same.

摘要翻译： 这里公开了一种电子部件嵌入式印刷电路板，其中在电子部件的一侧设置有与印刷电路板的内部电路层连接的冷却部件，从而能够提高其散热性能， 其厚度可以减小，及其制造方法。

公开(公告)号：US20120103671A1

公开(公告)日：2012-05-03

申请号：US13007474

申请日：2011-01-14

申请人： Eung Suek LEE ,  Kwang Seop YOUM ,  Keung Jin SOHN ,  Mi Sun HWANG

发明人： Eung Suek LEE ,  Kwang Seop YOUM ,  Keung Jin SOHN ,  Mi Sun HWANG

IPC分类号： H05K1/18 ,  H05K1/11 ,  H05K3/00 ,  H05K1/00

CPC分类号： H05K3/4069 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K2203/1461 ,  Y10T29/49124

摘要： Disclosed herein are a printed circuit board and a method for manufacturing the same capable of implementing a slim and small semiconductor package by the printed circuit board configured to include a circuit layer and an insulating layer as a single layer and shortening a process time and reducing processing costs by forming a bump using a screen printing method. Further, disclosed herein is a method for manufacturing a printed circuit board capable of improving a warpage problem of the printed circuit board that occurs during a polishing process by adopting a coining process instead of a polishing process.

摘要翻译： 这里公开了一种印刷电路板及其制造方法，该印刷电路板及其制造方法能够通过印刷电路板实现薄型和小型半导体封装，该印刷电路板被配置为包括电路层和绝缘层作为单层并缩短处理时间并减少处理 通过使用丝网印刷法形成凹凸的成本。 此外，本文公开了一种制造印刷电路板的方法，其能够通过采用压印处理而不是抛光工艺来改善在抛光过程中发生的印刷电路板的翘曲问题。

公开(公告)号：US20110048784A1

公开(公告)日：2011-03-03

申请号：US12761828

申请日：2010-04-16

申请人： Ki-Gon KIM ,  Kwang-Seop Youm ,  Hyoung-Won Kang

发明人： Ki-Gon KIM ,  Kwang-Seop Youm ,  Hyoung-Won Kang

IPC分类号： H05K1/11

CPC分类号： H05K3/242 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/09263 ,  H05K2203/175 ,  H01L2924/00

摘要： A printed circuit board strip and a printed circuit board panel are disclosed. In accordance with an embodiment of the present invention, the printed circuit board strip includes an unit area, a plating lead-in wire, which is for plating the unit area, and a mold gate, which is disposed on an outer side of the unit area. Here, the plating lead-in wire and the mold gate are electrically connected to each other through a lead line having a shape that is bent plural times. This can significantly save the production cost by preventing an excessive plated layer from being formed in an unnecessary area.

摘要翻译： 公开了印刷电路板条和印刷电路板面板。 根据本发明的实施例，印刷电路板条包括单元区域，用于电镀单元区域的电镀引入线，以及设置在该单元的外侧上的模具门 区。 这里，电镀引入线和模具栅极通过多次弯曲形状的引线彼此电连接。 这可以通过防止在不必要的区域中形成过量的镀层来显着地节省生产成本。

公开(公告)号：US20070241438A1

公开(公告)日：2007-10-18

申请号：US11783874

申请日：2007-04-12

申请人： Tae Hyeog Kang ,  Kwang Seop Youm ,  Kyu Hyun Shim ,  Bong Kyu Choi ,  Kyu Il Hwang ,  Won Hee Kim

发明人： Tae Hyeog Kang ,  Kwang Seop Youm ,  Kyu Hyun Shim ,  Bong Kyu Choi ,  Kyu Il Hwang ,  Won Hee Kim

IPC分类号： H01L23/02

CPC分类号： H01L23/49838 ,  H01L23/13 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed herein is a strip format of a semiconductor package board and an array thereof, in which a dummy area of the strip format of the semiconductor package board is formed into a predetermined shape such that, when several strip formats of semiconductor package boards are arranged on a panel, the number of strip formats of semiconductor package boards arranged on the panel can be increased.

摘要翻译： 这里公开了一种半导体封装板及其阵列的条形格式，其中半导体封装板的条形格式的虚拟区域形成为预定形状，使得当半导体封装板的多个条形格式布置在 可以增加布置在面板上的半导体封装板的条形格式的数量。