公开(公告)号：US20120103671A1

公开(公告)日：2012-05-03

申请号：US13007474

申请日：2011-01-14

申请人： Eung Suek LEE ,  Kwang Seop YOUM ,  Keung Jin SOHN ,  Mi Sun HWANG

发明人： Eung Suek LEE ,  Kwang Seop YOUM ,  Keung Jin SOHN ,  Mi Sun HWANG

IPC分类号： H05K1/18 ,  H05K1/11 ,  H05K3/00 ,  H05K1/00

CPC分类号： H05K3/4069 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K2203/1461 ,  Y10T29/49124

摘要： Disclosed herein are a printed circuit board and a method for manufacturing the same capable of implementing a slim and small semiconductor package by the printed circuit board configured to include a circuit layer and an insulating layer as a single layer and shortening a process time and reducing processing costs by forming a bump using a screen printing method. Further, disclosed herein is a method for manufacturing a printed circuit board capable of improving a warpage problem of the printed circuit board that occurs during a polishing process by adopting a coining process instead of a polishing process.

摘要翻译： 这里公开了一种印刷电路板及其制造方法，该印刷电路板及其制造方法能够通过印刷电路板实现薄型和小型半导体封装，该印刷电路板被配置为包括电路层和绝缘层作为单层并缩短处理时间并减少处理 通过使用丝网印刷法形成凹凸的成本。 此外，本文公开了一种制造印刷电路板的方法，其能够通过采用压印处理而不是抛光工艺来改善在抛光过程中发生的印刷电路板的翘曲问题。

公开(公告)号：US20120088334A1

公开(公告)日：2012-04-12

申请号：US13007444

申请日：2011-01-14

申请人： Mi Sun HWANG ,  Keung Jin SOHN ,  Eung Suek LEE ,  Myung Sam KANG

发明人： Mi Sun HWANG ,  Keung Jin SOHN ,  Eung Suek LEE ,  Myung Sam KANG

IPC分类号： H01L21/60

CPC分类号： H01L23/49827 ,  H01L21/486 ,  H01L23/49816 ,  H01L23/49894 ,  H01L24/16 ,  H01L24/48 ,  H01L24/81 ,  H01L2224/16237 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/81192 ,  H01L2224/81385 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/15311 ,  H05K3/06 ,  H05K3/4038 ,  H05K3/4647 ,  H05K2203/0384 ,  H01L2924/00015 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein is a method for manufacturing a semiconductor package which uses a base member 120 in which a first metal layer 113, a barrier layer 115, and a second metal layer 117 are stacked on both surface thereof in sequence based on an adhesive member 111 to simultaneously manufacture two printed circuit boards through a single sheet process, thereby making it possible to improve manufacturing efficiency; electrically connects a semiconductor chip 300 to a printed circuit board through a solder bump 250, thereby making it possible to implement a high-density package substrate; and forms a metal post 140 instead of a through hole to required in an interlayer circuit connection, thereby making it possible to reduce costs required in the processing/plating of the through hole.

摘要翻译： 本发明公开了一种半导体封装件的制造方法，该半导体封装件使用基片120，其中第一金属层113，阻挡层115和第二金属层117依次以两个表面层叠在第一金属层113，阻挡层115和第二金属层117上， 同时通过单片工艺制造两个印刷电路板，从而可以提高制造效率; 通过焊料凸块250将半导体芯片300电连接到印刷电路板，从而可以实现高密度封装基板; 并且形成金属柱140而不是层间电路连接所需的通孔，从而可以降低通孔的加工/电镀所需的成本。

公开(公告)号：US20110315745A1

公开(公告)日：2011-12-29

申请号：US13224265

申请日：2011-09-01

申请人： Seong Min CHO ,  Keung Jin SOHN ,  Chang Gun OH ,  Hyun Jung HONG ,  Tae Kyun BAE

发明人： Seong Min CHO ,  Keung Jin SOHN ,  Chang Gun OH ,  Hyun Jung HONG ,  Tae Kyun BAE

IPC分类号： B23K31/00

CPC分类号： H05K3/4644 ,  H05K3/0097 ,  H05K2203/1536 ,  Y10T428/12681 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12736 ,  Y10T428/12785 ,  Y10T428/12792 ,  Y10T428/12903 ,  Y10T428/12944 ,  Y10T428/12986

摘要： Disclosed herein is a carrier for manufacturing a substrate, including: two insulation layers, each being provided on one side thereof with a first metal layer and on the other side thereof with a second metal layer; and a third metal layer having a lower melting point than the first metal layer and formed between the two first metal layers respectively formed on the two insulation layers such that the two first metal layers are attached to each other. The carrier is advantageous in that the carrier can be separated by heating the third metal layer, so that the size of a substrate does not change at the time of separating the carrier, thereby maintaining the compatibility between a substrate and manufacturing facilities.

公开(公告)号：US20120152753A1

公开(公告)日：2012-06-21

申请号：US13045941

申请日：2011-03-11

申请人： Suk Won LEE ,  Tae Eun CHANG ,  Ho Sik PARK ,  Keung Jin SOHN

发明人： Suk Won LEE ,  Tae Eun CHANG ,  Ho Sik PARK ,  Keung Jin SOHN

IPC分类号： C25D5/02 ,  H05K3/00

CPC分类号： H05K3/4647 ,  H05K3/4602 ,  H05K2201/096 ,  H05K2203/025

摘要： Disclosed herein is a method of manufacturing a printed circuit board that simultaneously forms a via and an embedding land and thus improves the matching value of the via and the embedding land to secure interlayer conduction reliability, and further simultaneously forms the via and the embedding land to reduce manufacturing costs. In addition, the embedding land is formed to be embedded in the second insulating layer to implement high-density/high-integration of the printed circuit board and a via is formed in less time as compared to a method of forming a via hole using laser to reduce a process time.

摘要翻译： 本发明公开了一种制造印刷电路板的方法，该印刷电路板同时形成通孔和嵌入台面，从而提高通孔和嵌入层的匹配值，从而确保层间传导可靠性，并且进一步同时形成通孔和嵌入层 降低制造成本。 此外，与通过使用激光形成通孔的方法相比，嵌入式焊盘形成为嵌入第二绝缘层中以实现印刷电路板的高密度/高集成度，并且在较少的时间内形成通孔 以减少处理时间。

公开(公告)号：US20110180205A1

公开(公告)日：2011-07-28

申请号：US13083421

申请日：2011-04-08

申请人： Seong Min CHO ,  Keung Jin SOHN ,  Tae Kyun BAE ,  Hyun Jung HONG ,  Kyung Ah LEE ,  Chang Gun OH

发明人： Seong Min CHO ,  Keung Jin SOHN ,  Tae Kyun BAE ,  Hyun Jung HONG ,  Kyung Ah LEE ,  Chang Gun OH

IPC分类号： B32B38/10 ,  B05D3/02 ,  B32B37/02

CPC分类号： H05K3/0097 ,  B32B15/20 ,  H05K3/4682 ,  H05K2201/0355 ,  H05K2203/0156 ,  H05K2203/047 ,  H05K2203/1105 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/5313 ,  Y10T428/12493 ,  Y10T428/12681 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12736 ,  Y10T428/12785 ,  Y10T428/12792 ,  Y10T428/12903 ,  Y10T428/12944

摘要： Disclosed herein is a carrier for manufacturing a substrate, including: an insulation layer including a first metal layer formed on one side or both sides thereof; a second metal layer formed on one side of the first metal layer; and a third metal layer formed on one side of the second metal layer, wherein the second metal layer has a lower melting point than the first metal layer or the third metal layer. The carrier is advantageous in that a build up layer can be separated from a carrier by heating, so that a routing process is not required, with the result that the size of a substrate does not change when the build up layer is separated from the carrier, thereby reusing to the carrier and maintaining the compatibility between the substrate and manufacturing facilities.

摘要翻译： 本文公开了一种用于制造衬底的载体，包括：绝缘层，其包括在其一侧或两侧形成的第一金属层; 形成在所述第一金属层的一侧上的第二金属层; 以及形成在所述第二金属层的一侧上的第三金属层，其中所述第二金属层具有比所述第一金属层或所述第三金属层更低的熔点。 载体的优点在于可以通过加热将载置层与载体分离，从而不需要布线过程，结果是当构建层与载体分离时，基底的尺寸不变化 从而重新使用载体并保持基板和制造设备之间的兼容性。

公开(公告)号：US20110138621A1

公开(公告)日：2011-06-16

申请号：US12720567

申请日：2010-03-09

申请人： Seong Min CHO ,  Keung Jin SOHN ,  Tae Kyun BAE ,  Hyun Jung HONG ,  Kyung Ah LEE ,  Chang Gun OH

发明人： Seong Min CHO ,  Keung Jin SOHN ,  Tae Kyun BAE ,  Hyun Jung HONG ,  Kyung Ah LEE ,  Chang Gun OH

IPC分类号： H05K3/10 ,  B32B15/00 ,  B32B15/20 ,  B05D5/12 ,  B23K31/00

CPC分类号： H05K3/0097 ,  B32B15/20 ,  H05K3/4682 ,  H05K2201/0355 ,  H05K2203/0156 ,  H05K2203/047 ,  H05K2203/1105 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/5313 ,  Y10T428/12493 ,  Y10T428/12681 ,  Y10T428/12701 ,  Y10T428/12708 ,  Y10T428/12736 ,  Y10T428/12785 ,  Y10T428/12792 ,  Y10T428/12903 ,  Y10T428/12944

摘要： Disclosed herein is a carrier for manufacturing a substrate, including: an insulation layer including a first metal layer formed on one side or both sides thereof; a second metal layer formed on one side of the first metal layer; and a third metal layer formed on one side of the second metal layer, wherein the second metal layer has a lower melting point than the first metal layer or the third metal layer. The carrier is advantageous in that a build up layer can be separated from a carrier by heating, so that a routing process is not required, with the result that the size of a substrate does not change when the build up layer is separated from the carrier, thereby reusing the carrier and maintaining the compatibility between the substrate and manufacturing facilities.

摘要翻译： 本文公开了一种用于制造衬底的载体，包括：绝缘层，其包括在其一侧或两侧形成的第一金属层; 形成在所述第一金属层的一侧上的第二金属层; 以及形成在所述第二金属层的一侧上的第三金属层，其中所述第二金属层具有比所述第一金属层或所述第三金属层更低的熔点。 载体的优点在于可以通过加热将载置层与载体分离，从而不需要布线过程，结果是当构建层与载体分离时，基底的尺寸不变化 从而重新使用载体并保持基板和制造设备之间的兼容性。