公开(公告)号：USD571242S1

公开(公告)日：2008-06-17

申请号：US29267163

申请日：2006-10-06

申请人： Li-Huan Chen

设计人： Li-Huan Chen

公开(公告)号：US20070131597A1

公开(公告)日：2007-06-14

申请号：US11296490

申请日：2005-12-08

申请人： Li-Huan Chen

发明人： Li-Huan Chen

IPC分类号： E03F5/06

CPC分类号： E03F5/06 ,  E02D29/14

摘要： A drain cover is primarily composed of a layer of eco-material paved on the drain cover. The eco-material is made by stirring wastes of irregular shapes (e.g., slag, glass fragments, ceramic or waste gravels) with an adhesive agent and fiber glass yarns. By paving the eco-material on drain holes of the drain cover, trashes and grits can be prevented from flowing into a drain to cause an imperfect draining and a clogging. The wastes after being stirred with the adhesive agent and the fiber glass yarns can prevent insects from crawling out of the drain holes, and can reduce a drifting of odor in the drain. In addition, the wastes of irregular shapes can also increase a slip-proof effect to the drain cover, such that a pedestrian will not be tripped by the drain holes, thereby increasing a safety of walking of the pedestrian.

摘要翻译： 排水盖主要由铺设在排水盖上的生态材料层组成。 生态材料通过用粘合剂和玻璃纤维纱线搅拌不规则形状的废物（例如炉渣，玻璃碎片，陶瓷或废弃砂砾）而制成。 通过在排水盖的排水孔上铺设生态材料，可以防止垃圾和砂粒流入排水管，导致排水不畅和堵塞。 用粘合剂和玻璃纤维纱线搅拌后的废物可以防止昆虫从排水孔中爬出，并且可以减少排水管中的气味漂移。 此外，不规则形状的废物也可以增加排水盖的防滑效果，使得行人不会被排水孔绊倒，从而增加行人的行走安全性。

公开(公告)号：US06627983B2

公开(公告)日：2003-09-30

申请号：US09770083

申请日：2001-01-24

申请人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Nai Hua Yeh ,  Yen Cheng Huang ,  Yung Sheng Chiu ,  Jichen Wu ,  Joe Liu ,  Wu Hsiang Lee

发明人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Nai Hua Yeh ,  Yen Cheng Huang ,  Yung Sheng Chiu ,  Jichen Wu ,  Joe Liu ,  Wu Hsiang Lee

IPC分类号： H01L2302

CPC分类号： H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/00014

摘要： A stacked package structure of an image sensor for electrically connecting to a printed circuit board includes a first substrate, a second substrate, an integrated circuit, an image sensing chip, and a transparent layer. The second substrate is mounted on the first substrate so as to a cavity formed between the first substrate and second substrate. The integrated circuit is located within the cavity and electrically connected the first substrate. The image-sensing chip is arranged on the second substrate. The transparent layer covers over the image sensing chip, wherein the image sensing chip receives image signals via the transparent layer and transforms the image signals into electrical signals transmitted to the first substrate. Thus, the image sensing chip of the image sensing product and the integrated circuit can be integrally package.

公开(公告)号：US20080083261A1

公开(公告)日：2008-04-10

申请号：US11544026

申请日：2006-10-06

申请人： Li-Huan Chen

发明人： Li-Huan Chen

IPC分类号： G01G23/01 ,  G01P21/00 ,  G01V1/00

CPC分类号： G01G1/26

摘要： A zero gravity scale adjusting device for a steel cylinder zero gravity detector is composed of a main body, a suspension rod, a connector, a clamping device, and a counterweight, wherein the main body is extended with the suspension rod which is fixed on the connector, and the connector is corresponding to the clamping device which is extended with a fixing rod for rotatably fixing the connector. By rotatably fixing with the fixing rod, and through a scale of the clamping device, a position of the counterweight can be clearly and accurately adjusted while the device is used, and the counterweight can be quickly adjusted to achieve the balance position which can be detected conveniently.

摘要翻译： 一种用于钢瓶零重力检测器的零重力刻度调节装置由主体，悬架杆，连接器，夹紧装置和配重构成，其中主体与固定在 连接器，并且连接器对应于用用于可旋转地固定连接器的固定杆延伸的夹紧装置。 通过用固定杆可旋转地固定，并且通过夹紧装置的刻度，可以在使用装置的同时清楚和准确地调整配重的位置，并且能够快速地调整配重以实现能够被检测到的平衡位置 方便

公开(公告)号：US06521881B2

公开(公告)日：2003-02-18

申请号：US09836160

申请日：2001-04-16

申请人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Jichen Wu ,  Meng Ru Tsai

发明人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Jichen Wu ,  Meng Ru Tsai

IPC分类号： H01L2700

CPC分类号： H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/00014

摘要： A stacked structure of an image sensor includes a substrate, an integrated circuit, a package layer, an image sensing chip, and a transparent layer. The integrated circuit is formed on the substrate and electrically connected to the substrate. The package layer covers the integrated circuit. The image sensing chip is placed on the package layer to form the stacked structure with the integrated circuit and is electrically connected to the substrate. The transparent layer is arranged above the image sensing chip for the image sensing chip to receive image signals via the transparent layer. According to this structure, the image sensing chip and the integrated circuit can be integrally stacked easily.

摘要翻译： 图像传感器的堆叠结构包括基板，集成电路，封装层，图像感测芯片和透明层。 集成电路形成在基板上并电连接到基板。 封装层覆盖集成电路。 将图像感测芯片放置在封装层上，以形成具有集成电路的堆叠结构，并与基板电连接。 透明层设置在用于图像感测芯片的图像感测芯片上方以经由透明层接收图像信号。 根据该结构，可以容易地整合图像感测芯片和集成电路。

公开(公告)号：US06489572B2

公开(公告)日：2002-12-03

申请号：US09768981

申请日：2001-01-23

申请人： Mon Nan Ho ,  Chih-Hong Chen ,  Yen Cheng Huang ,  Li Huan Chen ,  Kuo Feng Peng ,  Jichen Wu ,  Allis Chen ,  Wen Chuan Chen

发明人： Mon Nan Ho ,  Chih-Hong Chen ,  Yen Cheng Huang ,  Li Huan Chen ,  Kuo Feng Peng ,  Jichen Wu ,  Allis Chen ,  Wen Chuan Chen

IPC分类号： H05K103

CPC分类号： H01L23/49861 ,  H01L2224/48091 ,  H01L2224/48465 ,  Y10T29/49128 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T156/109 ,  H01L2924/00014 ,  H01L2924/00

摘要： A substrate structure for an integrated circuit package. The substrate is electrically connected to a circuit board and an integrated circuit. The substrate includes a plurality of metal sheets and glue. The metal sheets are arranged opposite to each other. Each of the metal sheets includes a first surface and a second surface. The glue is used for sealing the plurality of metal sheet to form the substrate. The first surfaces and second surfaces of the metal sheets are exposed to the outside of the glue so as to form a plurality of signal input terminals for electrically connecting to the integrated circuit and a plurality of signal output terminals for electrically connecting to the circuit board. Thus, the signal output terminals of the metal sheets can be electrically connected to the circuit board smoothly. Furthermore, the signal transmission distance between the integrated circuit and the circuit board can be shortened so that better signal transmission effect can be obtained. A method for manufacturing the substrate is also disclosed.

摘要翻译： 一种用于集成电路封装的衬底结构。 基板电连接到电路板和集成电路。 基板包括多个金属片和胶。 金属板彼此相对布置。 每个金属片包括第一表面和第二表面。 胶被用于密封多个金属片以形成基底。 金属板的第一表面和第二表面暴露于胶的外部，以形成用于电连接到集成电路的多个信号输入端子和用于电连接到电路板的多个信号输出端子。 因此，金属片的信号输出端子可以平滑地电连接到电路板。 此外，可以缩短集成电路和电路板之间的信号传输距离，从而可以获得更好的信号传输效果。 还公开了一种用于制造衬底的方法。

公开(公告)号：US06559539B2

公开(公告)日：2003-05-06

申请号：US09770084

申请日：2001-01-24

申请人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Nai Hua Yeh ,  Yen Cheng Huang ,  Yung Sheng Chiu ,  Jichen Wu

发明人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Nai Hua Yeh ,  Yen Cheng Huang ,  Yung Sheng Chiu ,  Jichen Wu

IPC分类号： H01L2334

CPC分类号： H01L25/0657 ,  H01L31/0203 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2924/00 ,  H01L2224/0401

摘要： A stacked package structure of an image sensor used for electrically connecting to a printed circuit board includes a substrate, an image sensing chip, an integrated circuit, and a transparent layer. The substrate has a first surface and a second surface. The first surface is formed with signal input terminals. The second surface is formed with signal input terminals and signal output terminals for electrically connecting to the printed circuit board. The image sensing chip is mounted on the first surface of the substrate and is electrically to the signal input terminals of the substrate. The integrated circuit is arranged on the second surface of the substrate and is electrically connected to the signal input terminals of the substrate. The transparent layer covers over the image sensing chip, which can receive the image signals via the transparent layer and convert the image signals into electrical signals that are to be transmitted to the substrate. Thus, the image sensing chip of the image sensing product and integrated circuit can be integrally packaged.

摘要翻译： 用于电连接到印刷电路板的图像传感器的堆叠封装结构包括基板，图像感测芯片，集成电路和透明层。 基板具有第一表面和第二表面。 第一表面由信号输入端子形成。 第二表面形成有用于电连接到印刷电路板的信号输入端子和信号输出端子。 图像感测芯片安装在基板的第一表面上并且电连接到基板的信号输入端子。 集成电路布置在基板的第二表面上并且电连接到基板的信号输入端子。 透明层覆盖图像感测芯片，其可以经由透明层接收图像信号，并将图像信号转换成要传输到基板的电信号。 因此，图像感测产品和集成电路的图像感测芯片可以被整体封装。

公开(公告)号：US20060124412A1

公开(公告)日：2006-06-15

申请号：US11007294

申请日：2004-12-09

申请人： Li-Huan Chen

发明人： Li-Huan Chen

IPC分类号： F16D65/04

CPC分类号： G01G17/04 ,  G01G1/36

摘要： The present invention relates to a compressed-gas cylinder weight measuring device having a main body, beams, a vernier, a graduated scale, and sliding weight, wherein beams connected to the main body, the sliding weight with inner thread formed on the beam, the vernier formed on an end of the sliding weight, the graduated scale formed on the main body, thereby enabling the compressed-gas cylinder weight to be easily read from the graduated scale and also from a vernier when rotating the sliding weight.

摘要翻译： 本发明涉及一种具有主体，梁，游标，刻度尺和滑动重物的压缩气体重量测量装置，其中连接到主体的梁，在梁上形成有内螺纹的滑动重物， 在滑动体的一端形成有游标，刻度尺形成在主体上，从而能够在旋转滑动重物时使压缩气体重量容易地从刻度尺读取，也可以从游标读取。

公开(公告)号：US06737720B2

公开(公告)日：2004-05-18

申请号：US09768845

申请日：2001-01-23

申请人： Mon Nan Ho ,  Hsiu Wen Tu ,  Ching Shui Cheng ,  Li Huan Chen ,  Joe Liu ,  Jichen Wu ,  Wen Chuan Chen

发明人： Mon Nan Ho ,  Hsiu Wen Tu ,  Ching Shui Cheng ,  Li Huan Chen ,  Joe Liu ,  Jichen Wu ,  Wen Chuan Chen

IPC分类号： H01L310203

CPC分类号： H01L27/14618 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A packaging structure of an image sensor includes a substrate, an image sensing chip, a plurality of wirings, and a transparent layer. The substrate includes a plurality of metal sheets, glue for sealing the metal sheets, a first surface, and a second surface. The metal sheets are exposed to the outside via the first surface and the second surface to form first contacts and second contacts, respectively. The image sensing chip is mounted on the substrate. The plurality of bonding pads are formed on the image sensing chip. The plurality of wirings electrically connect the bonding pads on the image sensing chip to the first contacts of the first surface of the substrate, in order to electrically connect the image sensing chip to the substrate. The transparent layer is arranged above the image sensing chip. Therefore, a packaging structure of an image sensor made of plastic materials can be formed, thereby simplifying the packaging processes and lowering the manufacturing costs.

摘要翻译： 图像传感器的封装结构包括基板，图像感测芯片，多个布线和透明层。 基板包括多个金属片，用于密封金属片的胶，第一表面和第二表面。 金属片经由第一表面和第二表面暴露于外部，以分别形成第一触点和第二触点。 图像感测芯片安装在基板上。 多个接合焊盘形成在图像感测芯片上。 多个布线将图像感测芯片上的接合焊盘电连接到衬底的第一表面的第一触点，以将图像感​​测芯片电连接到衬底。 透明层设置在图像感测芯片的上方。 因此，可以形成由塑料材料制成的图像传感器的包装结构，从而简化包装过程并降低制造成本。