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    Stacked structure of an image sensor and method for manufacturing the same
    3.
    发明授权
    Stacked structure of an image sensor and method for manufacturing the same 有权
    图像传感器的堆叠结构及其制造方法

    公开(公告)号：US06521881B2

    公开(公告)日：2003-02-18

    申请号：US09836160

    申请日：2001-04-16

    申请人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Jichen Wu ,  Meng Ru Tsai

    发明人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Jichen Wu ,  Meng Ru Tsai

    IPC分类号： H01L2700

    CPC分类号： H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/00014

    摘要： A stacked structure of an image sensor includes a substrate, an integrated circuit, a package layer, an image sensing chip, and a transparent layer. The integrated circuit is formed on the substrate and electrically connected to the substrate. The package layer covers the integrated circuit. The image sensing chip is placed on the package layer to form the stacked structure with the integrated circuit and is electrically connected to the substrate. The transparent layer is arranged above the image sensing chip for the image sensing chip to receive image signals via the transparent layer. According to this structure, the image sensing chip and the integrated circuit can be integrally stacked easily.

    摘要翻译： 图像传感器的堆叠结构包括基板，集成电路，封装层，图像感测芯片和透明层。 集成电路形成在基板上并电连接到基板。 封装层覆盖集成电路。 将图像感测芯片放置在封装层上，以形成具有集成电路的堆叠结构，并与基板电连接。 透明层设置在用于图像感测芯片的图像感测芯片上方以经由透明层接收图像信号。 根据该结构，可以容易地整合图像感测芯片和集成电路。

    Packaging structure of image sensor and method for packaging the same
    4.
    发明授权
    Packaging structure of image sensor and method for packaging the same 失效
    图像传感器的包装结构及其包装方法

    公开(公告)号：US06737720B2

    公开(公告)日：2004-05-18

    申请号：US09768845

    申请日：2001-01-23

    申请人： Mon Nan Ho ,  Hsiu Wen Tu ,  Ching Shui Cheng ,  Li Huan Chen ,  Joe Liu ,  Jichen Wu ,  Wen Chuan Chen

    发明人： Mon Nan Ho ,  Hsiu Wen Tu ,  Ching Shui Cheng ,  Li Huan Chen ,  Joe Liu ,  Jichen Wu ,  Wen Chuan Chen

    IPC分类号： H01L310203

    CPC分类号： H01L27/14618 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A packaging structure of an image sensor includes a substrate, an image sensing chip, a plurality of wirings, and a transparent layer. The substrate includes a plurality of metal sheets, glue for sealing the metal sheets, a first surface, and a second surface. The metal sheets are exposed to the outside via the first surface and the second surface to form first contacts and second contacts, respectively. The image sensing chip is mounted on the substrate. The plurality of bonding pads are formed on the image sensing chip. The plurality of wirings electrically connect the bonding pads on the image sensing chip to the first contacts of the first surface of the substrate, in order to electrically connect the image sensing chip to the substrate. The transparent layer is arranged above the image sensing chip. Therefore, a packaging structure of an image sensor made of plastic materials can be formed, thereby simplifying the packaging processes and lowering the manufacturing costs.

    摘要翻译： 图像传感器的封装结构包括基板，图像感测芯片，多个布线和透明层。 基板包括多个金属片，用于密封金属片的胶，第一表面和第二表面。 金属片经由第一表面和第二表面暴露于外部，以分别形成第一触点和第二触点。 图像感测芯片安装在基板上。 多个接合焊盘形成在图像感测芯片上。 多个布线将图像感测芯片上的接合焊盘电连接到衬底的第一表面的第一触点，以将图像感​​测芯片电连接到衬底。 透明层设置在图像感测芯片的上方。 因此，可以形成由塑料材料制成的图像传感器的包装结构，从而简化包装过程并降低制造成本。

    Substrate structure for an integrated circuit package and method for manufacturing the same
    5.
    发明授权
    Substrate structure for an integrated circuit package and method for manufacturing the same 失效
    集成电路封装的基板结构及其制造方法

    公开(公告)号：US06489572B2

    公开(公告)日：2002-12-03

    申请号：US09768981

    申请日：2001-01-23

    申请人： Mon Nan Ho ,  Chih-Hong Chen ,  Yen Cheng Huang ,  Li Huan Chen ,  Kuo Feng Peng ,  Jichen Wu ,  Allis Chen ,  Wen Chuan Chen

    发明人： Mon Nan Ho ,  Chih-Hong Chen ,  Yen Cheng Huang ,  Li Huan Chen ,  Kuo Feng Peng ,  Jichen Wu ,  Allis Chen ,  Wen Chuan Chen

    IPC分类号： H05K103

    CPC分类号： H01L23/49861 ,  H01L2224/48091 ,  H01L2224/48465 ,  Y10T29/49128 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T156/109 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A substrate structure for an integrated circuit package. The substrate is electrically connected to a circuit board and an integrated circuit. The substrate includes a plurality of metal sheets and glue. The metal sheets are arranged opposite to each other. Each of the metal sheets includes a first surface and a second surface. The glue is used for sealing the plurality of metal sheet to form the substrate. The first surfaces and second surfaces of the metal sheets are exposed to the outside of the glue so as to form a plurality of signal input terminals for electrically connecting to the integrated circuit and a plurality of signal output terminals for electrically connecting to the circuit board. Thus, the signal output terminals of the metal sheets can be electrically connected to the circuit board smoothly. Furthermore, the signal transmission distance between the integrated circuit and the circuit board can be shortened so that better signal transmission effect can be obtained. A method for manufacturing the substrate is also disclosed.

    摘要翻译： 一种用于集成电路封装的衬底结构。 基板电连接到电路板和集成电路。 基板包括多个金属片和胶。 金属板彼此相对布置。 每个金属片包括第一表面和第二表面。 胶被用于密封多个金属片以形成基底。 金属板的第一表面和第二表面暴露于胶的外部，以形成用于电连接到集成电路的多个信号输入端子和用于电连接到电路板的多个信号输出端子。 因此，金属片的信号输出端子可以平滑地电连接到电路板。 此外，可以缩短集成电路和电路板之间的信号传输距离，从而可以获得更好的信号传输效果。 还公开了一种用于制造衬底的方法。