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    Packaging structure of image sensor and method for packaging the same
    4.
    发明授权
    Packaging structure of image sensor and method for packaging the same 失效
    图像传感器的包装结构及其包装方法

    公开(公告)号：US06737720B2

    公开(公告)日：2004-05-18

    申请号：US09768845

    申请日：2001-01-23

    申请人： Mon Nan Ho ,  Hsiu Wen Tu ,  Ching Shui Cheng ,  Li Huan Chen ,  Joe Liu ,  Jichen Wu ,  Wen Chuan Chen

    发明人： Mon Nan Ho ,  Hsiu Wen Tu ,  Ching Shui Cheng ,  Li Huan Chen ,  Joe Liu ,  Jichen Wu ,  Wen Chuan Chen

    IPC分类号： H01L310203

    CPC分类号： H01L27/14618 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： A packaging structure of an image sensor includes a substrate, an image sensing chip, a plurality of wirings, and a transparent layer. The substrate includes a plurality of metal sheets, glue for sealing the metal sheets, a first surface, and a second surface. The metal sheets are exposed to the outside via the first surface and the second surface to form first contacts and second contacts, respectively. The image sensing chip is mounted on the substrate. The plurality of bonding pads are formed on the image sensing chip. The plurality of wirings electrically connect the bonding pads on the image sensing chip to the first contacts of the first surface of the substrate, in order to electrically connect the image sensing chip to the substrate. The transparent layer is arranged above the image sensing chip. Therefore, a packaging structure of an image sensor made of plastic materials can be formed, thereby simplifying the packaging processes and lowering the manufacturing costs.

    摘要翻译： 图像传感器的封装结构包括基板，图像感测芯片，多个布线和透明层。 基板包括多个金属片，用于密封金属片的胶，第一表面和第二表面。 金属片经由第一表面和第二表面暴露于外部，以分别形成第一触点和第二触点。 图像感测芯片安装在基板上。 多个接合焊盘形成在图像感测芯片上。 多个布线将图像感测芯片上的接合焊盘电连接到衬底的第一表面的第一触点，以将图像感​​测芯片电连接到衬底。 透明层设置在图像感测芯片的上方。 因此，可以形成由塑料材料制成的图像传感器的包装结构，从而简化包装过程并降低制造成本。

    Stacked structure of an image sensor and method for manufacturing the same
    5.
    发明授权
    Stacked structure of an image sensor and method for manufacturing the same 有权
    图像传感器的堆叠结构及其制造方法

    公开(公告)号：US06521881B2

    公开(公告)日：2003-02-18

    申请号：US09836160

    申请日：2001-04-16

    申请人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Jichen Wu ,  Meng Ru Tsai

    发明人： Hsiu Wen Tu ,  Wen Chuan Chen ,  Mon Nan Ho ,  Li Huan Chen ,  Jichen Wu ,  Meng Ru Tsai

    IPC分类号： H01L2700

    CPC分类号： H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/00014

    摘要： A stacked structure of an image sensor includes a substrate, an integrated circuit, a package layer, an image sensing chip, and a transparent layer. The integrated circuit is formed on the substrate and electrically connected to the substrate. The package layer covers the integrated circuit. The image sensing chip is placed on the package layer to form the stacked structure with the integrated circuit and is electrically connected to the substrate. The transparent layer is arranged above the image sensing chip for the image sensing chip to receive image signals via the transparent layer. According to this structure, the image sensing chip and the integrated circuit can be integrally stacked easily.

    摘要翻译： 图像传感器的堆叠结构包括基板，集成电路，封装层，图像感测芯片和透明层。 集成电路形成在基板上并电连接到基板。 封装层覆盖集成电路。 将图像感测芯片放置在封装层上，以形成具有集成电路的堆叠结构，并与基板电连接。 透明层设置在用于图像感测芯片的图像感测芯片上方以经由透明层接收图像信号。 根据该结构，可以容易地整合图像感测芯片和集成电路。

    Package structure for a photosensitive chip
    6.
    发明授权
    Package structure for a photosensitive chip 有权
    感光芯片的封装结构

    公开(公告)号：US06590269B1

    公开(公告)日：2003-07-08

    申请号：US10114201

    申请日：2002-04-01

    申请人： Jason Chuang ,  Allis Chen ,  Jachson Hsieh ,  Hsiu Wen Tu ,  Meng Ru Tsai ,  Mon Nan Ho ,  Fu Yung Huang ,  Yung Sheng Chiu ,  Jichen Wu ,  Chih Cheng Hsu

    发明人： Jason Chuang ,  Allis Chen ,  Jachson Hsieh ,  Hsiu Wen Tu ,  Meng Ru Tsai ,  Mon Nan Ho ,  Fu Yung Huang ,  Yung Sheng Chiu ,  Jichen Wu ,  Chih Cheng Hsu

    IPC分类号： H01L310203

    CPC分类号： H01L31/0203 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A package structure for a photosensitive chip includes a substrate having an upper surface and a lower surface, and a frame layer having a first surface and a second surface. The frame layer is formed on the substrate by way of injection molding with the first surface contacting the upper surface. A cavity is formed between the substrate and the frame layer. The second surface is formed with a depression in which plural projections each having a suitable height are formed. The frame layer is formed directly on the substrate by way of injection molding. The package structure further includes a photosensitive chip arranged within the cavity, a plurality of wires for connecting the substrate to the photosensitive chip, and a transparent layer rested on the projections within the depression. Accordingly, the yield can be improved and the manufacturing processes can be facilitated.

    摘要翻译： 用于感光芯片的封装结构包括具有上表面和下表面的基片和具有第一表面和第二表面的框架层。 框架层通过注射成型形成在基板上，第一表面接触上表面。 在基板和框架层之间形成空腔。 第二表面形成有凹部，其中形成有具有适当高度的多个凸起。 框架层通过注射成型直接形成在基板上。 封装结构还包括布置在空腔内的感光芯片，用于将基板连接到感光芯片的多根导线以及搁置在凹陷内的凸起上的透明层。 因此，可以提高收率并且可以促进制造过程。

    Package structure of an image sensor and packaging
    7.
    发明授权
    Package structure of an image sensor and packaging 有权
    图像传感器和包装的封装结构

    公开(公告)号：US06646316B2

    公开(公告)日：2003-11-11

    申请号：US09770049

    申请日：2001-01-24

    申请人： Jichen Wu ,  Hsiu Wen Tu ,  Kuo Feng Peng ,  C. H. Chen ,  Wen Chuan Chen

    发明人： Jichen Wu ,  Hsiu Wen Tu ,  Kuo Feng Peng ,  C. H. Chen ,  Wen Chuan Chen

    IPC分类号： H01L310203

    CPC分类号： H01L31/0203 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

    摘要： A package structure of an image sensor is characterized in that an image sensing chip is directly packaged on a flexible circuit board by way of flip chip bonding. The package structure of an image sensor includes an image sensing chip, a flexible circuit board, and a transparent layer. A plurality of electrical circuits are formed on the image sensing chip. Each of the electrical circuits is formed with bonding pads. A flexible circuit board has an upper surface and a lower surface. Signal input terminals are formed on the lower surface and at positions corresponding to each of the bonding pads of the image sensing chip, respectively, for electrically connecting to the corresponding bonding pads of the image sensing chip. The signal input terminals are electrically connected to signal output terminals, respectively, for electrically connecting to the printed circuit board. The transparent layer is used for covering the upper surface of the flexible circuit board. The image sensing chip receives image signals via the transparent layer, transforms the image signals into electrical signals, and transmits the electrical signals from the flexible circuit board to the printed circuit board.

    摘要翻译： 图像传感器的封装结构的特征在于，通过倒装芯片接合将图像感测芯片直接封装在柔性电路板上。 图像传感器的封装结构包括图像感测芯片，柔性电路板和透明层。 在图像感测芯片上形成多个电路。 每个电路由接合焊盘形成。 柔性电路板具有上表面和下表面。 信号输入端子分别形成在下表面和对应于图像感测芯片的每个接合焊盘的位置处，用于电连接到图像感测芯片的相应接合焊盘。 信号输入端子分别电连接到信号输出端子，用于电连接到印刷电路板。 透明层用于覆盖柔性电路板的上表面。 图像感测芯片通过透明层接收图像信号，将图像信号转换为电信号，并将电信号从柔性电路板传输到印刷电路板。

    Image sensor package structure and method for manufacturing the same
    8.
    发明申请
    Image sensor package structure and method for manufacturing the same 审中-公开
    图像传感器封装结构及其制造方法

    公开(公告)号：US20080067334A1

    公开(公告)日：2008-03-20

    申请号：US11986227

    申请日：2007-11-19

    申请人： Jason Chuang ,  Mon Nan Ho ,  Hsiu Wen Tu ,  Chen Pin Peng ,  Chung Hsien Hsin ,  Wei Chang

    发明人： Jason Chuang ,  Mon Nan Ho ,  Hsiu Wen Tu ,  Chen Pin Peng ,  Chung Hsien Hsin ,  Wei Chang

    IPC分类号： H01J5/02 ,  H01L21/64

    CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

    摘要： An image sensor package structure includes a substrate, a chip, a plurality of wires, and a frame layer. The substrate has an upper surface, which is formed with first electrodes, and a lower surface, which is formed with second electrodes corresponding to electrically connect to the first electrodes. The chip has a sensor region and a plurality of bonding pads located at the side of the sensor region of the chip, and is mounted on the upper surface of the substrate. The plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate. The frame layer is inserted with a transparent layer, and is arranged on the upper surface of the substrate to cover the chip.

    摘要翻译： 图像传感器封装结构包括基板，芯片，多根导线和框架层。 基板具有形成有第一电极的上表面和形成有与第一电极电连接的第二电极的下表面。 芯片具有传感器区域和位于芯片的传感器区域侧的多个接合焊盘，并且安装在基板的上表面上。 多个导线将芯片的焊盘电连接到基板的第一电极。 框架层插入透明层，并且布置在基板的上表面上以覆盖芯片。

    Image sensor module with a protection layer and a method for manufacturing the same
    9.
    发明授权
    Image sensor module with a protection layer and a method for manufacturing the same 有权
    具有保护层的图像传感器模块及其制造方法

    公开(公告)号：US07423334B2

    公开(公告)日：2008-09-09

    申请号：US11283596

    申请日：2005-11-17

    申请人： Hsiu Wen Tu ,  Chen Pin Peng ,  Mon Nan Ho ,  Chung Hsien Hsin

    发明人： Hsiu Wen Tu ,  Chen Pin Peng ,  Mon Nan Ho ,  Chung Hsien Hsin

    IPC分类号： H01L23/02 ,  H01L29/22

    CPC分类号： H01L27/14625 ,  H01L23/10 ,  H01L23/3157 ,  H01L27/14618 ,  H01L27/14685 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An image sensor module with a protection layer and a method for manufacturing the same includes a substrate with an upper surface and a lower surface, a chip is mounted on the upper surface of the substrate, a plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate, a adhered layer is coated on the upper surface of the substrate, a lens holder has a lateral wall, a protection layer and internal thread, the lateral wall is adhered on the upper surface of the substrate by the adhered layer to encapsulate the chip, so that the protection layer is located on adjacent the sensor region of the chip to prevent adhered layer flowed to the sensor region of the chip; and a lens barrel is formed with external thread screwed on the internal thread of the lens holder.

    摘要翻译： 具有保护层的图像传感器模块及其制造方法包括具有上表面和下表面的基板，芯片安装在基板的上表面上，多条导线电连接到 芯片到基板的第一电极，粘合层涂覆在基板的上表面上，透镜保持器具有侧壁，保护层和内螺纹，侧壁粘附在基板的上表面上 通过粘附层封装芯片，使得保护层位于与芯片的传感器区域相邻的位置，以防止粘附层流到芯片的传感器区域; 并且透镜筒形成有拧在透镜架的内螺纹上的外螺纹。

    Image sensor module
    10.
    发明授权
    Image sensor module 失效
    图像传感器模块

    公开(公告)号：US06870208B1

    公开(公告)日：2005-03-22

    申请号：US10671038

    申请日：2003-09-24

    申请人： Irving You ,  Jichen Wu ,  Hsiu Wen Tu ,  Jason Chang ,  Figo Hsieh

    发明人： Irving You ,  Jichen Wu ,  Hsiu Wen Tu ,  Jason Chang ,  Figo Hsieh

    IPC分类号： H01L21/336 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/062

    CPC分类号： H01L27/14618 ,  H01L27/14625 ,  H01L31/0203 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An image sensor module includes a substrate, a frame layer, a photosensitive chip, a transparent layer and a lens barrel. The substrate has a plurality of lead frame arranged in a matrix to form an upper surface, which is formed with a opening, and a lower surface, which is formed with a cavity penetrated from the opening. The frame layer is integrally formed with the substrate, and arranged at the periphery of the upper surface of the substrate to define a chamber together with the substrate, an internal thread being formed on the inner wall of the chamber. The photosensitive chip is mounted within the cavity of the substrate, and electrically coupled each of the lead frames in a flip chip manner. The transparent layer is covered onto the upper surface of the substrate to cover the opening. The lens barrel has a top surface, a bottom surface opposed to the top surface and a transparent region, a external thread formed between the top surface and the bottom surface, the lens barrel being arranged within the chamber of the frame layer, the external thread being screwed on the internal thread of the chamber.

    摘要翻译： 图像传感器模块包括基板，框架层，感光芯片，透明层和镜筒。 基板具有以矩阵形式布置的多个引线框架，以形成形成有开口的上表面和形成有从开口穿入的空腔的下表面。 框架层与衬底一体地形成，并且布置在衬底的上表面的周边以与衬底一起限定腔室，内腔形成在腔室的内壁上。 感光芯片安装在基板的腔内，并以倒装芯片的方式电耦合每个引线框架。 透明层被覆盖在基板的上表面上以覆盖开口。 镜筒具有顶表面，与顶表面相对的底表面和透明区域，形成在顶表面和底表面之间的外螺纹，镜筒设置在框架层的腔室内，外螺纹 被拧在腔室的内螺纹上。