Silicon deposition process
    1.
    发明授权
    Silicon deposition process 失效
    硅沉积工艺

    公开(公告)号:US4590024A

    公开(公告)日:1986-05-20

    申请号:US594456

    申请日:1984-03-29

    IPC分类号: C30B13/00

    CPC分类号: C30B29/06 C30B13/00

    摘要: An improved process is disclosed for the deposition in a reactor vessel of silicon on the interior walls of the reactor vessel and for the subsequent separation of the silicon from those walls. The reactor vessel has a generally rectangular cross section and is formed of a refractory material from which the deposited silicon separates by thermal expansion shear separation during cool down of the vessel and the deposited silicon. To improve the output of the deposition system, a plurality of partitions are provided in the reactor vessel and integral with the reactor walls. These partitions act as additional deposition surfaces, increasing the number of silicon sheets deposited as well as increasing the efficiency of the chemical reaction.

    摘要翻译: 公开了一种改进的方法,用于沉积在反应器容器的内壁上的硅的反应器容器中,并且随后将硅与这些壁分离。 反应器容器具有大致矩形的横截面,并且由耐热材料形成,沉积的硅通过在容器和沉积的硅冷却期间的热膨胀剪切分离而分离。 为了提高沉积系统的输出,在反应器容器中提供多个隔板并与反应器壁成一体。 这些隔板作为附加的沉积表面,增加沉积的硅片的数量以及提高化学反应的效率。

    Process for forming self-supporting semiconductor film
    3.
    发明授权
    Process for forming self-supporting semiconductor film 失效
    用于形成自支撑半导体膜的工艺

    公开(公告)号:US4370288A

    公开(公告)日:1983-01-25

    申请号:US207845

    申请日:1980-11-18

    摘要: A process is provided for forming a self-supporting semiconductor film or ribbon. A TESS substrate is prepared from a substrate of refractory material having an expansion coefficient different from the expansion coefficient of the semiconductor material. A colloidal suspension of graphite is applied to the substrate to form a thin layer of loosely adherent graphite particles. Over this layer of graphite is deposited a layer of the semiconductor material, the deposition occurring at an elevated temperature. Upon cooling from the deposition temperature, the differential thermal expansion coefficience causes the shearing at the graphite layer and therefore provides for the easy removal of the semiconductor layer from the substrate.

    摘要翻译: 提供了一种用于形成自支撑半导体膜或带的工艺。 从具有与半导体材料的膨胀系数不同的膨胀系数的耐火材料的基材制备TESS基材。 将石墨的胶体悬浮液施加到基底上以形成松散粘附的石墨颗粒的薄层。 在该层石墨上淀积一层半导体材料,沉积在升高的温度下发生。 在从沉积温度冷却时,不同的热膨胀系数导致在石墨层处的剪切,因此提供了从衬底中容易地去除半导体层。

    Polycrystalline silicon production
    4.
    发明授权
    Polycrystalline silicon production 失效
    多晶硅生产

    公开(公告)号:US4321246A

    公开(公告)日:1982-03-23

    申请号:US148093

    申请日:1980-05-09

    IPC分类号: C01B33/02 C01B33/107

    摘要: Polycrystalline silicon is produced by a high pressure plasma process. A silicon halide or halosilane is reacted with hydrogen in the presence of a high pressure plasma to deposit silicon on a heated substrate. The effluent from this reaction is collected, the silicon-bearing compounds separated out, and re-introduced to the deposition reaction. The initial silicon bearing compound can be inexpensive silicon tetrachloride. Maximum utilization of all silicon bearing reaction products maximizes polycrystalline silicon production efficiency.

    摘要翻译: 通过高压等离子体工艺制造多晶硅。 在高压等离子体存在下,卤化硅或卤代硅烷与氢反应,以将硅沉积在加热的衬底上。 收集该反应的流出物,分离出含硅化合物,并重新引入沉积反应。 初始含硅化合物可以是廉价的四氯化硅。 所有硅轴承反应产品的最大利用率最大限度地提高了多晶硅的生产效率。

    Oxidation of material in high pressure oxygen plasma
    6.
    发明授权
    Oxidation of material in high pressure oxygen plasma 失效
    在高压氧等离子体中氧化材料

    公开(公告)号:US4555303A

    公开(公告)日:1985-11-26

    申请号:US656822

    申请日:1984-10-02

    摘要: A process is disclosed for removing carbonaceous material from a surface in a high pressure oxygen plasma. A surface, such as a surface of a silicon ribbon, having a layer of carbonaceous material thereon is positioned in a high pressure plasma reaction volume. A high pressure rf plasma is generated in which the plasma includes reactive and ionic oxygen species. The reactive oxygen species are directed to and react with the layer of carbonaceous material to oxidize that material. The reaction products of the oxidation step include carbon dioxide and, possibly a non-oxidizing ash material which can easily be removed from the silicon surface.

    摘要翻译: 公开了从高压氧等离子体中的表面除去碳质材料的方法。 在其上具有碳质材料层的表面,例如硅带的表面,位于高压等离子体反应体积中。 产生高压rf等离子体,其中等离子体包括反应性和离子氧。 活性氧物质被引导并与碳质材料层反应以氧化该材料。 氧化步骤的反应产物包括可以容易地从硅表面去除的二氧化碳和可能的非氧化灰分材料。