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公开(公告)号：US5727310A
公开(公告)日：1998-03-17
申请号：US661809
申请日：1996-06-11
Applicant: Keith L. Casson , Carol Myers , Kenneth B. Gilleo , Deanna Suilmann , Edward Mahagnoul , Marion Tibesar
Inventor： Keith L. Casson , Carol Myers , Kenneth B. Gilleo , Deanna Suilmann , Edward Mahagnoul , Marion Tibesar
CPC classification number: H05K3/462 , H05K3/323 , H05K2201/0233 , H05K2201/09536 , H05K2201/096 , H05K2201/10666 , H05K2203/0425 , H05K3/28 , H05K3/368 , H05K3/4623 , Y10T29/49126 , Y10T29/49155
Abstract: A heat resistant multilayer circuit board used in the transportation environment in cars, boats, planes, etc, having two or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, at least one of the conductive layers being affixed to a heat resistant substrate. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.
Abstract translation: 一种用于汽车，船舶，飞机等的运输环境中的具有两个或多个导电层的耐热多层电路板，至少两个导电层通过互连粘合剂层电连接和机械连接，至少一个导电层 固定在耐热基材上。 互连粘合剂层包括导电粘合剂材料，其具有基本上分散在非导电粘合剂上分散的多个可变形的热熔金属颗粒。 制造的多层电路板具有可靠，耐热和能够承受热循环和典型的电路板精加工和组装过程的互连。
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2.发明授权Method for electrically and mechanically connecting at least two conductive layers 失效用于电和机械连接至少两个导电层的方法
公开(公告)号：US5502889A
公开(公告)日：1996-04-02
申请号：US1811
申请日：1993-01-08
Applicant: Keith L. Casson , Carol Myers , Kenneth B. Gilleo , Deanna Suilmann , Edward Mahagnoul , Marion Tibesar
Inventor： Keith L. Casson , Carol Myers , Kenneth B. Gilleo , Deanna Suilmann , Edward Mahagnoul , Marion Tibesar
CPC classification number: H05K3/462 , H05K3/323 , H05K3/368 , H01L2224/293 , H01L2924/01019 , H01L2924/01322 , H01L2924/07811 , H01L2924/09701 , H05K2201/0233 , H05K2201/0266 , H05K2201/09536 , H05K2201/096 , H05K2201/10666 , H05K2203/0425 , H05K2203/061 , H05K2203/1572 , H05K3/28 , H05K3/321 , H05K3/4623 , Y10S428/901 , Y10T29/49126 , Y10T29/49149 , Y10T428/24917 , Y10T428/2857 , Y10T428/287
Abstract: A multilayer circuit board having three or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, is disclosed. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.
Abstract translation: 公开了一种具有三个或更多个导电层的多层电路板，其中至少两个导电层通过互连粘合剂层电连接和机械连接。 互连粘合剂层包括导电粘合剂材料，其具有基本上分散在非导电粘合剂上分散的多个可变形的热熔金属颗粒。 制造的多层电路板具有可靠，耐热和能够承受热循环和典型的电路板精加工和组装过程的互连。
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3.发明授权Printed wiring board with photoimageable dielectric base substrate and method of manufacture therefor 失效具有可光成像的电介质基底的印刷电路板及其制造方法
公开(公告)号：US5709979A
公开(公告)日：1998-01-20
申请号：US327236
申请日：1994-10-21
Applicant: Keith L. Casson , Matthew John Saari , Raphael A. Marsolek , Marion Tibesar
Inventor： Keith L. Casson , Matthew John Saari , Raphael A. Marsolek , Marion Tibesar
CPC classification number: H05K3/281 , H05K3/0023 , H05K3/42 , H05K1/112 , H05K2201/0355 , H05K2201/09472 , H05K2203/063 , H05K2203/066 , H05K3/4644 , H05K3/4652
Abstract: A printed wiring board includes a photoimageable dielectric material (PID) utilized as the base dielectric substrate therefor. The photoimageable dielectric material may be utilized in many conventional PWB designs, and improved resolution and registration precision of access apertures and through holes is generally realized through the use thereof. Moreover, less costly and complex manufacturing processes are required to deposit, image, develop and cure the PID material.
Abstract translation: 印刷电路板包括用作其基底电介质基板的可光成像的电介质材料（PID）。 可光成像的电介质材料可以用于许多常规的PWB设计中，并且通常通过其使用来实现存取孔和通孔的改进的分辨率和配准精度。 此外，需要较低成本和复杂的制造工艺来沉积，成像，开发和固化PID材料。
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公开(公告)号：US5688584A
公开(公告)日：1997-11-18
申请号：US534630
申请日：1995-09-27
Applicant: Keith L. Casson , Carol Myers , Kenneth B. Gilleo , Deanna Suilmann , Edward Mahagnoul , Marion Tibesar
Inventor： Keith L. Casson , Carol Myers , Kenneth B. Gilleo , Deanna Suilmann , Edward Mahagnoul , Marion Tibesar
CPC classification number: H05K3/462 , H05K3/323 , H05K3/368 , H01L2224/293 , H01L2924/01019 , H01L2924/01322 , H01L2924/07811 , H01L2924/09701 , H05K2201/0233 , H05K2201/0266 , H05K2201/09536 , H05K2201/096 , H05K2201/10666 , H05K2203/0425 , H05K2203/061 , H05K2203/1572 , H05K3/28 , H05K3/321 , H05K3/4623 , Y10S428/901 , Y10T29/49126 , Y10T29/49149 , Y10T428/24917 , Y10T428/2857 , Y10T428/287
Abstract: A multilayer circuit board having three or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, is disclosed. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.
Abstract translation: 公开了一种具有三个或更多个导电层的多层电路板，其中至少两个导电层通过互连粘合剂层电连接和机械连接。 互连粘合剂层包括导电粘合剂材料，其具有基本上分散在非导电粘合剂上分散的多个可变形的热熔金属颗粒。 制造的多层电路板具有可靠，耐热和能够承受热循环和典型的电路板精加工和组装过程的互连。
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