摘要:
The semiconductor of this invention is provided with a first inter-layer insulating film formed on the surface of a semiconductor substrate to a first film thickness; a plurality of first wiring patterns formed on the surface of the first inter-layer insulating film; a dummy pattern formed between the first wiring patterns and insulated electrically from the wiring patterns; a second inter-layer insulating film formed from the first inter-layer insulating film to a second film thickness so as to cover the surfaces of the first inter-layer insulating film, the first wiring patterns, the dummy pattern; and second wiring patterns formed on the surface of the second inter-layer insulating film and wherein the dummy pattern has no planar overlapped portion with respect to the second wiring patterns, that is, it is separated from the second wiring patterns in top view.
摘要:
A plurality of silicon insulating films are formed to separate regions to be formed with elements from each other on a silicon semiconductor substrate. Silicon layers are formed by an epitaxially growing method on the regions to be formed with the elements and the silicon insulating film. An MOS transistor is formed on the monocrystalline silicon layer formed on the regions to be formed with the elements of the silicon layer, and the polysilicon layer formed on the silicon insulating film is used as a high resistance element or doped with an impurity as a conductor line.
摘要:
A semiconductor device comprising an electrode or wiring layer formed over a semiconductor substrate, a circuit element provided adjacent the electrode or wiring layer, and a conductive layer formed on a side wall, or a side wall and top surface, of the electrode or wiring layer with an insulating film provided therebetween, and supplied with a fixed potential or a variable potential different from a potential on the electrode or wiring layer.
摘要:
A first insulating film is formed on the surface of a silicon substrate, and a first silicide wiring layer is deposited on the insulating film. A first mark is formed by transferring the pattern of a first reticle formed on the silicide wiring layer. A second insulation film is deposited on the mark and the first insulation film, and a second mark is formed on the first mark by transferring the pattern of a second reticle formed on the second insulation film. A second silicide wiring layer is deposited in the second mark and on the second insulating film. An anti dust deposit and a third mark are formed by transferring the pattern of a third reticle formed on the second silicide wiring layer. Thus, dusts from the marks produced by transferring the reticle inspection marks of the reticles can be effectively prevented to improve the yield of LSIs.
摘要:
A monocrystalline silicon substrate having a (110) crystal plane is prepared. A CMOS transistor is formed on this substrate. An N channel MOS transistor and a P channel MOS transistor are formed in the surface of the semiconductor substrate. In each of these transistors the channel length is 1.5 .mu.m or less and the velocity saturation phenomenon of electrons is outstanding.
摘要:
The semiconductor of this invention is provided with a first inter-layer insulating film formed on the surface of a semiconductor substrate to a first film thickness; a plurality of first wiring patterns formed on the surface of the first inter-layer insulating film; a dummy pattern formed between the first wiring patterns and insulated electrically from the wiring patterns; a second inter-layer insulating film formed from the first inter-layer insulating film to a second film thickness so as to cover the surfaces of the first inter-layer insulating film, the first wiring patterns, the dummy pattern; and second wiring patterns formed on the surface of the second inter-layer insulating film and wherein the dummy pattern has no planar overlapped portion with respect to the second wiring patterns, that is, it is separated from the second wiring patterns in top view.
摘要:
A static random access memory comprises a first power source, a second power source, a first resistor connected at one end to the first power source, a second resistor connected at one end to the first power source, a first FET including a first source connected to the second power source, a first drain connected to the other end of the first resistor, and a first gate arranged in parallel and electrically connected to the second resistor, via an insulating film, thereby varying a resistance value of the second resistor, and a second FET including a second source connected to the second power source, a second drain connected to the other end of the second resistor, and a second gate arranged in parallel and electrically connected to the first resistor, via an insulating film, thereby varying a resistance value of the first resistor.
摘要:
A semiconductor device comprising a semiconductor substrate having a principal surface constituted by crystal plane (100) formed with a groove, which is utilized for an element isolation region, a capacitor element, etc., wherein at least one of the side wall surfaces of the groove is constituted by a (100) crystal plane. There is also proposed a method of forming a groove having at least one crystal plane side surface in a crystal plane surface of a semiconductor substrate.
摘要:
A method and an apparatus for wrapping an elongated article with using a tranfer printing film are provided. A transfer printing film comprising a substrate film and a pattern-decorated transfer layer on the substrate film is drawn out from a roll thereof, and fed to a surface of the article which is conveyed horizontally by the convey rollers. The printing film is subject to an adhesive application during the travel to the article on the rollers. A hot melt type adhesive is employed as the adhesive, which type of adhesive can be easily regulated in thickness by an applicator. The printing film adheres to the article by the thick hot melt type adhesive to the article surface, and pressed with heat to transfer the decorated transfer layer with adhesive together integrally. Peeling off the substrate film finally, a smooth, quality and decrated article with a pattern such as the grain of wood or stone is obtained superior in appearance, because the thick hot melt type adhesion between the transfer layer and the article satisfactorily cover the cracks, flaws, roughness of the article.
摘要:
A semiconductor device includes a semiconductor body of one conductivity type, source and drain regions formed in the surface area of the semiconductor body, a gate insulating film formed on the semiconductor body between the source and drain regions, a gate electrode formed on the gate insulating film, an insulating member formed on the source and drain regions and in contact with the side walls of the gate electrode. Each of the source and drain regions includes a first impurity region of the opposite conductivity type and a second impurity region having a higher impurity concentration than that of the first impurity region and formed in the first impurity region to extend below the gate electrode.