公开(公告)号：US09849197B2

公开(公告)日：2017-12-26

申请号：US14002327

申请日：2012-03-01

申请人： Hideo Saji ,  Shunsaku Kimura ,  Masahiro Ono ,  Takashi Temma ,  Isao Hara ,  Eiichi Ozeki

发明人： Hideo Saji ,  Shunsaku Kimura ,  Masahiro Ono ,  Takashi Temma ,  Isao Hara ,  Eiichi Ozeki

IPC分类号： A61K9/00 ,  A61K49/00

CPC分类号： A61K49/0054 ,  A61K49/0032 ,  A61K49/0034 ,  A61K49/0069 ,  A61K49/0093

摘要： [Problem] To provide a novel fluorescent nanoparticle imaging probe having a switching function (a function to quench a fluorescent dye in a blood component and emit fluorescence in a tumor or an inflamed site to be imaged).[Solution] A fluorescent nanoparticle probe comprising: a molecular assembly composed of an amphiphilic block polymer having a hydrophilic block chain and a hydrophobic block chain; and a fluorescent dye encapsulated in the assembly, wherein (a) the hydrophilic block chain comprises, as an essential hydrophilic structural unit, a unit selected from a sarcosine unit and an alkylene oxide unit, (b) the hydrophobic block chain comprises, as an essential hydrophobic structural unit, a unit selected from the group consisting of an amino acid unit and a hydroxylic acid unit, and (c) the fluorescent dye is a polylactic acid-bound cyanine compound comprising: a fluorescent group represented by the formula (I): and a polylactic acid group having 5 to 50 lactic acid units, and two or more molecules of the fluorescent dye are encapsulated in the single molecular assembly.

公开(公告)号：US09136717B2

公开(公告)日：2015-09-15

申请号：US13040891

申请日：2011-03-04

申请人： Kyouichi Kashima ,  Yoshitaka Fukushima ,  Masahiro Ono ,  Tetsuro Hirano

发明人： Kyouichi Kashima ,  Yoshitaka Fukushima ,  Masahiro Ono ,  Tetsuro Hirano

IPC分类号： H02H3/00 ,  H02H7/00 ,  H02J7/00 ,  H02H9/00 ,  H02H3/20 ,  H02H9/04 ,  H02H3/22

CPC分类号： H02J7/0016

摘要： A circuit device connected between a neighboring pair of terminals in a semiconductor integrated circuit is protected from electrostatic damage due to a surge voltage when the surge voltage is applied between the neighboring pair of terminals. The semiconductor integrated circuit is formed to include terminals P0-P14, MOS transistors MN0-MN15 in diode connection, protection diode circuits HD0-HD14, MOS transistors T1-T14 for discharging electricity from batteries, a battery voltage detection control circuit and a clamp circuit for overvoltage protection. Each of the MOS transistors T1-T14 for discharging electricity from the batteries is connected between each neighboring pair of the terminals P0-P14 through wirings. Each of the MOS transistors MN1-MN14 in diode connection is connected between each neighboring pair of the terminals.

摘要翻译： 当在相邻的一对端子之间施加浪涌电压时，连接在半导体集成电路中的相邻的一对端子之间的电路装置被防止由于浪涌电压的静电损伤。 半导体集成电路形成为包括端子P0-P14，二极管连接的MOS晶体管MN0-MN15，保护二极管电路HD0-HD14，用于从电池放电的MOS晶体管T1-T14，电池电压检测控制电路和钳位电路 用于过电压保护。 用于从电池放电的MOS晶体管T1-T14中的每一个通过布线连接在每个相邻的一对端子P0-P14之间。 二极管连接的MOS晶体管MN1〜MN14中的每一个连接在每个相邻的一对端子之间。

公开(公告)号：USD703142S1

公开(公告)日：2014-04-22

申请号：US29430583

申请日：2012-08-28

申请人： Hirokazu Hoshino ,  Taijiro Fujiwara ,  Masahiro Ono

设计人： Hirokazu Hoshino ,  Taijiro Fujiwara ,  Masahiro Ono

公开(公告)号：US08636093B2

公开(公告)日：2014-01-28

申请号：US13819317

申请日：2010-08-30

申请人： Yoshitaka Sotoyama ,  Koki Ikeda ,  Shigeru Inamori ,  Kazuhiro Seki ,  Hiroaki Iwamoto ,  Masahiro Ono ,  Sho Maeda

发明人： Yoshitaka Sotoyama ,  Koki Ikeda ,  Shigeru Inamori ,  Kazuhiro Seki ,  Hiroaki Iwamoto ,  Masahiro Ono ,  Sho Maeda

IPC分类号： B62D25/20

CPC分类号： B62D21/15 ,  B62D21/152 ,  B62D25/14 ,  B62D25/20

摘要： To obtain a vehicle body lower portion structure that can efficiently absorb and disperse load of a front or rear collision including an offset collision or an oblique collision, and transmit the load to an underbody. A vehicle body lower portion structure has an underbody at which a dash lower portion and a lower back portion are provided to stand from both ends in a vehicle front-rear direction at a floor portion, a suspension member the length direction thereof is along a vehicle transverse direction and is joined to the underbody in a state of planarly-contacting a front surface of the dash lower portion, and a front EA member a length direction thereof is along the vehicle transverse direction and is joined to a front wall of the suspension member.

摘要翻译： 为了获得能够有效地吸收和分散包括偏移碰撞或倾斜碰撞的前后碰撞的负载的车身下部结构，并将负载传递到底部。 车体下部结构具有底板，底面设置有仪表板下部和下后部，以便在地板部分沿车辆前后方向的两端支撑，其长度方向为沿着车辆 并且在与前下面的前表面平面接触的状态下接合到底体，并且其前方EA构件的长度方向沿着车辆横向方向并且连接到悬架构件的前壁 。

公开(公告)号：US20130202941A1

公开(公告)日：2013-08-08

申请号：US13880282

申请日：2012-05-25

申请人： Masahiro Ono ,  Takashi Nakagawa ,  Akira Takano

发明人： Masahiro Ono ,  Takashi Nakagawa ,  Akira Takano

IPC分类号： H01H85/00 ,  H01H69/02

CPC分类号： H01H85/00 ,  H01H69/02 ,  H01H85/0241 ,  H01H85/12 ,  H01H85/143 ,  H01H85/205 ,  H01M2/30 ,  H01M2/34 ,  H01M10/4207 ,  H01M10/425 ,  H01M2200/103 ,  Y10T29/49107

摘要： A fuse board including a metal plate, a connection portion connected to a cell, a fuse portion connecting the metal plate to the connection portion, and an insulating resin film bonded to the fuse portion, wherein a wiring pattern of the fuse portion has a bent portion, and the insulating resin film has a rectangular sheet-like shape that covers one surface of the fuse portion.

摘要翻译： 一种熔断器板，包括金属板，连接到电池的连接部分，将金属板连接到连接部分的熔丝部分，以及与熔丝部分接合的绝缘树脂膜，其中熔丝部分的布线图案具有弯曲 并且绝缘树脂膜具有覆盖保险丝部分的一个表面的矩形片状形状。

公开(公告)号：US08476449B2

公开(公告)日：2013-07-02

申请号：US13582047

申请日：2011-02-24

申请人： Hideo Saji ,  Masahiro Ono ,  Ikuya Seki

发明人： Hideo Saji ,  Masahiro Ono ,  Ikuya Seki

IPC分类号： C07D405/06 ,  C07D405/14 ,  C07D417/06 ,  C07D417/14 ,  C07F7/22

CPC分类号： C07D417/06 ,  A61K51/0453 ,  C07D405/06 ,  C07D405/14

摘要： The present invention is a compound represented by the following formula (1) or a salt thereof. Furthermore, the present invention is an imaging agent used for imaging a tau protein, the imaging agent containing a compound represented by the formula (1) below or a salt thereof. In the formula (1), R3 is a radioactive iodine.

摘要翻译： 本发明是由下式（1）表示的化合物或其盐。 此外，本发明是用于成像tau蛋白的成像剂，该成像剂含有下述式（1）表示的化合物或其盐。 在式（1）中，R 3是放射性碘。

公开(公告)号：US20110235224A1

公开(公告)日：2011-09-29

申请号：US13040891

申请日：2011-03-04

申请人： Kyouichi KASHIMA ,  Yoshitaka Fukushima ,  Masahiro Ono ,  Tetsuro Hirano

发明人： Kyouichi KASHIMA ,  Yoshitaka Fukushima ,  Masahiro Ono ,  Tetsuro Hirano

IPC分类号： H02H3/00

CPC分类号： H02J7/0016

摘要： A circuit device connected between a neighboring pair of terminals in a semiconductor integrated circuit is protected from electrostatic damage due to a surge voltage when the surge voltage is applied between the neighboring pair of terminals. The semiconductor integrated circuit is formed to include terminals P0-P14, MOS transistors MN0-MN15 in diode connection, protection diode circuits HD0-HD14, MOS transistors T1-T14 for discharging electricity from batteries, a battery voltage detection control circuit and a clamp circuit for overvoltage protection. Each of the MOS transistors T1-T14 for discharging electricity from the batteries is connected between each neighboring pair of the terminals P0-P14 through wirings. Each of the MOS transistors MN1-MN14 in diode connection is connected between each neighboring pair of the terminals.

摘要翻译： 当在相邻的一对端子之间施加浪涌电压时，连接在半导体集成电路中的相邻的一对端子之间的电路装置被防止由于浪涌电压引起的静电损伤。 半导体集成电路形成为包括端子P0-P14，二极管连接的MOS晶体管MN0-MN15，保护二极管电路HD0-HD14，用于从电池放电的MOS晶体管T1-T14，电池电压检测控制电路和钳位电路 用于过电压保护。 用于从电池放电的MOS晶体管T1-T14中的每一个通过布线连接在每个相邻的一对端子P0-P14之间。 二极管连接的MOS晶体管MN1〜MN14中的每一个连接在每个相邻的一对端子之间。

公开(公告)号：US07985078B2

公开(公告)日：2011-07-26

申请号：US12644571

申请日：2009-12-22

申请人： Kentaro Kumazawa ,  Masahiro Ono ,  Yoshihiro Tomura

发明人： Kentaro Kumazawa ,  Masahiro Ono ,  Yoshihiro Tomura

IPC分类号： H01R12/00

CPC分类号： H01R13/52 ,  H05K1/142 ,  H05K3/284 ,  H05K3/361 ,  H05K2201/10977

摘要： The electrode junction structure includes: a glass substrate; a plurality of flexible substrates, in a planar view, arranged to cross over an edge of the glass substrate and arranged to have a space from each other along the edge; an adhesive for joining the glass substrate and each flexible substrate; and a sealing resin for covering junction portions between the glass substrate and each flexible substrate, wherein an edge of the sealing resin is formed so that the edge of the sealing resin has, in the planar view, a consecutive waveform portion in which a convex portion and a concave portion alternate with an imaginary line as a center axis, the imaginary line being parallel to the edge of the glass substrate and locating outer than the edge of the glass substrate, and wherein the convex portions are formed to be located on the flexible substrates.

摘要翻译： 电极结结构包括：玻璃基板; 多个柔性基板在平面图中布置成跨过玻璃基板的边缘并且被布置成沿着边缘彼此具有空间; 用于接合玻璃基板和每个柔性基板的粘合剂; 以及密封树脂，用于覆盖玻璃基板和每个柔性基板之间的接合部分，其中形成密封树脂的边缘，使得密封树脂的边缘在平面图中具有连续的波形部分，其中凸部 并且与假想线交替的凹部作为中心轴，所述假想线平行于所述玻璃基板的边缘并位于所述玻璃基板的边缘的外侧，并且其中所述凸部形成为位于所述柔性 底物。

公开(公告)号：US20110172212A1

公开(公告)日：2011-07-14

申请号：US13051248

申请日：2011-03-18

申请人： Atsushi SAITOU ,  Shigeyuki Kikumoto ,  Masahiro Ono ,  Ryo Matsui ,  Masashi Yamamoto ,  Tomohiro Sawa ,  Shigeru Suzuki ,  Mikiro Yanaka

发明人： Atsushi SAITOU ,  Shigeyuki Kikumoto ,  Masahiro Ono ,  Ryo Matsui ,  Masashi Yamamoto ,  Tomohiro Sawa ,  Shigeru Suzuki ,  Mikiro Yanaka

IPC分类号： A61K31/4178 ,  C07D403/12 ,  C07D403/14 ,  A61K31/4184 ,  C07D233/64 ,  A61K31/417 ,  C07D403/06 ,  A61K31/5513 ,  C07D401/12 ,  A61K31/4439 ,  C07D401/14 ,  A61K31/4725 ,  C07D471/04 ,  A61K31/437 ,  A61K31/454 ,  A61K31/4709 ,  C07D413/14 ,  A61K31/5377 ,  C07D405/14 ,  A61P29/00 ,  A61P35/04 ,  A61P31/12 ,  A61P31/18

CPC分类号： C07D403/12 ,  C07D263/64 ,  C07D401/14 ,  C07D403/14 ,  C07D405/14 ,  C07D413/14 ,  C07D417/14 ,  C07D471/04

摘要： Novel amine compounds which are represented by the following formula (1) and efficacious against diseases such as a viral infectious disease with HIV, rheumatism, and cancer metastasis; typically, A1 and A2 represent a hydrogen atom or a substitutable monocyclic or polycyclic heteroaromatic ring and W represents a substitutable benzene ring or any group represented by the following formula (10) or (11): where X represents O, CH2, C(═O), NR11, or CHR35 and D represents a group represented by the following formula (6): [Formula 4] -Q-Y—B  (6) where Q represents a single bond, NR12, or a group represented by the formula (13): and Y represents a group represented by the following formula (7): [Formula 6] —(CR18R19)m3- or —(CR20R21)m4-z-(CR22R23)m5-  (7) where z represents a substitutable monocyclic or polycyclic aromatic ring; and B represents —NR25R26; and R1 to R26 in the above formulae represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group.

摘要翻译： 由下式（1）表示的新型胺化合物，对HIV，风湿病，癌症转移等病毒感染性疾病有效; 通常，A1和A2表示氢原子或可取代的单环或多环杂芳环，W表示可取代的苯环或由下式（10）或（11）表示的任何基团：其中X表示O，CH 2，C（= O），NR 11或CHR 35，D表示由下式（6）表示的基团：[式4] -QY-B（6）其中Q表示单键，NR12或由式（13）表示的基团 ）：Y表示由下式（7）表示的基团：[式6] - （CR18R19）m3-或 - （CR20R21）m4-z-（CR22R23）m5-（7）其中z表示可取代的单环或 多环芳环; B代表-NR25R26; 上式中的R 1至R 26表示氢原子，烷基，烯基或炔基。

公开(公告)号：US20100207264A1

公开(公告)日：2010-08-19

申请号：US12702804

申请日：2010-02-09

申请人： Masahiro ONO

发明人： Masahiro ONO

IPC分类号： H01L23/488

CPC分类号： H01L23/3128 ,  H01L21/561 ,  H01L23/3135 ,  H01L23/3737 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/552 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K1/095 ,  H05K3/284 ,  H05K2201/0919 ,  H05K2203/1316 ,  H01L2224/81

摘要： A module substrate has an interconnection electrode that is exposed at a side end face thereof. A semiconductor component including an IC chip is mounted on the module substrate. A molded part comprising a resin is formed so as to cover at least a part of the semiconductor component. A coating with higher heat conductivity than the molded part is formed on the surface of the molded part by applying a paste made of material with higher heat conductivity than the molded part. This improves heat dissipation. The coating can be formed such that it extends to the surface of the main substrate on which the module substrate with the semiconductor component is mounted and comes into contact with the interconnection electrode on the surface of the main substrate. This further improves heat dissipation.

摘要翻译： 模块基板具有在其侧端面露出的互连电极。 包括IC芯片的半导体部件安装在模块基板上。 形成包含树脂的成型部，以覆盖半导体部件的至少一部分。 通过施加由比模制部件更高的导热性的材料制成的糊料，在模制部件的表面上形成具有比模制部件更高导热性的涂层。 这改善了散热。 涂层可以形成为使得其延伸到其上安装有半导体部件的模块基板的主基板的表面，并且与主基板的表面上的互连电极接触。 这进一步改善了散热。