摘要:
Methods for light-induced electroplating of aluminum are disclosed herein. Exemplary methods may comprise preparing an ionic liquid comprising aluminum chloride (AlCl3) and an organic halide, placing the silicon substrate into the ionic liquid, illuminating the silicon substrate, the illumination passing through the ionic liquid, and depositing aluminum onto the silicon substrate via a light-induced electroplating process, wherein the light-induced electroplating process utilizes an applied current that does not exceed a photo-generated current generated by the illumination.
摘要:
Principles of the present disclosure present a new concept for solar photovoltaic systems wherein the load to the photovoltaic system is digitally managed. This allows for much higher system efficiency along with a much lower system cost as compared to traditional solar photovoltaic systems in specific applications. By eliminating storage and power electronics typically present in traditional solar photovoltaic systems, exemplary systems achieve a cost reduction of over 50%, while the system efficiency is improved to over 95%.
摘要:
Exemplary methods provide for recovery of valuable industrial metals in connection with recycling of silicon solar cells and modules. Silicon, copper, silver, and the like may be recovered separately, allowing for cost-effective recycling for silicon solar cells and modules.
摘要:
Methods, structures and devices are described, in which structures and devices have one or more p-n homo-junctions fabricated in solution. The junctions are formed by a sequential deposition of an oxide of copper from solution. Conduction type of the oxide of copper is controlled by pH of the solution.
摘要:
The present invention relates generally to a method of improving the performance of solid state devices, and specifically provides methods for passivating a semiconductor surfaces with a monolayer of passivating material.
摘要:
Exemplary methods provide for recovery of valuable industrial metals in connection with recycling of silicon solar cells and modules. Silicon, copper, silver, and the like may be recovered separately, allowing for cost-effective recycling for silicon solar cells and modules.
摘要:
Methods and systems for electrochemically depositing doped metal oxide and metal chalcogenide films are disclosed. An example method includes dissolving a metal precursor into a solution, adding a halogen precursor to the solution, and applying a potential between a working electrode and a counter electrode of an electrochemical cell to deposit halogen doped metal oxide or metal chalcogenide onto a substrate. Another example method includes dissolving a zinc precursor into a solution, adding an yttrium precursor to the solution, and applying a potential between a working electrode and a counter electrode of an electrochemical cell to deposit yttrium doped zinc oxide onto a substrate. Other embodiments are described and claimed.
摘要:
One example embodiment includes a method for applying a transparent conducting oxide. The method includes providing a solution, where the solution includes a solvent, a zinc precursor and an yttrium precursor. The method also includes spraying the solution on a heated substrate, where the heated substrate turns the solution into an yttrium-doped zinc oxide film. The method further includes annealing the film on the substrate in a controlled environment.
摘要:
A method for actuating a system on chip (SOC) includes the following steps. First, determine whether the SOC is connected to a computer system via a communication connection. If no, determine whether a non-volatile memory of the SOC has an initial flag signal. If yes, read correction information stored in the non-volatile memory in response to the initial flag signal and set a corresponding first register of the SOC according to the correction information.
摘要:
Compositions and methods are provided herein that include modifications to at least one surface of a silicon-based semiconductor material. Modifications occur in a liquid and comprise alterations of surface states, passivation, cleaning and/or etching of the surface, thereby providing an improved surface to the semiconductor material. Modifications of surface states include reduction or elimination of an electrically active state of the surface, wherein, at the atomic level, the surface binding characteristics are changed. Passivation includes the termination of dangling bonds on the surface of the semiconductor material.