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21 条记录 (耗时 0.018 秒)

    Preloaded linear beam vibration sensor and its manufacturing method
    3.
    发明授权
    Preloaded linear beam vibration sensor and its manufacturing method 失效
    预载线束振动传感器及其制造方法

    公开(公告)号：US5629243A

    公开(公告)日：1997-05-13

    申请号：US528043

    申请日：1995-09-14

    申请人： Sean S. Cahill ,  Walter Shoeys ,  Kenichi Nakamura

    发明人： Sean S. Cahill ,  Walter Shoeys ,  Kenichi Nakamura

    IPC分类号： G01P15/00 ,  B81B3/00 ,  B81C1/00 ,  G01H11/06 ,  G01P15/08 ,  G01P15/135 ,  H01G5/18

    CPC分类号： G01P15/135 ,  G01P15/0802 ,  G01P2015/0814 ,  G01P2015/0831

    摘要： A method is described for manufacturing a miniaturized accelerometer having a narrow bandwidth and behaving as a switch sensitive only to low frequencies such as are contained in earthquakes. The method includes provision of an unbalanced see-saw beam assembly composed of beams 2 and masses 3 at opposite ends of the beams 2. The beams 2 have their suspension at a location with slightly different distances from the masses 3 along a line parallel to and vertically offset from the line connecting centers of gravity of the masses 3.

    摘要翻译： 描述了一种用于制造具有窄带宽并且表现为仅对诸如包含在地震中的低频敏感的开关的小型化加速度计的方法。 该方法包括在梁2的相对端处设置由梁2和质量块3组成的不平衡跷跷板组件。梁2具有悬挂在距物体3稍微不同的距离处的位置，沿着平行于 垂直偏离连接质心重心的线3。

    Hermetic packaging for semiconductor pressure sensors
    7.
    发明授权
    Hermetic packaging for semiconductor pressure sensors 有权
    半导体压力传感器的气密封装

    公开(公告)号：US06351996B1

    公开(公告)日：2002-03-05

    申请号：US09191718

    申请日：1998-11-12

    申请人： Steven S. Nasiri ,  David W. Burns ,  Janusz Bryzek ,  Sean S. Cahill

    发明人： Steven S. Nasiri ,  David W. Burns ,  Janusz Bryzek ,  Sean S. Cahill

    IPC分类号： G01L904

    CPC分类号： G01L19/147 ,  G01L19/0038 ,  G01L19/0084

    摘要： A hermetic media interface for a sensor package is disclosed. Preferably, the hermetic media interface is incorporated into a pressure sensor package for interfacing directly to fluid and/or gaseous media. In one embodiment, the pressure sensor package includes a semiconductor die and a pressure port that are housed in a pre-molded plastic package. A eutectic solder is coupled between the semiconductor die and the pressure port to solder the same to the semiconductor die. The semiconductor die may be metallized to enhance solderability. In an alternative embodiment, the pressure port is made from one or more plastic materials and the pressure port is attached to the semiconductor die with an adhesive. An integral stress-isolation region may optionally be incorporated on the semiconductor die.

    摘要翻译： 公开了一种用于传感器封装的密封介质接口。 优选地，密封介质界面结合到压力传感器封装中，用于直接与流体和/或气体介质接合。 在一个实施例中，压力传感器封装包括容纳在预模制塑料封装中的半导体管芯和压力端口。 共晶焊料耦合在半导体管芯和压力端口之间以将其焊接到半导体管芯。 半导体管芯可以被金属化以增强可焊性。 在替代实施例中，压力端口由一种或多种塑料材料制成，并且压力端口用粘合剂附接到半导体管芯。 整体应力隔离区可任选地并入半导体管芯上。

    Micromachined circuit elements driven by micromachined DC-to-DC converter on a common substrate
    8.
    发明授权
    Micromachined circuit elements driven by micromachined DC-to-DC converter on a common substrate 失效
    由微加工的DC-DC转换器在公共基板上驱动的微加工电路元件

    公开(公告)号：US6058027A

    公开(公告)日：2000-05-02

    申请号：US251103

    申请日：1999-02-16

    申请人： Douglas A. Vargha ,  Sean S. Cahill

    发明人： Douglas A. Vargha ,  Sean S. Cahill

    IPC分类号： B81B3/00 ,  H01H59/00 ,  H02M3/38 ,  H02M3/42

    CPC分类号： H02M3/38 ,  H02M3/44 ,  H01H59/0009

    摘要： The present invention comprises the combination of one or more micromachined circuit elements and a micromachined DC-to-DC step-up converter on the same or different substrates, so as to allow the operation of the micromachined circuit element at a different voltage, typically a higher or a negative voltage, in comparison to the input power supply to the system. The micromachined structure of such a converter requires little chip area and is normally fully compatible with the micromachined structure of other micromachined circuit elements, such switches and resonators, providing obvious advantages when formed on the same substrate as such devices. Similarly, micromachined switches have the advantage of providing substantially greater isolation between the signal being switched and the signal doing the switching, and provide a much better ratio between the off resistance to the on resistance than can be achieved with transistor switching devices, such as by way of example, MOS switches. Micromachined resonators also offer many advantages, such as an equivalent of tuned circuits with very high Q factor, and do so without requiring inductors or active devices in oscillatory circuits having a risk of instability, and of allowing the realization of the equivalent of complicated tuned circuits in a small chip area.

    摘要翻译： 本发明包括在相同或不同的衬底上组合一个或多个微加工电路元件和微机械加工的DC-DC升压转换器，以便允许微加工电路元件的操作在不同的电压，通常为 与系统的输入电源相比较高或负电压。 这种转换器的微加工结构需要很少的芯片面积，并且通常完全与其它微加工电路元件（例如开关和谐振器）的微加工结构完全兼容，当与这种器件形成在相同的衬底上时，提供了明显的优点。 类似地，微加工开关具有在被切换的信号和进行切换的信号之间提供显着更大的隔离的优点，并且提供比可以用晶体管开关器件实现的关断电阻与导通电阻之间更好的比例，例如通过 例子，MOS开关。 微加工谐振器还具有许多优点，例如等效于具有非常高Q因子的调谐电路，并且不需要在具有不稳定性的风险的振荡电路中的电感器或有源器件，并且允许实现等效于复杂调谐电路 在一个小芯片领域。

    Varying apparent mass accelerometer
    9.
    发明授权
    Varying apparent mass accelerometer 失效
    不同的表观质量加速度计

    公开(公告)号：US5604313A

    公开(公告)日：1997-02-18

    申请号：US346263

    申请日：1994-11-23

    申请人： Sean S. Cahill ,  Kenichi Nakamura

    发明人： Sean S. Cahill ,  Kenichi Nakamura

    IPC分类号： B81B3/00 ,  G01H11/06 ,  G01P15/08 ,  G01P15/125 ,  G01V1/00 ,  G01P15/00 ,  H01G7/00

    CPC分类号： G01P15/0802 ,  G01P15/125 ,  G01V1/008 ,  G01P2015/0828

    摘要： A varying apparent mass accelerometer 1 for detecting earthquake vibrations includes a frame 2 vibrating with an earthquake wave, a mass 51 supported on the frame 2 via a spring 52, electrodes 6 and 7 disposed above and below the mass 51, power sources 8 each applying a voltage across the electrodes 6 and 7, and a capacitance detector 9 for detecting changes in capacitance between the electrodes. The accelerometer 1 exerts a signal only when an acceleration exceeds a threshold.

    摘要翻译： 用于检测地震振动的变化的表观质量加速度计1包括用地震波振动的框架2，经由弹簧52支撑在框架2上的质量51，设置在质量块51上方和下方的电极6和7，每个施加的电源8 电极6和7两端的电压，以及用于检测电极间电容变化的电容检测器9。 加速度计1仅在加速度超过阈值时施加信号。

    Method of making superhard tips for micro-probe microscopy and field emission
    10.
    发明授权
    Method of making superhard tips for micro-probe microscopy and field emission 失效
    制作超微观尖端的方法，用于微探针显微镜和场发射

    公开(公告)号：US5393647A

    公开(公告)日：1995-02-28

    申请号：US92780

    申请日：1993-07-16

    申请人： Armand P. Neukermans ,  Timothy G. Slater ,  Linda E. Whittlesey ,  Sean S. Cahill

    发明人： Armand P. Neukermans ,  Timothy G. Slater ,  Linda E. Whittlesey ,  Sean S. Cahill

    IPC分类号： G01Q70/10 ,  B81C1/00 ,  C23C16/00 ,  G01Q70/14 ,  G01Q70/16 ,  H01J9/02 ,  H01J37/073 ,  H01L21/302

    CPC分类号： G01Q70/16 ,  B81C1/00682 ,  B82Y35/00 ,  G01Q70/14 ,  H01J9/025 ,  B81B2201/12 ,  H01J2209/0226

    摘要： Forming micro-probe tips for an atomic force microscope, a scanning tunneling microscope, a beam electron emission microscope, or for field emission, by first thinning a tip of a first material, such as silicon. The tips are then reacted with a second material, such as atoms from an organic or ammonia vapor, at a temperature of about 1000.degree. C..+-.200.degree. C. and vacuum conditions for several minutes. Vapors such as methane, propane or acetylene will be converted to SiC or WC while ammonia will be converted to Si.sub.3 N.sub.4. The converted material will have different physical, chemical and electrical properties. For example, a SiC tip will be superhard, approaching diamond in hardness. Electrically conductive tips are suitable for field emission.

    摘要翻译： 通过首先使诸如硅的第一材料的尖端变薄，形成用于原子力显微镜，扫描隧道显微镜，束电子发射显微镜或用于场发射的微探针尖端。 然后将尖端与第二种材料（例如来自有机或氨蒸汽的原子）在约1000℃±200℃的温度和真空条件下反应数分钟。 蒸气如甲烷，丙烷或乙炔将转化为SiC或WC，而氨将转化为Si3N4。 转换的材料将具有不同的物理，化学和电学性能。 例如，SiC尖端将是超硬的，接近金刚石的硬度。 导电尖端适用于场发射。