摘要:
A back contact back junction solar cell using semiconductor wafers and methods for manufacturing are provided. The back contact back junction solar cell comprises a semiconductor wafer having a doped base region, a light capturing frontside surface, and a doped backside emitter region. A frontside and backside dielectric layer and passivation layer provide enhance light trapping and internal reflection. Backside base and emitter contacts are connected to metal interconnects forming a metallization pattern of interdigitated fingers and busbars on the backside of the solar cell.
摘要:
A back contact solar cell with on-cell electronics is provided. The back contact solar cell is comprised of a semiconductor substrate having a light capturing front side and a backside opposite the light capturing front side. A first interdigitated metallization pattern is positioned on the backside of the semiconductor substrate and a backplane supports and is attached to the backside of the semiconductor substrate. A second interdigitated metallization pattern positioned on the backplane and is connected to the first interdigitated metallization pattern. An on-cell electronic component is attached to the second interdigitated metallization pattern and electrical leads connect the on-cell electronic component to the second interdigitated metallization pattern.
摘要:
A back contact solar cell comprises an active semiconductor absorber for use in a back contact solar cell having a light capturing front side and a backside opposite the light capturing front side. A first interdigitated metallization is positioned over the backside of the active semiconductor absorber. The first interdigitated metallization forming base and emitter contact metallization of the back contact solar cell. A backplane is positioned over the backside of the active semiconductor absorber and the first interdigitated metallization. A second interdigitated metallization is positioned over the backplane. The second interdigitated metallization is connected to the first interdigitated metallization for extracting photovoltaic power from the active semiconductor absorber. The second interdigitated metallization has base and emitter busbars over the backplane for electrical connection. An electronic component is electrically connected to at least a base busbar and at least an emitter busbar of the second interdigitated metallization. The electronic component has a bypass switch.
摘要:
Solar cell array solutions including monolithic solar cell arrays and fabrication methods. A first patterned cell metallization contacts base and emitter regions of each of a plurality of solar cells having a light receiving frontside and a backside. An electrically insulating continuous backplane layer is attached to the backside of the solar cells and covers the first cell metallization of each of the solar cells. Via holes through the continuous backplane layer provide access to the first cell metallization. A second cell metallization is connected to the first cell metallization of each of the solar cells and electrically interconnects the solar cells in the array.
摘要:
Fabrication methods and structures relating to backplanes for back contact solar cells that provide for solar cell substrate reinforcement and electrical interconnects as well as Fabrication methods and structures for forming thin film back contact solar cells are described.
摘要:
Fabrication methods and structures relating to backplanes for back contact solar cells that provide for solar cell substrate reinforcement and electrical interconnects as well as Fabrication methods and structures for forming thin film back contact solar cells are described.
摘要:
A dual layer insect screen assembly for fenestration units has a first screening layer for blocking passage of insects through the fenestration unit. A second screening layer is moveable over the first screening layer to provide additional shading, light reflection, and other variable optical effects, while still allowing ventilation through the fenestration unit.