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    LASER ANNEALING APPLICATIONS IN HIGH-EFFICIENCY SOLAR CELLS
    3.
    发明申请
    LASER ANNEALING APPLICATIONS IN HIGH-EFFICIENCY SOLAR CELLS 审中-公开
    激光退火在高效太阳能电池中的应用

    公开(公告)号：US20130164883A1

    公开(公告)日：2013-06-27

    申请号：US13303488

    申请日：2011-11-23

    申请人： Mehrdad M. Moslehi ,  Virendra V. Rana ,  Sean M. Seutter ,  Anand Deshpande

    发明人： Mehrdad M. Moslehi ,  Virendra V. Rana ,  Sean M. Seutter ,  Mitiku Getahun ,  Anand Deshpande

    IPC分类号： H01L31/18

    CPC分类号： H01L31/18 ,  B23K26/0006 ,  B23K26/0624 ,  B23K26/352 ,  B23K26/354 ,  B23K26/361 ,  B23K26/40 ,  B23K2103/16 ,  B23K2103/50 ,  B23K2103/56 ,  H01L31/022441 ,  H01L31/035281 ,  H01L31/068 ,  H01L31/0682 ,  H01L31/1804 ,  H01L31/1864 ,  H01L31/1896 ,  Y02E10/547 ,  Y02P70/521

    摘要： Various laser processing schemes are disclosed for producing various types of hetero-junction and homo-junction solar cells. The methods include base and emitter contact opening, selective doping, metal ablation, annealing to improve passivation, and selective emitter doping via laser heating of aluminum. Also, laser processing schemes are disclosed that are suitable for selective amorphous silicon ablation and selective doping for hetero-junction solar cells. Laser ablation techniques are disclosed that leave the underlying silicon substantially undamaged. These laser processing techniques may be applied to semiconductor substrates, including crystalline silicon substrates, and further including crystalline silicon substrates which are manufactured either through wire saw wafering methods or via epitaxial deposition processes, or other cleavage techniques such as ion implantation and heating, that are either planar or textured/three-dimensional. These techniques are highly suited to thin crystalline semiconductor, including thin crystalline silicon films.

    摘要翻译： 公开了用于生产各种类型的异质结和同质结太阳能电池的各种激光处理方案。 这些方法包括基极和发射极接触开口，选择性掺杂，金属烧蚀，退火以改善钝化，以及通过激光加热铝的选择性发射极掺杂。 此外，公开了适用于异质结太阳能电池的选择性非晶硅消融和选择性掺杂的激光处理方案。 公开了激光烧蚀技术，使基底硅基本上没有损坏。 这些激光处理技术可以应用于包括晶体硅衬底的半导体衬底，并且还包括通过线锯晶片化方法或经由外延沉积工艺或诸如离子注入和加热的其它切割技术制造的晶体硅衬底，其是 平面或纹理/三维。 这些技术非常适用于薄晶体半导体，包括薄晶体硅薄膜。

    Methods of indicating states of software processes cooperating on a single task
    5.
    发明授权
    Methods of indicating states of software processes cooperating on a single task 失效
    指示在单个任务上协作的软件过程状态的方法

    公开(公告)号：US5388268A

    公开(公告)日：1995-02-07

    申请号：US234496

    申请日：1994-04-28

    申请人： Brian W. Beach ,  Anand Deshpande ,  Wendy L. Fong ,  Pankaj K. Garg ,  Audrey K. Ishizaki ,  Thuan Q. Pham

    发明人： Brian W. Beach ,  Anand Deshpande ,  Wendy L. Fong ,  Pankaj K. Garg ,  Audrey K. Ishizaki ,  Thuan Q. Pham

    IPC分类号： G06F11/30 ,  G06F11/32 ,  G06F11/34 ,  G06F11/00

    CPC分类号： G06F11/328 ,  G06F11/322 ,  Y10S707/99934 ,  Y10S715/966 ,  Y10S715/97

    摘要： A visual display system providing an operator simultaneous descriptions of the states of many cooperating sub-processes working on a task and residing in various instruments in a distributed system. A server process is connected to receive and translate status signals from the sub-processes into a standardized language. The translated signals are interpreted by a screen manipulation program. A monitor, connected to the server process, displays the interpreted signals to show the states of the sub-processes. The visual indication on the monitor includes a plurality of representations of indicator lights. Each indicator light indicates the state of one of the sub-processes. Next to each indicator light is an identifier which identifies the sub-process represented by the indicator light. The visual indication also includes two types of meters. One type of meter indicates the speed of one of the sub-processes and the other indicates the amount of data used at any given time by one of the sub-processes. Finally, a picture of each of the operators using the system is also included in the indication. In one embodiment, the present invention is implemented to monitor a rule-based programming environment using the X Window System.

    摘要翻译： 视觉显示系统，提供操作员同时描述在工作在任务上并驻留在分布式系统中的各种仪器中的许多合作子过程的状态。 连接服务器进程以将状态信号从子进程接收并转换为标准化语言。 翻译的信号由屏幕操纵程序解释。 连接到服务器进程的监视器显示解释的信号以显示子进程的状态。 监视器上的视觉指示包括指示灯的多个表示。 每个指示灯指示其中一个子进程的状态。 每个指示灯旁边是标识由指示灯表示的子过程的标识符。 视觉指示还包括两种类型的米。 一种类型的仪表表示其中一个子进程的速度，另一种表示通过其中一个子进程在任何给定时间使用的数据量。 最后，使用该系统的每个操作员的图片也包括在指示中。 在一个实施例中，本发明被实现为使用X Window系统监视基于规则的编程环境。

    Device for sound based monitoring of machine operations and method for operating the same
    6.
    发明授权
    Device for sound based monitoring of machine operations and method for operating the same 有权

    公开(公告)号：US10976730B2

    公开(公告)日：2021-04-13

    申请号：US16627176

    申请日：2018-07-11

    申请人： Anand Deshpande ,  Aniruddha Pant

    发明人： Anand Deshpande ,  Aniruddha Pant

    IPC分类号： G05B23/02 ,  G06N20/00 ,  G08B21/18 ,  G10L25/51

    摘要： A device for monitoring an operating condition of a machine is disclosed. The device includes a sound detection device located in proximity to the machine and configured to collect a plurality of sound signals in real-time from the machine. The device also includes a processor electrically coupled to the sound detection device. The processor is configured to acquire one or more predefined sound analytics models associated with the machine. The processor is also configured to analyse the plurality of sound signals based on the one or more predefined sound analytics models. The processor is further configured to identify the operating condition of the machine based on an analysed result and the one or more predefined sound analytics models. The device also includes a sound analytics system which is further configured to update the one or more predefined sound analytics models based on the plurality of sound signals.

    Traffic classification and control on a network node
    7.
    发明授权
    Traffic classification and control on a network node 有权
    网络节点上的流量分类和控制

    公开(公告)号：US08738906B1

    公开(公告)日：2014-05-27

    申请号：US13308212

    申请日：2011-11-30

    申请人： Dhananjay Sampath ,  Chetan Anand ,  Arjun Sambamoorthy ,  Anand Deshpande

    发明人： Dhananjay Sampath ,  Chetan Anand ,  Arjun Sambamoorthy ,  Anand Deshpande

    IPC分类号： H04N21/80 ,  H04N21/83

    CPC分类号： H04L47/2441 ,  H04L45/306 ,  H04L47/14 ,  H04L63/0245 ,  H04N21/643 ,  H04W28/06

    摘要： A system may identify one or more attributes associated with traffic. The system may then determine that at least one attribute, of the one or more attributes, matches an attribute of a set of attributes that correspond to a set of categories of traffic. Based on determining that the at least one attribute matches the attribute of the set of attributes, the system may identify a category, of the set of categories, that corresponds to the attribute. The system may associate the category with the traffic, and process the traffic based on the associated category.

    摘要翻译： 系统可以识别与流量相关联的一个或多个属性。 系统然后可以确定一个或多个属性中的至少一个属性与一组属性对应于一组业务类别的属性相匹配。 基于确定所述至少一个属性与所述属性集合的属性相匹配，所述系统可以识别与所述属性对应的所述类别集合中的类别。 系统可以将该类别与流量相关联，并且基于相关联的类别来处理流量。

    Removable package underside device attach
    9.
    发明授权
    Removable package underside device attach 有权
    可拆卸包装下装置附件

    公开(公告)号：US07729121B1

    公开(公告)日：2010-06-01

    申请号：US12317855

    申请日：2008-12-30

    申请人： Anand Deshpande ,  Venkat Natarajan ,  Ashok Kabadi ,  Vittal Kini

    发明人： Anand Deshpande ,  Venkat Natarajan ,  Ashok Kabadi ,  Vittal Kini

    IPC分类号： H05K7/20

    CPC分类号： H01L23/3677 ,  H01L23/40 ,  H01L23/427 ,  H01L2224/73253 ,  H05K1/0203 ,  H05K1/141 ,  H05K3/325 ,  H05K2201/10159 ,  H05K2201/10325 ,  H05K2201/10477 ,  H05K2201/10719

    摘要： In some embodiments, a stacked package assembly may include a first socket defining an interior cavity, a first semiconductor device coupled to the first socket, a second socket positioned within the interior cavity of the first socket, and a second semiconductor device removably coupled to the second socket within the cavity of the first socket. The second socket may be positioned between the first semiconductor device and the second semiconductor device and provide an electrical connection between the first semiconductor device and the second semiconductor device. Other embodiments are disclosed and claimed.

    摘要翻译： 在一些实施例中，堆叠的包装组件可以包括限定内部空腔的第一插座，耦合到第一插座的第一半导体器件，位于第一插座的内部空腔内的第二插座，以及可移除地耦合到 在第一插座的腔内的第二插座。 第二插座可以位于第一半导体器件和第二半导体器件之间，并且在第一半导体器件和第二半导体器件之间提供电连接。 公开和要求保护其他实施例。