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    Joining device and joining position adjustment method using joining device
    2.
    发明授权
    Joining device and joining position adjustment method using joining device 有权
    使用接合装置的接合装置和接合位置调整方法

    公开(公告)号：US09263312B2

    公开(公告)日：2016-02-16

    申请号：US14351425

    申请日：2012-09-13

    申请人： Michikazu Nakamura ,  Masahiko Sugiyama ,  Hajime Furuya ,  Naoki Akiyama ,  Yosuke Omori

    发明人： Michikazu Nakamura ,  Masahiko Sugiyama ,  Hajime Furuya ,  Naoki Akiyama ,  Yosuke Omori

    IPC分类号： B32B41/00 ,  H01L21/68 ,  H01L21/67

    CPC分类号： H01L21/68 ,  H01L21/67092 ,  Y10T156/1744

    摘要： A joining device includes a first holding unit configured to load and hold the first member on its top surface; a second holding unit disposed above the first holding unit while facing the first holding unit and configured to hold the second member; and a position adjustment mechanism configured to adjust a joining position between the first member held by the first holding unit and the second member held by the second holding unit. The second holding unit is of a circular plate shape, and the position adjustment mechanism includes four position-adjusting cam members disposed at equal intervals along an outer peripheral surface of the second holding unit, and moves the second holding unit in a horizontal direction.

    摘要翻译： 接合装置包括：第一保持单元，其构造成在其顶表面上加载和保持第一构件; 第二保持单元，其设置在所述第一保持单元的上方，同时面向所述第一保持单元并且构造成保持所述第二构件; 以及位置调整机构，其构造成调整由所述第一保持单元保持的所述第一构件与由所述第二保持单元保持的所述第二构件之间的接合位置。 第二保持单元是圆板形状，并且位置调节机构包括沿着第二保持单元的外周表面等间隔设置的四个位置调节凸轮构件，并且使第二保持单元沿水平方向移动。

    PICKUP METHOD AND PICKUP DEVICE
    3.
    发明申请
    PICKUP METHOD AND PICKUP DEVICE 审中-公开
    撷取方法和撷取装置

    公开(公告)号：US20150214088A1

    公开(公告)日：2015-07-30

    申请号：US13819033

    申请日：2011-06-30

    申请人： Ken Nakao ,  Michikazu Nakamura ,  Itaru Iida ,  Muneo Harada

    发明人： Ken Nakao ,  Michikazu Nakamura ,  Itaru Iida ,  Muneo Harada

    IPC分类号： H01L21/683 ,  B32B43/00 ,  H01L21/67 ,  B25J15/06

    CPC分类号： H01L21/6835 ,  B25J15/0616 ,  B32B43/006 ,  H01L21/67011 ,  H01L21/67132 ,  H01L21/6836 ,  H01L21/6838 ,  H01L2221/68327 ,  Y10T156/1132 ,  Y10T156/1933

    摘要： Disclosed is a pickup method in which a first suction unit is caused to approach and come into contact with a chip adhered to an adhesive sheet, and a second suction unit which is formed with a concavity on a contact surface configured to come into contact with the adhesive sheet is caused to approach and come into contact with the adhesive sheet in such a manner as to be opposite to the first suction unit. The adhesive sheet is sucked by the second suction unit that is in contact with the adhesive sheet, and a fluid is injected between the adhesive sheet and the chip by an injection unit. As a result, the adhesive sheet is detached from a portion of the chip opposite to the concavity, and in the state where the chip is being sucked by the first suction unit, the first suction unit is caused to be spaced away from the adhesive sheet that is being sucked by the second suction unit. In this manner, the chip is detached and picked up from the adhesive sheet.

    摘要翻译： 公开了一种拾取方法，其中使第一吸引单元接近并与粘附到粘合片上的芯片接触;以及第二抽吸单元，其形成在接触表面上的与凹部接触的接触表面上的凹部 使粘合片以与第一抽吸单元相对的方式接近并与粘合片接触。 通过与粘合片接触的第二抽吸单元吸附粘合片，并且通过注射单元将流体注入粘合片和芯片之间。 结果，粘合片与芯片的与凹部相反的部分分离，并且在芯片被第一吸引单元吸附的状态下，使第一吸引单元与粘合片隔开 其被第二抽吸单元吸入。 以这种方式，将芯片从粘合片上分离并拾取。