公开(公告)号：US08866385B2

公开(公告)日：2014-10-21

申请号：US13222837

申请日：2011-08-31

申请人： Toshitake Kitagawa ,  Makoto Sakai ,  Daigo Suzuki ,  Michinobu Inoue

发明人： Toshitake Kitagawa ,  Makoto Sakai ,  Daigo Suzuki ,  Michinobu Inoue

IPC分类号： H01J7/44 ,  F21V3/02 ,  F21K99/00 ,  F21V17/10 ,  F21V23/00 ,  F21V3/00 ,  F21V5/04 ,  F21Y101/02

CPC分类号： F21V17/101 ,  F21K9/232 ,  F21K9/238 ,  F21K9/60 ,  F21V3/00 ,  F21V5/04 ,  F21V23/006 ,  F21Y2115/10

摘要： A self-ballasted lamp includes a base body, a light source unit attached to one side of the base body, a lens attached to the light source unit, a cap provided on the other side of the base body and a lighting circuit arranged in the space provided by the base body and the cap. The light source unit includes a light source constituted by semiconductor light emitting elements. The lens has a lens body facing the light source and an attachment leg for attaching the lens body to the light source unit. A claw portion to be secured to the light source unit can be provided on the attachment leg.

摘要翻译： 一种自镇流灯包括基体，安装在基体一侧的光源单元，安装在光源单元上的透镜，设置在基体另一侧的盖和布置在基体中的点亮电路 由基体和盖提供的空间。 光源单元包括由半导体发光元件构成的光源。 透镜具有面向光源的透镜体和用于将透镜体附接到光源单元的附接腿。 可以在附接腿上设置要固定到光源单元的爪部。

公开(公告)号：US20130063957A1

公开(公告)日：2013-03-14

申请号：US13601217

申请日：2012-08-31

申请人： Makoto SAKAI ,  Takumi Suwa ,  Shinji Nakata ,  Daigo Suzuki ,  Izuru Komatsu ,  Michinobu Inoue ,  Kumiko Ioka ,  Kazuki Tateyama ,  Yasuhide Okada

发明人： Makoto SAKAI ,  Takumi Suwa ,  Shinji Nakata ,  Daigo Suzuki ,  Izuru Komatsu ,  Michinobu Inoue ,  Kumiko Ioka ,  Kazuki Tateyama ,  Yasuhide Okada

IPC分类号： F21V21/00 ,  F21V17/00

CPC分类号： F21V3/00 ,  F21K9/232 ,  F21K9/60 ,  F21V29/713 ,  F21V29/74 ,  F21Y2115/10 ,  Y10T29/49002

摘要： A lighting device according to an embodiment includes a main body unit, a light source which is provided at one end portion of the main body unit, and includes a light emitting element, a globe which is provided so as to cover the light source, and a heat conducting unit whose end surface on the globe side is exposed on the outside of the globe, and which thermally bonds the globe and a heat radiating surface of the main body unit on the end portion side. The heat conducting unit includes a plate-shaped unit in which a first plate-shaped body, and a second plate-shaped body which crosses the first plate-shaped body are integrally formed.

摘要翻译： 根据实施例的照明装置包括主体单元，设置在主体单元的一个端部处的光源，并且包括发光元件，设置成覆盖光源的球面，以及 导体单元，其在球面侧的端面暴露在球体的外侧，并且在端部侧热接合球体和主体单元的散热面。 导热单元包括板状单元，其中第一板状体和与第一板状体交叉的第二板状体一体形成。

公开(公告)号：USD668364S1

公开(公告)日：2012-10-02

申请号：US29414158

申请日：2012-02-24

申请人： Junichiro Yamamoto ,  Shigeru Motoki ,  Makoto Sakai ,  Takumi Suwa ,  Michinobu Inoue

设计人： Junichiro Yamamoto ,  Shigeru Motoki ,  Makoto Sakai ,  Takumi Suwa ,  Michinobu Inoue

公开(公告)号：US07972884B2

公开(公告)日：2011-07-05

申请号：US12399348

申请日：2009-03-06

申请人： Susumu Obata ,  Michinobu Inoue ,  Takeshi Miyagi

发明人： Susumu Obata ,  Michinobu Inoue ,  Takeshi Miyagi

IPC分类号： H01L21/00

CPC分类号： B81B3/0078 ,  B81B2201/016 ,  B81B2203/0109 ,  H01H1/50 ,  H01H3/60 ,  H01H59/0009 ,  Y10T29/49002

摘要： An example of the present invention is a micromechanical device including, a substrate in which a signal line is provided, a micromachine which is mounted on the substrate, is formed of a conductive material into a beam-like shape, is elastically deformed by a function of an electric field in such a manner that the beam-like part moves closer to or apart from the signal line, and changes the electric characteristics concomitantly with the deformation, a deformation restraint section constituted of a material having a higher viscosity coefficient than the conductive material, provided on the opposite side of the micromachine to the signal line, for restraining deformation of the micromachine in a direction in which the micromachine is separated from the signal line, and a sealing body provided on the principal surface of the substrate, for covering the micromachine with a hollow section located therebetween.

摘要翻译： 本发明的一个实例是一种微机械装置，其特征在于，包括：设置有信号线的基板，安装在基板上的微机械，由导电材料形成为梁状，通过功能弹性变形 电场的方式使得束状部分靠近信号线或离开信号线移动，并且随着变形而改变电特性，变形抑制部分由具有比导电性更高的粘度系数的材料构成 材料，其设置在所述微机械相对于所述信号线的相反侧，用于限制所述微机械从所述微机械与所述信号线分离的方向上的变形;以及设置在所述基板主表面上的密封体， 具有位于其间的中空部分的微机械。

公开(公告)号：US20080297992A1

公开(公告)日：2008-12-04

申请号：US12128956

申请日：2008-05-29

申请人： Susumu OBATA ,  Michinobu Inoue ,  Takeshi Miyagi

发明人： Susumu OBATA ,  Michinobu Inoue ,  Takeshi Miyagi

IPC分类号： H05K7/00 ,  H01L21/00

CPC分类号： B81C1/00333 ,  B81C2203/0136 ,  B81C2203/0145 ,  H01L29/84

摘要： A hollow sealing structure includes, a substrate, a functional element portion disposed on a principal surface of the substrate, and a covering portion disposed over the principal surface of the substrate to form a hollow portion in which the covering portion covers the functional element portion, the covering portion including a first covering structure portion having a plurality of openings, second covering structure portions disposed individually on imaginary straight lines which connect the functional element portion and the openings, and a sealing structure portion which seals gaps defined between the first covering structure portion and the second covering structure portions.

摘要翻译： 中空密封结构包括：基板，设置在基板的主表面上的功能元件部分和设置在基板的主表面上的覆盖部分，以形成覆盖部分覆盖功能元件部分的中空部分， 所述覆盖部分包括具有多个开口的第一覆盖结构部分，分别设置在连接所述功能元件部分和所述开口的假想直线上的第二覆盖结构部分和密封结构部分，所述密封结构部分密封限定在所述第一覆盖结构部分 和第二覆盖结构部分。

公开(公告)号：US08956017B2

公开(公告)日：2015-02-17

申请号：US13405668

申请日：2012-02-27

申请人： Kumiko Ioka ,  Michinobu Inoue ,  Hideo Nishiuchi ,  Kazuki Tateyama ,  Koki Moriya

发明人： Kumiko Ioka ,  Michinobu Inoue ,  Hideo Nishiuchi ,  Kazuki Tateyama ,  Koki Moriya

IPC分类号： B60Q3/04 ,  F21V15/00 ,  B60Q1/06 ,  F21V29/00 ,  F21K99/00 ,  F21V23/02 ,  F21Y101/02

CPC分类号： F21K9/1355 ,  F21K9/23 ,  F21V23/02 ,  F21V29/75 ,  F21V29/76 ,  F21Y2115/10

摘要： A lighting apparatus includes a case, a power source unit, and a light emitting unit. The case has a side portion provided around a first axis parallel to a direction from the power source unit toward the light emitting unit. The side portion has a first portion and a second portion disposed around a central axis parallel to the first axis. The first portion has a long distance to the central axis. The second portion has a short distance to the central axis. An end portion of an inner surface of the second portion is configured to have at least one selected from a portion perpendicular to the central axis and a portion has a recessed configuration with respect to the central axis when the inner surface is cut by a cross-section perpendicular to the central axis.

摘要翻译： 照明装置包括壳体，电源单元和发光单元。 壳体具有围绕平行于从电源单元朝向发光单元的方向的第一轴线设置的侧部。 侧部具有围绕平行于第一轴线的中心轴线设置的第一部分和第二部分。 第一部分与中心轴的距离很长。 第二部分与中心轴的距离很短。 第二部分的内表面的端部构造成具有从垂直于中心轴线的部分中选择的至少一个部分，并且当内表面被切断时，部分具有相对于中心轴线的凹陷构造， 垂直于中心轴的截面。

公开(公告)号：US08241937B2

公开(公告)日：2012-08-14

申请号：US13221634

申请日：2011-08-30

申请人： Akihiko Happoya ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

发明人： Akihiko Happoya ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

IPC分类号： H01L21/00

CPC分类号： H01L33/62 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An optical semiconductor device includes a light emitting element having a first surface and a second surface, the first surface having a first electrode provided thereon, the second surface being located on the opposite side from the first surface and having a second electrode provided thereon; a first conductive member connected to the first surface; a second conductive member connected to the second surface; a first external electrode connected to the first conductive member; a second external electrode connected to the second conductive member; and an enclosure sealing the light emitting element, the first conductive member, and the second conductive member between the first external electrode and the second external electrode, and being configured to transmit light emitted from the light emitting element.

摘要翻译： 光学半导体器件包括具有第一表面和第二表面的发光元件，所述第一表面具有设置在其上的第一电极，所述第二表面位于与所述第一表面相对的一侧，并且具有设置在其上的第二电极; 连接到第一表面的第一导电构件; 连接到第二表面的第二导电构件; 连接到第一导电构件的第一外部电极; 连接到第二导电构件的第二外部电极; 以及将所述发光元件，所述第一导电构件和所述第二导电构件密封在所述第一外部电极和所述第二外部电极之间并且被配置为透射从所述发光元件发射的光的外壳。

公开(公告)号：US08039857B2

公开(公告)日：2011-10-18

申请号：US12552504

申请日：2009-09-02

申请人： Akihiko Happoya ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

发明人： Akihiko Happoya ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An optical semiconductor device includes a light emitting element having a first surface and a second surface, the first surface having a first electrode provided thereon, the second surface being located on the opposite side from the first surface and having a second electrode provided thereon; a first conductive member connected to the first surface; a second conductive member connected to the second surface; a first external electrode connected to the first conductive member; a second external electrode connected to the second conductive member; and an enclosure sealing the light emitting element, the first conductive member, and the second conductive member between the first external electrode and the second external electrode, and being configured to transmit light emitted from the light emitting element.

摘要翻译： 光学半导体器件包括具有第一表面和第二表面的发光元件，所述第一表面具有设置在其上的第一电极，所述第二表面位于与所述第一表面相对的一侧，并且具有设置在其上的第二电极; 连接到第一表面的第一导电构件; 连接到第二表面的第二导电构件; 连接到第一导电构件的第一外部电极; 连接到第二导电构件的第二外部电极; 以及将所述发光元件，所述第一导电构件和所述第二导电构件密封在所述第一外部电极和所述第二外部电极之间并且被配置为透射从所述发光元件发射的光的外壳。

公开(公告)号：US08004053B2

公开(公告)日：2011-08-23

申请号：US12255144

申请日：2008-10-21

申请人： Takeshi Miyagi ,  Michinobu Inoue ,  Susumu Obata ,  Yoshiaki Sugizaki

发明人： Takeshi Miyagi ,  Michinobu Inoue ,  Susumu Obata ,  Yoshiaki Sugizaki

IPC分类号： H01L29/84

CPC分类号： B81C1/00293 ,  B81B3/0078 ,  B81C2203/0136 ,  B81C2203/0145 ,  H03H9/1057 ,  Y10T29/49002

摘要： A micromechanical device according to an aspect of the present invention includes, a substrate, a micromachine which is mounted on the substrate, is provided with a mechanism deformed by a function of an electric field, and changes the electrical characteristics concomitantly with the deformation, an inner inorganic sealing film which contains an inorganic material, is provided on a principal surface of the substrate, covers the micromachine through a hollow section containing a gaseous body therein, and is provided with opening shape sections allowing the hollow section to communicate with the outside, an organic sealing film which contains an organic material, is formed on the inner inorganic sealing film, and blocks up the opening shape sections, and an outer inorganic sealing film which contains an inorganic material with lower moisture permeability than the organic material, is formed on the organic sealing film, and covers the organic sealing film.

摘要翻译： 根据本发明的一个方面的微机械装置包括：基板，安装在基板上的微型机械，具有通过电场的功能变形的机构，并且随着变形而改变电特性， 含有无机材料的内无机密封膜设置在基板的主表面上，通过包含气体的中空部分覆盖微机械，并且设置有允许中空部分与外部连通的开口形状部分， 在内无机密封膜上形成含有有机材料的有机密封膜，并且封闭开口形状部分，并且形成包含具有比有机材料低的透湿性的无机材料的外部无机密封膜， 有机密封膜，并覆盖有机密封膜。

公开(公告)号：US20100140639A1

公开(公告)日：2010-06-10

申请号：US12552504

申请日：2009-09-02

申请人： Akihiko HAPPOYA ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

发明人： Akihiko HAPPOYA ,  Kazuhito Higuchi ,  Tomohiro Iguchi ,  Kazuo Shimokawa ,  Takashi Koyanagawa ,  Michinobu Inoue ,  Izuru Komatsu ,  Hisashi Ito

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L33/483 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An optical semiconductor device includes a light emitting element having a first surface and a second surface, the first surface having a first electrode provided thereon, the second surface being located on the opposite side from the first surface and having a second electrode provided thereon; a first conductive member connected to the first surface; a second conductive member connected to the second surface; a first external electrode connected to the first conductive member; a second external electrode connected to the second conductive member; and an enclosure sealing the light emitting element, the first conductive member, and the second conductive member between the first external electrode and the second external electrode, and being configured to transmit light emitted from the light emitting element.

摘要翻译： 光学半导体器件包括具有第一表面和第二表面的发光元件，所述第一表面具有设置在其上的第一电极，所述第二表面位于与所述第一表面相对的一侧，并且具有设置在其上的第二电极; 连接到第一表面的第一导电构件; 连接到第二表面的第二导电构件; 连接到第一导电构件的第一外部电极; 连接到第二导电构件的第二外部电极; 以及将发光元件，第一导电构件和第二导电构件密封在第一外部电极和第二外部电极之间并且被配置为透射从发光元件发射的光的外壳。