公开(公告)号：US20100109016A1

公开(公告)日：2010-05-06

申请号：US12596382

申请日：2008-04-17

申请人： Yuji Yagi ,  Yasushi Yamada ,  Ikuo Nakagawa ,  Takashi Atsumi ,  Mikio Shirai ,  Ikuo Ohnuma ,  Kiyohito Ishida ,  Yoshikazu Takaku

发明人： Yuji Yagi ,  Yasushi Yamada ,  Ikuo Nakagawa ,  Takashi Atsumi ,  Mikio Shirai ,  Ikuo Ohnuma ,  Kiyohito Ishida ,  Yoshikazu Takaku

IPC分类号： H01L23/488 ,  H01L29/12

CPC分类号： H01L23/3735 ,  H01L23/473 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/83447 ,  H01L2224/838 ,  H01L2224/83805 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/1579 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01013 ,  H01L2924/01025 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2224/83205

摘要： Provided is a power semiconductor module in which two components are bonded by a Bi based solder material. A Cu layer is provided on the surfaces thereof to be bonded by the Bi based solder material on the two-component. Two components, i.e., the components to be bonded, are a combination of a semiconductor element and an insulating part, or a combination of an insulating part and a radiator plate. The insulating part is composed of a Cu/SiNx/Cu laminated body.

摘要翻译： 提供了一种功率半导体模块，其中两个部件通过Bi基焊料材料接合。 在其表面上设置有Cu层，以通过Bi基焊料材料粘接在双组分上。 两个部件，即待接合的部件，是半导体元件和绝缘部件的组合，或绝缘部件和散热器板的组合。 绝缘部由Cu / SiNx / Cu层叠体构成。

公开(公告)号：US20100193801A1

公开(公告)日：2010-08-05

申请号：US12669346

申请日：2008-11-19

申请人： Yasushi Yamada ,  Yuji Yagi ,  Yoshikazu Takaku ,  Ikuo Ohnuma ,  Kiyohito Ishida ,  Takashi Atsumi ,  Ikuo Nakagawa ,  Mikio Shirai

发明人： Yasushi Yamada ,  Yuji Yagi ,  Yoshikazu Takaku ,  Ikuo Ohnuma ,  Kiyohito Ishida ,  Takashi Atsumi ,  Ikuo Nakagawa ,  Mikio Shirai

IPC分类号： H01L23/488 ,  H01L21/60 ,  H01L29/12 ,  H01B5/00 ,  B23K35/14 ,  B23K1/20 ,  B05D3/00

CPC分类号： C22C18/04 ,  B23K35/282 ,  B23K35/40 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/29 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29118 ,  H01L2224/29298 ,  H01L2224/32014 ,  H01L2224/83051 ,  H01L2224/83101 ,  H01L2224/83801 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0134 ,  H01L2924/0135 ,  H01L2924/014 ,  H01L2924/1579 ,  H01L2924/19042 ,  H01L2924/351 ,  Y10T428/12222 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/83205

摘要： A zinc based solder material 55 of the present invention is prepared by providing on the surface of a zinc based material 50, from which an oxide film 501 has been removed or at which an oxide film 501 does not exist, with a coating layer 51 containing primarily a metal whose oxide is more easily reducible than the oxide film 501. In a joined body and a power semiconductor module of the present invention, the zinc based solder material 55 is used in the joining portion, and after joining, the coating layer 51 does not exist.

摘要翻译： 本发明的锌基焊料55通过在其上除去氧化膜501或不存在氧化膜501的锌基材料50的表面上设置涂覆层51来制备，该涂层51包含 主要是氧化物比氧化膜501更容易还原的金属。在本发明的接合体和功率半导体模块中，在接合部使用锌基焊料55，在接合后，涂层51 不存在。

公开(公告)号：US20120111550A1

公开(公告)日：2012-05-10

申请号：US13254680

申请日：2010-03-09

申请人： Hiromichi Kuno ,  Yasuji Taketsuna ,  Mikio Shirai ,  Hideo Nakamura ,  Takeshi Yamazaki ,  Haruhiko Ohta ,  Yasuhisa Shinmoto ,  Koichi Suzuki ,  Yoshiyuki Abe ,  Osamu Kawanami

发明人： Hiromichi Kuno ,  Yasuji Taketsuna ,  Mikio Shirai ,  Hideo Nakamura ,  Takeshi Yamazaki ,  Haruhiko Ohta ,  Yasuhisa Shinmoto ,  Koichi Suzuki ,  Yoshiyuki Abe ,  Osamu Kawanami

IPC分类号： F28F1/10

CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28F3/12 ,  H01L2924/0002 ,  H05K7/20936 ,  H01L2924/00

摘要： An ebullient cooling device having a simple structure and capable of limiting the bubbles to an appropriate volume. The ebullient cooling device for cooling a heat generating element is provided with a plurality of vertically arranged cooling channels comprising a lower channel (2), a middle channel (3) and un upper channel (4). Each cooling channel has cooling fins (12) for guiding a refrigerant to flow in a vertical direction, and a vapor discharge path (16) formed at the side of the cooling fins (12) that is opposite the side in contact with the heat generating element. Furthermore, flow path partition/vapor discharge guiding plates (18) are provided between the cooling channels so that the bubbles that have been generated are guided to the vapor discharge path (16) and prevented from moving into the subsequent cooling channel.

摘要翻译： 一种沸腾冷却装置，具有简单的结构并且能够将气泡限制到适当的体积。 用于冷却发热元件的沸腾冷却装置设置有多个垂直布置的冷却通道，其包括下通道（2），中间通道（3）和非上通道（4）。 每个冷却通道具有用于引导制冷剂沿垂直方向流动的冷却片（12）和形成在与发热量接触的一侧相反的散热片（12）侧的蒸汽排出通道（16） 元件。 此外，在冷却通道之间设置有流路分隔/蒸汽排出引导板（18），使得已经产生的气泡被引导到蒸气排放路径（16）并阻止其进入随后的冷却通道。

公开(公告)号：US08283783B2

公开(公告)日：2012-10-09

申请号：US12669346

申请日：2008-11-19

申请人： Yasushi Yamada ,  Yuji Yagi ,  Yoshikazu Takaku ,  Ikuo Ohnuma ,  Kiyohito Ishida ,  Takashi Atsumi ,  Ikuo Nakagawa ,  Mikio Shirai

发明人： Yasushi Yamada ,  Yuji Yagi ,  Yoshikazu Takaku ,  Ikuo Ohnuma ,  Kiyohito Ishida ,  Takashi Atsumi ,  Ikuo Nakagawa ,  Mikio Shirai

IPC分类号： H01L23/48 ,  H01L21/00

CPC分类号： C22C18/04 ,  B23K35/282 ,  B23K35/40 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/29 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29118 ,  H01L2224/29298 ,  H01L2224/32014 ,  H01L2224/83051 ,  H01L2224/83101 ,  H01L2224/83801 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0134 ,  H01L2924/0135 ,  H01L2924/014 ,  H01L2924/1579 ,  H01L2924/19042 ,  H01L2924/351 ,  Y10T428/12222 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/83205

摘要： A zinc based solder material 55 of the present invention is prepared by providing on the surface of a zinc based material 50, from which an oxide film 501 has been removed or at which an oxide film 501 does not exist, with a coating layer 51 containing primarily a metal whose oxide is more easily reducible than the oxide film 501. In a joined body and a power semiconductor module of the present invention, the zinc based solder material 55 is used in the joining portion, and after joining, the coating layer 51 does not exist.

摘要翻译： 本发明的锌基焊料55通过在其上除去氧化膜501或不存在氧化膜501的锌基材料50的表面上设置涂覆层51来制备，该涂层51包含 主要是氧化物比氧化膜501更容易还原的金属。在本发明的接合体和功率半导体模块中，在接合部使用锌基焊料55，在接合后，涂层51 不存在。