Package For Light-Emitting Device, Light-Emitting Apparatus, and Illuminating Apparatus
    2.
    发明申请
    Package For Light-Emitting Device, Light-Emitting Apparatus, and Illuminating Apparatus 有权
    发光装置,发光装置和照明装置的封装

    公开(公告)号:US20090296367A1

    公开(公告)日:2009-12-03

    申请号:US11909592

    申请日:2006-03-23

    IPC分类号: F21V9/16 F21V7/00

    摘要: A package includes a base body having a mounting portion for mounting a light-emitting device, a frame-shaped first reflection member attached to the upper surface of the base body, an inner peripheral surface of which is shaped into a first light reflecting surface and surrounds the mounting portion, and a frame-shaped second reflection member attached to the upper surface of the base body, with a spacing secured between an inner peripheral surface of the second reflection member and an outer peripheral surface of the first reflection member, the inner peripheral surface surrounding the first reflection member and having a second light reflecting surface at a location above an upper end of the first reflection member.

    摘要翻译: 一种包装体,包括具有用于安装发光装置的安装部的基体,安装在基体的上表面的框状的第一反射构件,其内周面成形为第一光反射面, 围绕安装部的框状的第二反射构件和安装在基体的上表面的框状的第二反射构件,其间隔固定在第二反射构件的内周面与第一反射构件的外周面之间, 围绕第一反射构件的周边表面,并且在第一反射构件的上端上方的位置具有第二光反射表面。

    Package for light-emitting device, light-emitting apparatus, and illuminating apparatus
    3.
    发明授权
    Package for light-emitting device, light-emitting apparatus, and illuminating apparatus 有权
    发光装置,发光装置和照明装置的封装

    公开(公告)号:US08029152B2

    公开(公告)日:2011-10-04

    申请号:US11909592

    申请日:2006-03-23

    IPC分类号: F21V9/16

    摘要: A package includes a base body having a mounting portion for mounting a light-emitting device, a frame-shaped first reflection member attached to the upper surface of the base body, an inner peripheral surface of which is shaped into a first light reflecting surface and surrounds the mounting portion, and a frame-shaped second reflection member attached to the upper surface of the base body, with a spacing secured between an inner peripheral surface of the second reflection member and an outer peripheral surface of the first reflection member, the inner peripheral surface surrounding the first reflection member and having a second light reflecting surface at a location above an upper end of the first reflection member.

    摘要翻译: 一种包装体,包括具有用于安装发光装置的安装部的基体,安装在基体的上表面的框状的第一反射构件,其内周面成形为第一光反射面, 围绕安装部的框状的第二反射构件和安装在基体的上表面的框状的第二反射构件,其间隔固定在第二反射构件的内周面与第一反射构件的外周面之间, 围绕第一反射构件的周边表面,并且在第一反射构件的上端上方的位置具有第二光反射表面。

    Light-emitting apparatus and illuminating apparatus
    4.
    发明申请
    Light-emitting apparatus and illuminating apparatus 审中-公开
    发光装置和照明装置

    公开(公告)号:US20060034084A1

    公开(公告)日:2006-02-16

    申请号:US11168887

    申请日:2005-06-28

    IPC分类号: F21V9/00 F21V7/00

    摘要: The light-emitting apparatus includes a light-emitting element, a base body having, on its upper principal surface, a placement portion for emplacing thereon the light-emitting element; a first reflecting member formed in a frame-like shape and attached to the upper principal surface of the base body so as to surround the placement portion; a second reflecting member formed in a frame-like shape and attached to the upper principal surface of the base body so as to surround the first reflecting member; a light transmitting member provided inside the second reflecting member so as to cover the light-emitting element and the first reflecting member; and a first wavelength-conversion layer for converting a wavelength of light from the light-emitting element, the first wavelength-conversion layer being provided inside the light transmitting member disposed above the light-emitting element, spaced from the first and second reflecting members.

    摘要翻译: 发光装置包括发光元件,基体,其上主表面上具有用于放置发光元件的放置部分; 第一反射构件,其形成为框状,并且以围绕所述放置部的方式安装在所述基体的上主面上; 第二反射构件,其形成为框状,并且以围绕所述第一反射构件的方式安装在所述基体的上主面上; 透光构件,设置在所述第二反射构件的内部以覆盖所述发光元件和所述第一反射构件; 以及用于转换来自发光元件的波长的第一波长转换层,所述第一波长转换层设置在与所述第一和第二反射部件间隔开的所述发光元件的上方的所述透光部件的内部。

    Light emitting device mounting substrate, light emitting device housing package, light emitting apparatus, and illuminating apparatus
    5.
    发明授权
    Light emitting device mounting substrate, light emitting device housing package, light emitting apparatus, and illuminating apparatus 有权
    发光装置安装基板,发光装置壳体封装,发光装置和照明装置

    公开(公告)号:US07868345B2

    公开(公告)日:2011-01-11

    申请号:US11718217

    申请日:2005-10-27

    IPC分类号: H01L33/00

    摘要: A light-emitting apparatus with improved dissipation efficiency of heat transmitted to a specific electrode of a light-emitting device is provided. A light-emitting device mounting substrate used for the light emitting apparatus include a base body (1) which mounts thereon a light-emitting device (3); a first electrically conductive path (L1) formed within the base body (1), one end thereof being electrically connected to a first electrode (3a) of the light-emitting device (3) and the other end thereof being led out to a surface of the base body (1); and a second electrically conductive path (L2) formed in the base body (1), one end thereof being electrically connected to a second electrode (3b) of the light-emitting device (3), and the other end thereof being formed on the surface of the base body (1). The first electrically conductive path (L1) is made smaller in thermal resistance than the second electrically conductive path (L2).

    摘要翻译: 提供了一种具有改善的散热效率的发光装置,其传输到发光装置的特定电极。 用于发光装置的发光装置安装基板包括安装在其上的发光装置(3)的基体(1)。 形成在所述基体(1)内的第一导电路径(L1),其一端电连接到所述发光装置(3)的第一电极(3a),并且其另一端被引出到 的基体(1); 以及形成在所述基体(1)中的第二导电路径(L2),其一端电连接到所述发光装置(3)的第二电极(3b),并且其另一端形成在所述基体 基体(1)的表面。 第一导电路径(L1)的热阻比第二导电路径(L2)小。

    Light Emitting Device Mounting Substrate, Light Emitting Device Housing Package, Light Emitting Apparatus, and Illuminating Apparatus
    6.
    发明申请
    Light Emitting Device Mounting Substrate, Light Emitting Device Housing Package, Light Emitting Apparatus, and Illuminating Apparatus 有权
    发光装置安装基板,发光装置外壳封装,发光装置和照明装置

    公开(公告)号:US20090200570A1

    公开(公告)日:2009-08-13

    申请号:US11718217

    申请日:2005-10-27

    IPC分类号: H01L33/00

    摘要: A light-emitting apparatus with improved dissipation efficiency of heat transmitted to a specific electrode of a light-emitting device is provided. A light-emitting device mounting substrate used for the light emitting apparatus include a base body (1) which mounts thereon a light-emitting device (3); a first electrically conductive path (L1) formed within the base body (1), one end thereof being electrically connected to a first electrode (3a) of the light-emitting device (3) and the other end thereof being led out to a surface of the base body (1); and a second electrically conductive path (L2) formed in the base body (1), one end thereof being electrically connected to a second electrode (3b) of the light-emitting device (3), and the other end thereof being formed on the surface of the base body (1). The first electrically conductive path (L1) is made smaller in thermal resistance than the second electrically conductive path (L2).

    摘要翻译: 提供了一种具有改善的散热效率的发光装置,其传输到发光装置的特定电极。 用于发光装置的发光装置安装基板包括安装在其上的发光装置(3)的基体(1)。 形成在所述基体(1)内的第一导电路径(L1),其一端电连接到所述发光装置(3)的第一电极(3a),并且其另一端被引出到 的基体(1); 以及形成在所述基体(1)中的第二导电路径(L2),其一端电连接到所述发光装置(3)的第二电极(3b),并且其另一端形成在所述基体 基体(1)的表面。 第一导电路径(L1)的热阻比第二导电路径(L2)小。