公开(公告)号：US20050133808A1

公开(公告)日：2005-06-23

申请号：US10978302

申请日：2004-10-29

申请人： Mitsugu Uraya ,  Daisuke Sakumoto ,  Akira Miyake ,  Fumiaki Sekine ,  Yuki Mori ,  Mitsuo Yanagisawa ,  Hiroshi Shibayama ,  Shingo Matsuura

发明人： Mitsugu Uraya ,  Daisuke Sakumoto ,  Akira Miyake ,  Fumiaki Sekine ,  Yuki Mori ,  Mitsuo Yanagisawa ,  Hiroshi Shibayama ,  Shingo Matsuura

IPC分类号： H01L33/38 ,  H01L33/48 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/00

CPC分类号： H01L33/486 ,  B41J2/455 ,  H01L33/508 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/1815 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light-emitting apparatus provides a ceramic-made base body, a frame body, a light-emitting element, a conductor layer and a light-transmitting member. The base body has on its upper surface a mounting portion for the light-emitting element. The frame body is joined to the upper surface of the base body so as to surround the mounting portion, with its inner peripheral surface shaped into a reflection surface. The wiring conductor has its one end formed on the upper surface of the base body and electrically connected to the light-emitting element, and has another end led to a side or lower surface of the base body. The light-transmitting member is disposed inside the frame body so as to cover the light-emitting element, which contains fluorescent materials for performing wavelength conversion. The base body is so designed that ceramic crystal grains range in average particle diameter from 1 to 5 μm.

摘要翻译： 发光装置提供陶瓷制的基体，框体，发光元件，导体层和透光构件。 基体在其上表面上具有用于发光元件的安装部分。 框架体以围绕安装部的方式与基体的上表面接合，其内周面形成为反射面。 布线导体的一端形成在基体的上表面上并与发光元件电连接，另一端被引导到基体的侧面或下表面。 透光构件设置在框体内，以覆盖包含用于进行波长转换的荧光材料的发光元件。 基体的设计使得陶瓷晶粒的平均粒径范围为1〜5μm。

公开(公告)号：US20130200784A1

公开(公告)日：2013-08-08

申请号：US12294850

申请日：2007-03-28

申请人： Shingo Matsuura ,  Tomoya Tabuchi ,  Kousuke Katabe ,  Yuki Mori ,  Akira Miyake ,  Daisuke Sakumoto

发明人： Shingo Matsuura ,  Tomoya Tabuchi ,  Kousuke Katabe ,  Yuki Mori ,  Akira Miyake ,  Daisuke Sakumoto

IPC分类号： H05B33/02 ,  F21V13/04

CPC分类号： H05B33/02 ,  F21V13/04 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/83385 ,  H01L2224/83951

摘要： To improve the luminance of light emitted by a light-emitting device, the light-emitting device includes a base (1) that has an opening part (1p) constituted by a light-reflecting surface (1r) and a bottom surface (1u), a light-emitting chip (2) that is mounted on the bottom surface (1u) of the opening part (1p), a transparent member (3) that covers the light-emitting chip (2), and an optical member (4) that is disposed on the transparent member (3). The transparent member (3) is disposed on the bottom surface (1u) of the opening part (1p) in a state where the transparent member (3) is spaced away from the light-reflecting surface (1r) of the opening part (1p).

摘要翻译： 为了提高发光装置发出的光的亮度，发光装置包括具有由光反射面（1r）和底面（1u）构成的开口部（1p）的基体（1） ，安装在开口部（1p）的底面（1u）上的发光芯片（2），覆盖发光芯片（2）的透明部件（3）和光学部件 ），其设置在透明构件（3）上。 在透明构件（3）与开口部（1p）的光反射面（1r）隔开的状态下，透明构件（3）设置在开口部（1p）的底面（1u） ）。

公开(公告)号：US08710737B2

公开(公告)日：2014-04-29

申请号：US12294850

申请日：2007-03-28

申请人： Shingo Matsuura ,  Tomoya Tabuchi ,  Kousuke Katabe ,  Yuki Mori ,  Akira Miyake ,  Daisuke Sakumoto

发明人： Shingo Matsuura ,  Tomoya Tabuchi ,  Kousuke Katabe ,  Yuki Mori ,  Akira Miyake ,  Daisuke Sakumoto

IPC分类号： H01J1/62

CPC分类号： H05B33/02 ,  F21V13/04 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/83385 ,  H01L2224/83951

摘要： To improve the luminance of light emitted by a light-emitting device, the light-emitting device includes a base (1) that has an opening part (1p) constituted by a light-reflecting surface (1r) and a bottom surface (1u), a light-emitting chip (2) that is mounted on the bottom surface (1u) of the opening part (1p), a transparent member (3) that covers the light-emitting chip (2), and an optical member (4) that is disposed on the transparent member (3). The transparent member (3) is disposed on the bottom surface (1u) of the opening part (1p) in a state where the transparent member (3) is spaced away from the light-reflecting surface (1r) of the opening part (1p).

摘要翻译： 为了提高发光装置发出的光的亮度，发光装置包括具有由光反射面（1r）和底面（1u）构成的开口部（1p）的基体（1） ，安装在开口部（1p）的底面（1u）上的发光芯片（2），覆盖发光芯片（2）的透明部件（3）和光学部件 ），其设置在透明构件（3）上。 在透明构件（3）与开口部（1p）的光反射面（1r）隔开的状态下，透明构件（3）设置在开口部（1p）的底面（1u） ）。

公开(公告)号：US20110096526A1

公开(公告)日：2011-04-28

申请号：US12810769

申请日：2008-12-26

申请人： Kousuke Katabe ,  Yuki Mori ,  Akira Miyake ,  Shingo Matsuura

发明人： Kousuke Katabe ,  Yuki Mori ,  Akira Miyake ,  Shingo Matsuura

IPC分类号： F21V9/16

CPC分类号： H01L33/60 ,  F21K9/64 ,  F21Y2115/10 ,  H01L33/507 ,  H01L33/64 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light emitting device includes a base, a sub-mount substrate, and a frame member. The light emitting device further includes a light emitting element and a wavelength converting member. The sub-mount substrate is disposed on the base, and has an upper surface made of a ceramic sintered body. The frame member has a light reflecting portion made of porous ceramics, is disposed on the base, and surrounds the sub-mount substrate. The light emitting element is mounted on the sub-mount substrate. The wavelength converting member covers the light emitting element and the light reflecting portion of the frame member.

摘要翻译： 发光装置包括基座，副安装基板和框架构件。 发光装置还包括发光元件和波长转换构件。 副安装基板设置在基座上，具有由陶瓷烧结体构成的上表面。 框架构件具有由多孔陶瓷制成的光反射部分，设置在基座上并且包围副安装基板。 发光元件安装在副安装基板上。 波长转换部件覆盖框架部件的发光元件和光反射部。

公开(公告)号：US20120161186A1

公开(公告)日：2012-06-28

申请号：US13393408

申请日：2010-10-22

申请人： Kousuke Katabe ,  Yuki Mori ,  Akira Miyake ,  Shingo Matsuura ,  Masayuki Mori

发明人： Kousuke Katabe ,  Yuki Mori ,  Akira Miyake ,  Shingo Matsuura ,  Masayuki Mori

IPC分类号： H01L33/50

CPC分类号： H01L33/60 ,  H01L33/507 ,  H01L2924/16195 ,  H01L2924/16315 ,  H01L2924/181 ,  H01L2924/00012

摘要： A light-emitting device includes a substrate mounted with a light-emitting element, and a frame disposed on the substrate. The frame includes a first frame portion disposed on the substrate and surrounding the light-emitting element, and having an inner wall surface substantially perpendicular to an upper surface of the substrate, an upper end of the inner wall surface being positioned at a level higher than that of an upper surface of the light-emitting element, and a second frame portion surrounding the inner wall surface of the first frame portion when viewed in a plan view, and having an inner periphery which is so shaped as to extend at an outward incline from a lower end of the inner periphery to an upper thereof. The light-emitting device includes a wavelength converter supported on the frame and opposed to the substrate with a gap.

摘要翻译： 发光装置包括安装有发光元件的基板和设置在基板上的框架。 所述框架包括设置在所述基板上并围绕所述发光元件的第一框架部分，并且具有基本上垂直于所述基板的上表面的内壁表面，所述内壁表面的上端定位在高于 发光元件的上表面以及围绕第一框架部分的内壁表面的平面图中的第二框架部分，并且具有内周，该内周被成形为在向外倾斜 从内周的下端到其上部。 发光装置包括支撑在框架上并与间隙相对的基板的波长转换器。

公开(公告)号：US20080112165A1

公开(公告)日：2008-05-15

申请号：US11940769

申请日：2007-11-15

申请人： Yuki MORI ,  Akira Miyake ,  Shingo Matsuura ,  Kousuke Katabe

发明人： Yuki MORI ,  Akira Miyake ,  Shingo Matsuura ,  Kousuke Katabe

IPC分类号： F21V13/04 ,  F21V7/04

CPC分类号： F21V5/007 ,  F21K9/68 ,  F21Y2105/10 ,  F21Y2115/10

摘要： A lighting apparatus includes a substrate, a plurality of light-emitting chips and a light-emitting member. The substrate has a layer including a base material and a medium. The base material is formed of an inorganic material and includes a plurality of cells. The medium is provided in the cells and has a refractive index lower than that of the inorganic material. The light-emitting chips are made of a semiconductor material and mounted on the substrate. The light-emitting member includes a fluorescent material and is provided above the light-emitting chips.

摘要翻译： 照明装置包括基板，多个发光芯片和发光部件。 基板具有包括基材和介质的层。 基材由无机材料形成，并且包括多个单元。 介质设置在电池中，折射率低于无机材料的折射率。 发光芯片由半导体材料制成并安装在基板上。 发光构件包括荧光材料，并且设置在发光芯片的上方。

公开(公告)号：US08529089B2

公开(公告)日：2013-09-10

申请号：US12810769

申请日：2008-12-26

申请人： Kousuke Katabe ,  Yuki Mori ,  Akira Miyake ,  Shingo Matsuura

发明人： Kousuke Katabe ,  Yuki Mori ,  Akira Miyake ,  Shingo Matsuura

IPC分类号： F21S4/00

CPC分类号： H01L33/60 ,  F21K9/64 ,  F21Y2115/10 ,  H01L33/507 ,  H01L33/64 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light emitting device includes a base, a sub-mount substrate, and a frame member. The light emitting device further includes a light emitting element and a wavelength converting member. The sub-mount substrate is disposed on the base, and has an upper surface made of a ceramic sintered body. The frame member has a light reflecting portion made of porous ceramics, is disposed on the base, and surrounds the sub-mount substrate. The light emitting element is mounted on the sub-mount substrate. The wavelength converting member covers the light emitting element and the light reflecting portion of the frame member.

摘要翻译： 发光装置包括基座，副安装基板和框架构件。 发光装置还包括发光元件和波长转换构件。 副安装基板设置在基座上，具有由陶瓷烧结体构成的上表面。 框架构件具有由多孔陶瓷制成的光反射部分，设置在基座上并且包围副安装基板。 发光元件安装在副安装基板上。 波长转换部件覆盖框架部件的发光元件和光反射部。

公开(公告)号：US08106584B2

公开(公告)日：2012-01-31

申请号：US11721807

申请日：2005-07-27

申请人： Tomoya Tabuchi ,  Akira Miyake ,  Daisuke Sakumoto

发明人： Tomoya Tabuchi ,  Akira Miyake ,  Daisuke Sakumoto

IPC分类号： H01J1/62 ,  H01L21/00

CPC分类号： H01L33/56 ,  H01L33/507 ,  H01L2224/13

摘要： A light emitting device includes a base on which a wiring conductor is formed from the top surface to the bottom surface or the side face; a light emitting chip mounted on the top surface of the base and electrically connected with the wiring conductor; a first light transmitting member which covers the light emitting chip; a second light transmitting member provided above the first light transmitting member to cover the first light transmitting member, the second light transmitting member being formed of a light transmitting material containing fluorescent materials for converting in wavelength the light emitted from the light emitting chip; and a third light transmitting member provided between the first and second light transmitting members, wherein the refractive index n1 of the first light transmitting member, the refractive index n2 of the second light transmitting member and the refractive index n3 of the third light transmitting member satisfy the relation: n3

摘要翻译： 发光器件包括从顶表面到底表面或侧面形成布线导体的基底; 发光芯片安装在基座的顶表面上并与布线导体电连接; 覆盖发光芯片的第一透光构件; 第二透光构件，设置在第一透光构件上方以覆盖第一透光构件，第二透光构件由包含荧光材料的透光材料形成，用于使波长从发光芯片发射的光转换; 以及第三透光构件，设置在第一透光构件和第二透光构件之间，其中第一透光构件的折射率n1，第二透光构件的折射率n2和第三透光构件的折射率n3满足 关系：n3

公开(公告)号：US20090295265A1

公开(公告)日：2009-12-03

申请号：US11721807

申请日：2005-07-27

申请人： Tomoya Tabuchi ,  Akira Miyake ,  Daisuke Sakumoto

发明人： Tomoya Tabuchi ,  Akira Miyake ,  Daisuke Sakumoto

IPC分类号： F21V13/08

CPC分类号： H01L33/56 ,  H01L33/507 ,  H01L2224/13

摘要： A light emitting device includes a base on which a wiring conductor is formed from the top surface to the bottom surface or the side face; a light emitting chip mounted on the top surface of the base and electrically connected with the wiring conductor; a first light transmitting member which covers the light emitting chip; a second light transmitting member provided above the first light transmitting member to cover the first light transmitting member, the second light transmitting member being formed of a light transmitting material containing fluorescent materials for converting in wavelength the light emitted from the light emitting chip; and a third light transmitting member provided between the first and second light transmitting members, wherein the refractive index n1 of the first light transmitting member, the refractive index n2 of the second light transmitting member and the refractive index n3 of the third light transmitting member satisfy the relation: n3

摘要翻译： 发光器件包括从顶表面到底表面或侧面形成布线导体的基底; 发光芯片安装在基座的顶表面上并与布线导体电连接; 覆盖发光芯片的第一透光构件; 第二透光构件，设置在第一透光构件上方以覆盖第一透光构件，第二透光构件由包含荧光材料的透光材料形成，用于使波长从发光芯片发射的光转换; 以及第三透光构件，设置在第一透光构件和第二透光构件之间，其中第一透光构件的折射率n1，第二透光构件的折射率n2和第三透光构件的折射率n3满足 关系：n3

公开(公告)号：US20050186407A1

公开(公告)日：2005-08-25

申请号：US11064784

申请日：2005-02-23

申请人： Yuki Mori ,  Akira Miyake

发明人： Yuki Mori ,  Akira Miyake

IPC分类号： B32B3/00 ,  H01L23/498 ,  H05K1/03 ,  H05K3/46

CPC分类号： C04B35/63 ,  B32B18/00 ,  B32B2311/04 ,  B32B2311/06 ,  B32B2311/08 ,  B32B2311/09 ,  B32B2311/12 ,  C04B35/632 ,  C04B35/634 ,  C04B2235/3206 ,  C04B2235/3217 ,  C04B2235/3222 ,  C04B2235/3231 ,  C04B2235/3244 ,  C04B2235/3418 ,  C04B2235/3463 ,  C04B2235/3481 ,  C04B2235/365 ,  C04B2235/48 ,  C04B2235/6025 ,  C04B2235/604 ,  C04B2235/96 ,  C04B2237/403 ,  C04B2237/407 ,  C04B2237/408 ,  C04B2237/62 ,  C04B2237/704 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/4629 ,  H05K2201/09881 ,  Y10T428/24926 ,  H01L2924/00

摘要： In manufacturing a ceramic multi-layer wiring substrate which is formed by stacking a plurality of ceramic layers and which includes an internal wiring, a ceramic paste is printed using a screen printing process on a part of a ceramic green sheet to be a ceramic layer having the internal wiring formed thereon which part does not include the internal wiring, to form between the ceramic layers a ceramic filling layer including a same ceramic component as that in the ceramic layers which ceramic filling layer is not formed on the internal wiring. The ceramic paste includes a ceramic component, an acrylic resin, and a cellulose resin, and loss factor tan δ of the paste represented by (loss modulus)/(storage modulus) in a dry condition after printing is equal to or greater than loss factor tan δ of a conductor paste layer to be the internal wiring in a dry condition.

摘要翻译： 在制造通过堆叠多个陶瓷层并且包括内部布线形成的陶瓷多层布线基板时，通过丝网印刷方法将陶瓷浆料印刷在陶瓷生片的一部分上，作为具有 在其上形成的部分不包括内部布线的内部布线，在陶瓷层之间形成陶瓷填充层，陶瓷填充层包括与内部布线中没有形成陶瓷填充层的陶瓷层相同的陶瓷成分。 陶瓷膏包括陶瓷成分，丙烯酸树脂和纤维素树脂，印刷后的干燥条件下（损耗模量）/（储能模量）表示的糊剂的损失因子tanδ等于或大于损耗因子 导体糊层的tanδ在干燥条件下成为内部布线。