摘要:
There is provided a back light unit having a light guide buffer plate. The back light unit having a light guide buffer plate includes a light source for generating the light when a power source is applied; a light guide panel whose light-receiving vertical surface that the light emitted from the light source enters is provided with a first prism pattern and whose bottom surface is provided with a refraction pattern, thereby converting the incident light from the light-receiving vertical surface into a surface light source; a reflection unit disposed in a bottom surface of the light guide panel to reflect light toward the light guide panel; and a buffer disposed between the light source and the light guide panel and whose light-emitting vertical surface corresponding to the light-receiving vertical surface of the light guide panel is provided with a second prism pattern. The back light unit can be useful to improve visibility, a mixing property and uniformity by basically removing a poor-visibility zone, which is formed in an end of the light guide panel, without any changes in the structure of the light guide panel.
摘要:
A method of multi-processing data in an attached resource computer network, includes a first step of setting a network address data MAP, which is a path for transmitting data to a plurality of stations and each processor employed in each station. The method further includes a second step of, when transmitting a data packet from a random station to a destination station, calling a transmission function by using an identification code corresponding to each address data in the network MAP, detecting the network MAP by the identification code to obtain the source process address and the destination station and the destination process address data, and inserting and transmitting into the data unit of the data packet. A third step of receiving the data packet transmitted from the second step is performed, and includes obtaining the address data from the data packet, detecting the network MAP set in the attached resource computer network entity, and thereby determining if there is the same address data for denoting the process of its own station. Further, a fourth step of transmitting data to the corresponding process if there is the same address data set in the network MAP of the attached resource computer network in the previous third step is performed.
摘要:
A magnetic recording/reproducing apparatus whereby the movements of various parts of a deck are fast and a very stabilized operation is attained. The apparatus includes a deck having a rotating head drum, a capstan motor and a pinch roller disposed adjacent to the head drum, and two reel driving tables onto which a tape reel of a tape cassette is seated. A motor is installed in the deck for generating power. A cassette loading device is provided for loading/unloading the tape cassette onto/from the reel driving tables. A master gear member rotated by the motor, a main slide member having a rack gear connected to the master gear member, a tape loading device interlocked with the main slide member for loading a tape of the tape cassette toward the head drum, a pinch roller driving device interlocked with the main slide member and pressed/separated against/from a shaft of the capstan motor for driving the pinch roller so that the tape is pressingly transferred are provided. A reel driving device is interlocked with the main slide member for selectively driving the two reel driving tables. A brake device is interlocked with the main slide member for selectively braking the two reel driving tables, and a mode identifying device is interlocked with the cassette loading device for determining the recording feasibility of the tape.
摘要:
There is provided a light emitting device package, including: a package body; a first lead frame coupled to the package body and including a first recess having an exposed side, the first recess having a chip mounting area formed to be downwardly recessed therein, wherein at least a part of a bottom surface of the chip mounting area is exposed to a bottom surface of the package body; a second lead frame coupled to the package body so as to have a predetermined distance from the first lead frame and including a second recess having an exposed side opposed to the exposed side of the first recess; and at least one light emitting device mounted on the chip mounting area of the first lead frame and electrically connected with the first and second lead frames.
摘要:
The invention relates to a side-emitting LED package and a manufacturing method thereof. The side-emitting LED package includes a substrate with an electrode formed thereon, and a light source disposed on the substrate and electrically connected to the electrode. The side-emitting LED package also includes a molded part having an upper surface with a center thereof depressed concavely, covering and protecting the substrate and the light source, and a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part which forms a light transmitting surface. The package is not restricted in the shape of the molded part and is not affected by the LED chip size, enabling a compact structure. The invention can also process a substrate by a PCB process, enabling mass-production.
摘要:
There is provided a back light unit having a light guide buffer plate. The back light unit having a light guide buffer plate includes a light source for generating the light when a power source is applied; a light guide panel whose light-receiving vertical surface that the light emitted from the light source enters is provided with a first prism pattern and whose bottom surface is provided with a refraction pattern, thereby converting the incident light from the light-receiving vertical surface into a surface light source; a reflection unit disposed in a bottom surface of the light guide panel to reflect light toward the light guide panel; and a buffer disposed between the light source and the light guide panel and whose light-emitting vertical surface corresponding to the light-receiving vertical surface of the light guide panel is provided with a second prism pattern. The back light unit can be useful to improve visibility, a mixing property and uniformity by basically removing a poor-visibility zone, which is formed in an end of the light guide panel, without any changes in the structure of the light guide panel.
摘要:
The invention relates to a side-emitting LED package and a manufacturing method thereof. The side-emitting LED package includes a substrate with an electrode formed thereon, and a light source disposed on the substrate and electrically connected to the electrode. The side-emitting LED package also includes a molded part having an upper surface with a center thereof depressed concavely, covering and protecting the substrate and the light source, and a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part which forms a light transmitting surface. The package is not restricted in the shape of the molded part and is not affected by the LED chip size, enabling a compact structure. The invention can also process a substrate by a PCB process, enabling mass-production.
摘要:
A pinch roller driving apparatus of a tape cassette player, for pressing a pinch roller against a capstan shaft, is provided. The pinch roller driving apparatus has a relatively simple structure for raising and lowering the pinch roller, and for pressing it against the capstan shaft, while being ganged with a slide member which reciprocates by receiving the driving force from a loading motor. Therefore, the cost of parts is reduced, and the assembly is made easy so that the generation of inferior quality products, caused by accumulated errors during assembly, is reduced.
摘要:
In a side view LED, elongated first and second lead frames each have a finger extending therefrom. The finger of the first lead frame is disposed in parallel with that of the second lead frame. An LED chip and a protective device are mounted on mounting areas of the first and second lead frames, respectively and electrically connected to the first and second lead frames. A package body houses the first and second lead frames to form first and second opened areas. The first opened area is externally opened around the LED chip, the second opened area is externally opened around the protective device, and the partition wall is formed therebetween. First and second encapsulants are provided to the first and second opened areas, respectively to encapsulate the LED chip and protective device, respectively. At least the first encapsulant is transparent.
摘要:
An LED package having a dual structure for lateral emission of light includes an LED chip, a lower structure, a lower lens and an upper lens. The lower structure includes a pair of electric connection parts, a package body, and a transparent encapsulant filled in the recess of the package body to seal the LED chip. The upper-hemispheric lower lens is fixed to an upper part of the lower structure with a bottom part thereof attached to an upper surface of the transparent encapsulant. The funnel-shaped upper lens is fixed to an upper end of the lower lens, and includes an axially symmetrical reflecting surface for laterally reflecting light from the lower lens, and an emitting surface for laterally emitting light reflected from the reflecting surface. The upper lens and the lower lens are separately molded and combined together to easily manufacture and efficiently install the LED package.