METHOD OF CONNECTING CIRCUIT BOARDS AND CONNECTED STRUCTURE
    2.
    发明申请
    METHOD OF CONNECTING CIRCUIT BOARDS AND CONNECTED STRUCTURE 审中-公开
    连接电路板和连接结构的方法

    公开(公告)号:US20110000700A1

    公开(公告)日:2011-01-06

    申请号:US12446518

    申请日:2007-10-11

    IPC分类号: H05K1/00 H05K3/36

    摘要: A method of connecting circuit boards capable of easily accomplishing the connection maintaining reliability. A method of connection comprising the steps of obtaining a laminated body of a first circuit board, an adhesive sheet and a second circuit board, and accomplishing electric conduction between the first circuit and the second circuit by applying heat and pressure to the laminated body of the first circuit board, the adhesive sheet and the second circuit board, wherein an end of the circuit formed on at least either the first circuit board or the second circuit board is terminated at a position separated away from an end of the substrate, and the adhesive of the adhesive sheet is partly arranged between the end of the substrate of the circuit board and the end of the circuit so as to be adhered to the opposing circuit board.

    摘要翻译: 一种连接电路板的方法,能够容易地实现连接维护的可靠性。 一种连接方法,包括以下步骤:获得第一电路板,粘合片和第二电路板的层压体,并且通过向第一电路和第二电路的叠层体施加热和压力来实现第一电路和第二电路之间的导电 第一电路板,粘合片和第二电路板,其中形成在至少第一电路板或第二电路板的电路的端部终止于远离衬底的端部分离的位置,并且粘合剂 粘合片部分地布置在电路板的基板的端部和电路的端部之间,以便粘附到相对的电路板。