公开(公告)号：US06210770B1

公开(公告)日：2001-04-03

申请号：US09274274

申请日：1999-03-22

申请人： Minoru Kikuchi ,  Yoshihiro Akimoto ,  Fuminori Takase ,  Nobuhiro Saito ,  Noriko Kikuchi

发明人： Minoru Kikuchi ,  Yoshihiro Akimoto ,  Fuminori Takase ,  Nobuhiro Saito ,  Noriko Kikuchi

IPC分类号： B32B302

CPC分类号： G11B7/26 ,  G11B7/243 ,  G11B7/2534 ,  G11B7/2542 ,  G11B7/2585 ,  G11B2007/24312 ,  G11B2007/24314 ,  G11B2007/24316 ,  G11B2007/2432 ,  G11B2007/24322 ,  Y10S428/913 ,  Y10S430/146 ,  Y10T428/21

摘要： A phase-change optical disc has a recording layer formed from a phase-change material switchable between a crystalline state and an amorphous state. The recording layer is illuminated signal-wise by a light is focused onto the recording layer to change the phase thereof from crystalline to amorphous, to thereby write an information signal onto the recording layer. The phase-change material contains a GeSbTe alloy. The recording layer is formed by sputtering in an Ar gas atmosphere containing at least either N2 or O2 gas or both. The optical recording medium exhibits improved durability after repeated recording and maintains a stable and good write/read characteristic even after repeated cycles of signal recording.

摘要翻译： 相变光盘具有由可在结晶状态和非晶状态之间切换的相变材料形成的记录层。 记录层通过聚焦在记录层上的光而被信号照亮，以将其相位从结晶变为非晶体，从而将信息信号写入记录层。 相变材料含有GeSbTe合金。 记录层通过溅射在含有至少N 2或O 2气体的Ar气体气氛中或两者形成。 光记录介质在重复记录之后表现出改善的耐久性，并且即使在信号记录的重复循环之后也保持稳定且良好的写入/读取特性。

公开(公告)号：USD730165S1

公开(公告)日：2015-05-26

申请号：US29426351

申请日：2012-07-03

申请人： Philipp H. Refior ,  Noriko Kikuchi ,  Hajime Okuno ,  Shinichi Togo ,  Manabu Kitsunai

设计人： Philipp H. Refior ,  Noriko Kikuchi ,  Hajime Okuno ,  Shinichi Togo ,  Manabu Kitsunai

公开(公告)号：US20110000700A1

公开(公告)日：2011-01-06

申请号：US12446518

申请日：2007-10-11

申请人： Yoshiaki Sato ,  Kohichiro Kawate ,  Tomihiro Hara ,  Noriko Kikuchi

发明人： Yoshiaki Sato ,  Kohichiro Kawate ,  Tomihiro Hara ,  Noriko Kikuchi

IPC分类号： H05K1/00 ,  H05K3/36

CPC分类号： H01R4/04 ,  H01R12/52 ,  H01R12/61 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/09245 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/09709 ,  H05K2201/10977 ,  H05K2203/1189 ,  Y10T29/49126

摘要： A method of connecting circuit boards capable of easily accomplishing the connection maintaining reliability. A method of connection comprising the steps of obtaining a laminated body of a first circuit board, an adhesive sheet and a second circuit board, and accomplishing electric conduction between the first circuit and the second circuit by applying heat and pressure to the laminated body of the first circuit board, the adhesive sheet and the second circuit board, wherein an end of the circuit formed on at least either the first circuit board or the second circuit board is terminated at a position separated away from an end of the substrate, and the adhesive of the adhesive sheet is partly arranged between the end of the substrate of the circuit board and the end of the circuit so as to be adhered to the opposing circuit board.

摘要翻译： 一种连接电路板的方法，能够容易地实现连接维护的可靠性。 一种连接方法，包括以下步骤：获得第一电路板，粘合片和第二电路板的层压体，并且通过向第一电路和第二电路的叠层体施加热和压力来实现第一电路和第二电路之间的导电 第一电路板，粘合片和第二电路板，其中形成在至少第一电路板或第二电路板的电路的端部终止于远离衬底的端部分离的位置，并且粘合剂 粘合片部分地布置在电路板的基板的端部和电路的端部之间，以便粘附到相对的电路板。

公开(公告)号：US20090321015A1

公开(公告)日：2009-12-31

申请号：US12304577

申请日：2007-06-18

申请人： Kohichiro Kawate ,  Hitoshi Yamaguchi ,  Noriko Kikuchi ,  Tomihiro Hara ,  Yoshiyuki Ohkura

发明人： Kohichiro Kawate ,  Hitoshi Yamaguchi ,  Noriko Kikuchi ,  Tomihiro Hara ,  Yoshiyuki Ohkura

IPC分类号： B32B7/12 ,  C08K5/3445

CPC分类号： C08K5/5442 ,  C08G65/336 ,  C08G2650/56 ,  C08L33/06 ,  C08L63/00 ,  C08L71/12 ,  C08L81/06 ,  C08L2666/22 ,  C09J171/00 ,  H01L24/83 ,  H01L2224/2929 ,  H01L2224/2939 ,  H01L2224/83851 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/09701 ,  H05K3/305 ,  H05K3/321 ,  H05K3/361 ,  H05K2201/0212 ,  Y02P70/613 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00

摘要： To provide an adhesive composition which can exhibit high adhesion to a circuit board and also has ability capable of releasing the connection to the circuit board connected and reconnecting the circuit board (repairing properties). An adhesive composition comprising: (i) one or more aromatic-group-containing polyhydroxy ether resins, (ii) a compound having an alkoxysilyl group and an imidazole group in the molecule, and (iii) organic particles, wherein the content of the organic particles is 50% by weight or more based on the weight of the adhesive composition.

摘要翻译： 提供一种能够对电路板具有高粘附性的粘合剂组合物，并且还具有能够释放与连接并重新连接电路板的电路板的连接（修复特性）的能力。 一种粘合剂组合物，其包含：（i）一种或多种含芳族基团的多羟基醚树脂，（ii）分子中具有烷氧基甲硅烷基和咪唑基的化合物，和（iii）有机颗粒，其中有机 基于粘合剂组合物的重量，颗粒为50重量％以上。