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    METHOD OF CONNECTING CIRCUIT BOARDS AND CONNECTED STRUCTURE
    2.
    发明申请
    METHOD OF CONNECTING CIRCUIT BOARDS AND CONNECTED STRUCTURE 审中-公开
    连接电路板和连接结构的方法

    公开(公告)号：US20110000700A1

    公开(公告)日：2011-01-06

    申请号：US12446518

    申请日：2007-10-11

    申请人： Yoshiaki Sato ,  Kohichiro Kawate ,  Tomihiro Hara ,  Noriko Kikuchi

    发明人： Yoshiaki Sato ,  Kohichiro Kawate ,  Tomihiro Hara ,  Noriko Kikuchi

    IPC分类号： H05K1/00 ,  H05K3/36

    CPC分类号： H01R4/04 ,  H01R12/52 ,  H01R12/61 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/09245 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/09709 ,  H05K2201/10977 ,  H05K2203/1189 ,  Y10T29/49126

    摘要： A method of connecting circuit boards capable of easily accomplishing the connection maintaining reliability. A method of connection comprising the steps of obtaining a laminated body of a first circuit board, an adhesive sheet and a second circuit board, and accomplishing electric conduction between the first circuit and the second circuit by applying heat and pressure to the laminated body of the first circuit board, the adhesive sheet and the second circuit board, wherein an end of the circuit formed on at least either the first circuit board or the second circuit board is terminated at a position separated away from an end of the substrate, and the adhesive of the adhesive sheet is partly arranged between the end of the substrate of the circuit board and the end of the circuit so as to be adhered to the opposing circuit board.

    摘要翻译： 一种连接电路板的方法，能够容易地实现连接维护的可靠性。 一种连接方法，包括以下步骤：获得第一电路板，粘合片和第二电路板的层压体，并且通过向第一电路和第二电路的叠层体施加热和压力来实现第一电路和第二电路之间的导电 第一电路板，粘合片和第二电路板，其中形成在至少第一电路板或第二电路板的电路的端部终止于远离衬底的端部分离的位置，并且粘合剂 粘合片部分地布置在电路板的基板的端部和电路的端部之间，以便粘附到相对的电路板。

    TERMINAL MOUNTING STRUCTURE AND METHOD
    4.
    发明申请
    TERMINAL MOUNTING STRUCTURE AND METHOD 审中-公开
    端子安装结构和方法

    公开(公告)号：US20110163569A1

    公开(公告)日：2011-07-07

    申请号：US13063843

    申请日：2009-01-23

    申请人： Miki Yoneyama ,  Kohichiro Kawate ,  Kenji Kuwahara

    发明人： Miki Yoneyama ,  Kohichiro Kawate ,  Kenji Kuwahara

    IPC分类号： B60J1/00 ,  H01R4/00 ,  B29C65/48

    CPC分类号： H01R12/515 ,  H01R13/2492 ,  H01R13/639 ,  H05B3/84 ,  H05B2203/016 ,  H05K3/321 ,  H05K3/3426 ,  Y10T156/1089

    摘要： To provide a terminal mounting structure, the electrical continuation and the joining strength of which are sufficiently high although the structure is simple, further the reliability of which is high even when it is used over a long period of time and to provide a terminal mounting method therefor. A terminal (3) is connected and continued to a conductor (2) such as a heating wire provided on a substrate (1). Terminal (3) includes: a fixing portion (31); elastic portions (32) extending from fixing portion (31); and a substrate contact portion (33) provided in elastic portion (32) so that substrate contact portion (33) can be protruded with respect to substrate (1), and electrically connected to conductor (2). Each fixing portion (31) is made to adhere to substrate (1) by a joining means such as a double-sided adhesive tape (4). Substrate contact portion (33) of terminal (3) is made to adhere to substrate (1) by adhesive (5) under the condition that substrate contact portion (33) comes into contact with conductor (2) by a repulsive force generated by an elastic displacement of elastic portion (32).

    摘要翻译： 为了提供一种端子安装结构，虽然结构简单，但其电连续性和接合强度足够高，即使长时间使用也可靠性高，并提供端子安装方法 因此。 端子（3）连接并连接到诸如设置在基板（1）上的加热丝的导体（2）。 端子（3）包括：固定部分（31）; 从固定部分（31）延伸的弹性部分（32）; 以及设置在弹性部分（32）中的基板接触部分（33），使得基板接触部分（33）可以相对于基板（1）突出并且电连接到导体（2）。 通过诸如双面胶带（4）的接合装置使每个固定部分（31）粘附到基底（1）上。 端子（3）的基板接触部分（33）通过粘合剂（5）在基板接触部分（33）通过由导体（2）产生的排斥力与导体（2）接触的条件下粘附到基板（1） 弹性部分（32）的弹性位移。

    Method for Connecting Printed Circuit Boards
    9.
    发明申请
    Method for Connecting Printed Circuit Boards 审中-公开
    连接印刷电路板的方法

    公开(公告)号：US20080283280A1

    公开(公告)日：2008-11-20

    申请号：US12092773

    申请日：2006-11-09

    申请人： Kohichiro Kawate ,  Yoshihisa Kawate

    发明人： Kohichiro Kawate ,  Yoshihisa Kawate

    IPC分类号： H05K1/14 ,  B29C65/54

    CPC分类号： H05K3/361 ,  H05K3/328 ,  H05K2201/0129 ,  H05K2201/0212 ,  H05K2201/10977 ,  H05K2203/0278 ,  H05K2203/0285 ,  H05K2203/1189

    摘要： To provide a method for connecting printed circuit boards with high connection reliability, while avoiding the problem of shorting even with a fine pitch. A method for connecting printed circuit boards (PCB) containing metal wiring, or connecting a printed circuit board (PCB) containing metal wiring with a metal lead wire or a metal contact, which method includes a step of thermocompression bonding of an adhesive film with connectors, the adhesive film being composed of an adhesive composition comprising a thermoplastic resin and organic particles, wherein the viscosity decreases as the applied thermocompression force increases at a temperature of 100-250° C.

    摘要翻译： 提供一种以高连接可靠性连接印刷电路板的方法，同时避免了即使具有精细间距的短路问题。 一种用于连接包含金属布线的印刷电路板（PCB）或将包含金属布线的印刷电路板（PCB）与金属引线或金属接触件连接的方法，该方法包括将粘合剂膜与连接器热压接合的步骤 粘合剂膜由包含热塑性树脂和有机颗粒的粘合剂组合物组成，其中随着施加的热压力在100-250℃的温度下增加，粘度降低。

    Method for Mutually Connecting Circuit Boards
    10.
    发明申请
    Method for Mutually Connecting Circuit Boards 失效
    电路板互连方法

    公开(公告)号：US20080205019A1

    公开(公告)日：2008-08-28

    申请号：US11917527

    申请日：2006-06-21

    申请人： Yoshiaki Sato ,  Kohichiro Kawate ,  James R. White

    发明人： Yoshiaki Sato ,  Kohichiro Kawate ,  James R. White

    IPC分类号： H05K1/14

    CPC分类号： H05K3/365 ,  H01L2224/73204 ,  H01L2224/83101 ,  H05K1/117 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/09427 ,  H05K2201/10977 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49174 ,  Y10T29/49179 ,  Y10T29/49195

    摘要： A method for connecting circuit boards, comprising: (i) preparing a first circuit board having connection parts assigned to end parts of a plurality of conductor wirings, and a second circuit board having connection parts assigned to corresponding end parts of a plurality of conductor wirings; (ii) disposing the connection parts of the first circuit board to face the connection parts of the second circuit board with a thermosetting adhesive film between the connection parts of the circuit boards; and (iii) applying heat and pressure to the connection parts and to the thermosetting adhesive film sufficiently high to thoroughly push away the adhesive film so as to establish electrical contact between connection parts of the circuit boards facing each other and to allow for curing of the adhesive; wherein the conductor wirings constituting the connection parts of at least one of the first and second circuit boards contain non-linear wirings.

    摘要翻译： 一种用于连接电路板的方法，包括：（i）制备具有分配给多个导体布线的端部的连接部分的第一电路板和具有分配给多个导体布线的相应端部的连接部分的第二电路板 ; （ii）将第一电路板的连接部分设置成与电路板的连接部分之间的热固性粘合膜面对第二电路板的连接部分; 和（iii）对连接部分和热固性粘合剂膜施加足够高的热量和压力，以充分地推开粘合剂膜，以便在彼此面对的电路板的连接部分之间建立电接触，并允许固化 胶粘剂; 其中构成第一和第二电路板中的至少一个的连接部分的导体配线包含非线性配线。