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13 条记录 (耗时 0.016 秒)

    Method of forming uniform features using photoresist
    2.
    发明授权
    Method of forming uniform features using photoresist 失效
    使用光刻胶形成均匀特征的方法

    公开(公告)号：US07560225B2

    公开(公告)日：2009-07-14

    申请号：US10448501

    申请日：2003-05-29

    申请人： Omar Eduardo Montero Camacho ,  Pei-C Chen ,  Cherngye Hwang ,  Diana Perez ,  Eric Yongjian Sun

    发明人： Omar Eduardo Montero Camacho ,  Pei-C Chen ,  Cherngye Hwang ,  Diana Perez ,  Eric Yongjian Sun

    IPC分类号： G03F7/40 ,  B44C1/22

    CPC分类号： G11B5/3173 ,  G03F7/40 ,  G03F7/405 ,  G11B5/102

    摘要： A process for ion milling using photoresist as a mask is described. In a preferred embodiment the invention is used in the fabricating air-bearing features on sliders for use in magnetic storage devices. According to the invention the photoresist (liquid or dry) is applied, developed and removed as in the prior art which includes baking steps. The embodiment of the invention includes an additional baking step beyond whatever baking steps are used in the photolithography process. The additional baking step is preferably performed immediately prior to ion milling. The additional baking step according to the invention yields increased uniformity of the depth of the ion milling which is believed to result from reduction of volatile material such as water in the photoresist. When the invention is used as part of the manufacturing process for ion milling the air-bearing features on a slider, the features are more uniform which improves the overall quality and performance.

    摘要翻译： 描述使用光致抗蚀剂作为掩模的离子铣削的方法。 在优选实施例中，本发明用于制造用于磁存储装置的滑块上的空气轴承特征。 根据本发明，如在包括烘烤步骤的现有技术中，应用，显影和去除光致抗蚀剂（液体或干燥）。 本发明的实施例包括除了在光刻工艺中使用的任何烘烤步骤之外的额外的烘烤步骤。 额外的烘烤步骤优选在离子研磨之前立即进行。 根据本发明的另外的烘烤步骤产生离子研磨深度的均匀性，这被认为是通过光致抗蚀剂中的挥发性物质例如水的还原引起的。 当将本发明用作离子铣削制造过程的一部分时，滑块上的空气轴承特征更加均匀，这提高了整体的质量和性能。

    Silicon coating on air bearing surface for magnetic thin film heads
    7.
    发明授权
    Silicon coating on air bearing surface for magnetic thin film heads 失效
    用于磁性薄膜头的空气轴承表面上的硅涂层

    公开(公告)号：US06532134B1

    公开(公告)日：2003-03-11

    申请号：US08686567

    申请日：1996-07-26

    申请人： Pei C. Chen ,  Grace Lim Gorman ,  Cherngye Hwang ,  Vedantham Raman ,  Randall George Simmons

    发明人： Pei C. Chen ,  Grace Lim Gorman ,  Cherngye Hwang ,  Vedantham Raman ,  Randall George Simmons

    IPC分类号： G11B560

    CPC分类号： G11B5/3106 ,  G11B5/255 ,  G11B5/40 ,  G11B5/6082

    摘要： A silicon coating on an air bearing surface for magnetic thin film heads. A thick silicon layer is provided to replace metallic layers such as TiW as an overcoat for thin film heads. The silicon layer will provide a durable head-disk interface and act as a reflective surface for fly height measurement. The silicon layer can be planarized with the pole tips to avoid any magnetic spacing loss. The thickness of the silicon coating is preferably between 125 and 6500 angstroms thick. The slider body may be fabricated from silicon such that the silicon coating is substantially identical to the silicon slider body, thereby preventing thermal mismatch therebetween. The silicon coating is preferably applied using a magnetron sputtering technique which provides a high rate of deposition of silicon to form a dense, low stress silicon layer.

    摘要翻译： 用于磁性薄膜头的空气轴承表面上的硅涂层。 提供厚硅层以代替诸如TiW的金属层作为薄膜头的外涂层。 硅层将提供耐用的头盘接口，并作为飞高测量的反射表面。 硅层可以用极尖平面化，以避免任何磁间隙损失。 硅涂层的厚度优选为125至6500埃厚。 滑块体可以由硅制成，使得硅涂层基本上与硅滑块体相同，从而防止硅片之间的热失配。 硅涂层优选使用磁控溅射技术来施加，其提供硅的高沉积速率以形成致密的低应力硅层。

    Carbon overcoat for a slider with improved step coverage
    8.
    发明授权
    Carbon overcoat for a slider with improved step coverage 失效
    用于滑块的碳涂层，具有改进的台阶覆盖

    公开(公告)号：US5943187A

    公开(公告)日：1999-08-24

    申请号：US878976

    申请日：1997-06-18

    申请人： Pei C. Chen ,  Cherngye Hwang ,  Vedantham Raman ,  Jila Tabib

    发明人： Pei C. Chen ,  Cherngye Hwang ,  Vedantham Raman ,  Jila Tabib

    IPC分类号： G11B5/10 ,  G11B5/255 ,  G11B5/31 ,  G11B5/39 ,  G11B5/60 ,  G11B5/72 ,  G11B5/82 ,  G11B5/84

    CPC分类号： G11B5/6005 ,  G11B5/10 ,  G11B5/255 ,  G11B5/3106 ,  G11B5/3967 ,  G11B5/72 ,  G11B5/82 ,  G11B5/8408

    摘要： A method is provided for applying an overcoat to a slider and sensitive elements of a magnetic head which has improved coverage, reduced spacing loss and improved corrosion resistance. After lapping, an overcoat material is sputter deposited on the air bearing surface (ABS) of the slider, followed by a step of sputter etching the overcoat. The sputter etching redeposits material from high points on the slider and fills in trenches formed during the lapping process. The redeposition of the overcoat from the high places to the low places of the slider decreases the overall thickness of the overcoat, thereby decreasing spacing loss. The filling of the trenches implements increased coverage which increases wear resistance of the slider and more adequately protects the sensitive elements of the magnetic head from corrosion. In a preferred embodiment, a portion of the overcoat is left on the high places to ensure that the sputter etching does not damage the sensitive elements of the magnetic head. If the overcoat is completely etched from the high places an optional second overcoat may be applied which is thinner than the first overcoat. This method may also be applied to other articles such as a magnetic disk.

    摘要翻译： 提供了一种将外涂层施加到滑块和磁头的敏感元件的方法，其具有改进的覆盖范围，减小的间隔损耗和改善的耐腐蚀性。 研磨后，将外涂层材料溅射沉积在滑块的空气轴承表面（ABS）上，随后溅射蚀刻外涂层。 溅射蚀刻从滑块上的高点重新沉积材料，并填充研磨过程中形成的沟槽。 外涂层从滑块的高处重新沉积到滑块的低处降低了外涂层的总厚度，从而减小了间隔损耗。 沟槽的填充实现增加的覆盖，增加滑块的耐磨性，并更充分地保护磁头的敏感元件不被腐蚀。 在优选实施例中，外涂层的一部分留在高处，以确保溅射蚀刻不会损坏磁头的敏感元件。 如果外涂层从高处完全蚀刻，则可以施加比第一外涂层更薄的任选的第二外涂层。 该方法也可以应用于诸如磁盘的其它物品。

    Method of laminating polyimide to thin sheet metal
    9.
    发明授权
    Method of laminating polyimide to thin sheet metal 失效
    将聚酰亚胺层压到薄金属板上的方法

    公开(公告)号：US5156710A

    公开(公告)日：1992-10-20

    申请号：US695850

    申请日：1991-05-06

    申请人： Pei C. Chen ,  Thomas E. Kindl ,  Paul G. Rickerl ,  Mark J. Schadt ,  John G. Stephanie

    发明人： Pei C. Chen ,  Thomas E. Kindl ,  Paul G. Rickerl ,  Mark J. Schadt ,  John G. Stephanie

    IPC分类号： B29C65/64 ,  B29K79/00 ,  B29L9/00 ,  B32B15/08 ,  B32B15/088 ,  B32B37/00 ,  C08G73/10 ,  C08J5/12 ,  C08J5/18 ,  H05K1/03 ,  H05K1/05

    CPC分类号： C08J5/125 ,  B32B15/08 ,  C08G73/1039 ,  C08G73/1057 ,  C08G73/106 ,  C08G73/1064 ,  C08G73/1067 ,  C08G73/1078 ,  H05K1/0346 ,  H05K1/056 ,  C08J2379/02 ,  H05K1/036 ,  H05K2201/0355 ,  Y10T428/31536 ,  Y10T428/31681 ,  Y10T428/31721

    摘要： An improved method of laminating a metal foil or sheet to a polyimide material is provided. A solution of a precursor of an intractable (i.e. thermosetting) polyimide is applied to a substrate and the solvent is removed to form a dry tack-free film. Thereafter, a solution of a precursor of a thermoplastic polyimide is applied onto the first film of polyimide and the solvent is removed to form a dry tack-free second film. Both films are then cured concomitantly at a sufficiently rapid rate and low temperature to effect substantial imidization of the polyimide precursors of both films without substantial crosslinking or densification of the polyimides in either of the films. Thereafter, a metal sheet or foil is laminated onto the thermoplastic polyimide film according to the following process. The thermoplastic film is contacted with the sheet or foil of metal to be laminated thereto. A first pressure is applied to the metal sheet and the polyimide substrate composite, which pressure is sufficiently low to permit outgassing of any gases trapped or generated within the polyimides and the temperature is increased. The temperature is raised to a level to essentially complete imidization of the polyimides and also to expel any gases contained or generated by said polyimide films. Thereafter, the pressure is increased to a second level or value and the temperature is controlled to a value which temperature is above the T.sub.g of the thermoplastic film. This second pressure is sufficiently high to complete the lamination of the metal sheet or foil to the thermoplastic polyimide.

    摘要翻译： 提供了一种将金属箔或片层压到聚酰亚胺材料上的改进方法。 将难溶物（即热固性）聚酰亚胺的前体溶液施加到基材上，并除去溶剂以形成无干粘性膜。 此后，将热塑性聚酰亚胺的前体溶液施加到第一聚酰亚胺薄膜上，除去溶剂以形成无干粘性的第二薄膜。 然后两个膜以足够快的速率和低温同时固化，以实现两种膜的聚酰亚胺前体的显着酰亚胺化，而不影响任何一种膜中聚酰亚胺的交联或致密化。 此后，根据以下方法将金属片或箔层压到热塑性聚酰亚胺膜上。 将热塑性膜与待层压的金属片或箔片接触。 对金属板和聚酰亚胺基板复合体施加第一压力，其压力足够低以允许在聚酰亚胺内捕获或产生的任何气体脱气，并且温度升高。 将温度升高到基本上完全聚酰亚胺的酰亚胺化水平，并且还排出由所述聚酰亚胺膜包含或产生的任何气体。 此后，将压力提高到第二水平或值，并将温度控制在该温度高于热塑性膜的Tg的值。 该第二压力足够高以完成金属片或箔与热塑性聚酰亚胺的层压。