公开(公告)号：US06206997B1

公开(公告)日：2001-03-27

申请号：US09248341

申请日：1999-02-11

Applicant: Frank D. Egitto ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Luis J. Matienzo ,  Mark V. Pierson

Inventor： Frank D. Egitto ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Luis J. Matienzo ,  Mark V. Pierson

IPC: B32B3112

CPC classification number: B29C59/14 ,  H01L21/56 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent material between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent material may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive. In particular, the film may be polytetrafluoroethylene, the adhesive may be polybutadine, and the film may be further impregnated with a metal oxide heat transfer medium, such as zinc oxide. An alternate method comprises applying the porous polymer film without plasma treatment and heat curing the film to form a proper bond.

Abstract translation: 一种用于将散热器粘合到封装的电子部件的方法包括以下步骤：（a）将形成在基底上的模制聚合物的表面暴露于等离子体; （b）允许等离子体至少部分地将表面上的含硅残余物转化为二氧化硅; 和（c）通过在制品和表面之间施加粘附材料将制品粘合到表面上。 通常，含硅残渣是使用常规粘合方法和材料的硅油，脱模剂，可以防止形成粘结。 形成在模塑聚合物表面上的二氧化硅层有助于形成适当的键。 等离子体可以是氧等离子体，并且粘附材料可以选自具有金属氧化物填料的热固化硅氧烷基糊状粘合剂或浸渍有粘合剂的热固化多孔聚合物膜。 特别地，膜可以是聚四氟乙烯，粘合剂可以是聚丁二烯，并且该膜可以进一步用金属氧化物传热介质如氧化锌浸渍。 替代方法包括在不进行等离子体处理的情况下应用多孔聚合物膜并热固化膜以形成适当的键。

公开(公告)号：US06193576B1

公开(公告)日：2001-02-27

申请号：US09082287

申请日：1998-05-19

Applicant: Michael A. Gaynes ,  Allan O. Johnson ,  Ramesh R. Kodnani ,  Mark V. Pierson ,  Edward J. Tasillo

Inventor： Michael A. Gaynes ,  Allan O. Johnson ,  Ramesh R. Kodnani ,  Mark V. Pierson ,  Edward J. Tasillo

IPC: H01J900

CPC classification number: G02F1/13336 ,  Y10S345/903

Abstract: A method for aligning a plurality of thin film transistor tiles for constructing a flat panel display. A coverplate is arranged on a coverplate support. A first layer of a bonding material is applied to at least one of a first side of each of the tiles and a surface of the coverplate on which the tiles are to be secured. The tiles are arranged on the coverplate, such that the first layer of bonding material is arranged between the tiles and the coverplate. The tiles are connected to an alignment apparatus. The tiles are aligned relative to each other and the coverplate. The tiles are at least partially secured to the coverplate.

Abstract translation: 一种用于对准多个用于构建平板显示器的薄膜晶体管瓦片的方法。 盖板安装在盖板支架上。 接合材料的第一层被施加到每个瓷砖的第一侧中的至少一个以及待固定瓷砖的盖板的表面。 瓦片布置在盖板上，使得第一层粘合材料布置在瓦片和盖板之间。 瓦片连接到对准装置。 瓷砖相对于彼此和盖板对准。 瓦片至少部分地固定到盖板上。

公开(公告)号：US06596559B2

公开(公告)日：2003-07-22

申请号：US09822746

申请日：2001-03-30

Applicant: Ramesh R. Kodnani ,  Luis J. Matienzo ,  Son K. Tran

Inventor： Ramesh R. Kodnani ,  Luis J. Matienzo ,  Son K. Tran

IPC: H01L2144

CPC classification number: H01L24/81 ,  C08G73/0611 ,  C08G73/0627 ,  H01L21/563 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14

Abstract: An electronic module having enhanced adhesion at the chip passivation and underfill interface is disclosed. The surface of the chip passivation is chemically modified to a sufficient depth such that the cured passivation is more reactive. The modified surface is treated with a polyamine preferably having a cyclic amine group extending from a preferably aliphatic backbone. During reflow of the solder joints of the electronic module by heating, the modified passivation reacts with the polyamine at the amine functionality. Following underfill of the electronic module with a polymeric material, preferably an epoxy resin, the polyamine on the surface of the passivation reacts with the underfill material during curing of the underfill material. The resulting electronic module is more robust since the amine acts as a chemical anchoring site for both the modified passivation and the underfill material. A method of assembling an electronic module utilizing the polyamine treatment at the chip and wafer level is also disclosed.

Abstract translation: 公开了一种在芯片钝化和底部填充界面处具有增强的附着力的电子模块。 芯片钝化的表面被化学修饰到足够的深度，使得固化的钝化更具反应性。 改性表面用优选具有从优选脂肪族主链延伸的环状胺基团的多胺处理。 在通过加热回流电子模块的焊点时，改性的钝化剂在胺官能度下与多胺反应。 在具有聚合材料，优选环氧树脂的电子模块的底部填充之后，钝化剂表面上的多胺在底部填充材料的固化期间与底部填充材料反应。 所得到的电子模块更加坚固，因为胺用作修饰的钝化和底部填充材料的化学锚定位点。 还公开了利用芯片和晶片级的多胺处理来组装电子模块的方法。

公开(公告)号：US06487461B1

公开(公告)日：2002-11-26

申请号：US09590280

申请日：2000-06-09

Applicant: Michael A. Gaynes ,  Allan O. Johnson ,  Ramesh R. Kodnani ,  Mark V. Pierson ,  Edward J. Tasillo

Inventor： Michael A. Gaynes ,  Allan O. Johnson ,  Ramesh R. Kodnani ,  Mark V. Pierson ,  Edward J. Tasillo

IPC: G05B1918

CPC classification number: G02F1/13336 ,  Y10S345/903

Abstract: A method for aligning a plurality of thin film transistor tiles for constructing a flat panel display. A coverplate is arranged on a coverplate support. A first layer of a bonding material is applied to at least one of a first side of each of the tiles and a surface of the coverplate on which the tiles are to be secured. The tiles are arranged on the coverplate, such that the first layer of bonding material is arranged between the tiles and the coverplate. The tiles are connected to an alignment apparatus. The tiles are aligned relative to each other and the coverplate. The tiles are at least partially secured to the coverplate.

Abstract translation: 一种用于对准多个用于构建平板显示器的薄膜晶体管瓦片的方法。 盖板安装在盖板支架上。 接合材料的第一层被施加到每个瓷砖的第一侧中的至少一个以及待固定瓷砖的盖板的表面。 瓦片布置在盖板上，使得第一层粘合材料布置在瓦片和盖板之间。 瓦片连接到对准装置。 瓷砖相对于彼此和盖板对准。 瓦片至少部分地固定到盖板上。

公开(公告)号：US5889321A

公开(公告)日：1999-03-30

申请号：US877538

申请日：1997-06-17

Applicant: Thomas M. Culnane ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Mark V. Pierson

Inventor： Thomas M. Culnane ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Mark V. Pierson

IPC: H01L21/48 ,  H01L21/50 ,  H05K1/18 ,  H01L23/48

CPC classification number: H05K1/189 ,  H01L21/4803 ,  H01L21/50 ,  H01L2224/16225

Abstract: A stiffener (34 or 52 or 72) includes a pathway which allows gases and fluids, such as air, to be vented from the interface between surface bonding regions (35 or 60 or 74) of the stiffener and an adhesive (38 or 56 or 80) on a flexible substrate (36 or 54 or 78). The pathway may take the form of a porous material used for the stiffener or one or more bore holes (58 or 59 or 70) formed in the stiffener. The stiffener may also include an internal cavity (76) for promoting venting of fluids and gases. By venting fluid and gases from the adhesive/stiffener interface, better adhesion between the stiffener and flexible substrate is achieved.

Abstract translation: 加强件（34或52或72）包括允许气体和流体（例如空气）从加强件的表面粘合区域（35或60或74）之间的界面和粘合剂（38或56或 80）在柔性基板（36或54或78）上。 该通道可以采用用于加强件的多孔材料的形式或形成在加强件中的一个或多个钻孔（58或59或70）。 加强件还可以包括用于促进流体和气体排放的内腔（76）。 通过从粘合剂/加强件界面排出流体和气体，实现加强件和柔性基材之间更好的粘附。

公开(公告)号：US06835441B1

公开(公告)日：2004-12-28

申请号：US09593446

申请日：2000-06-15

Applicant: Michael A. Gaynes ,  Ramesh R. Kodnani

Inventor： Michael A. Gaynes ,  Ramesh R. Kodnani

IPC: B32B2714

CPC classification number: F16B11/006 ,  B32B37/0007 ,  B32B37/1292 ,  B32B2315/08 ,  Y10T428/1059 ,  Y10T428/24802 ,  Y10T428/24826 ,  Y10T428/24843 ,  Y10T428/2852 ,  Y10T428/2891 ,  Y10T428/2896

Abstract: Two surfaces are adhesively bonded together by providing on one of the surfaces a central, single point adhesive contact deposit and providing on one of the surfaces, adhesive extending from a central point deposit in a spoke-like array diagonally across substantially the entire surface. Also provided is the article obtained by the above method as well as the assembly used for bonding the two surfaces together. The surfaces are brought together, one on top of the other, with the adhesive located between the surfaces to cause the adhesive to spread out and cover the surfaces to thereby bond them together.

Abstract translation: 两个表面通过在其中一个表面上提供中心的单点粘合剂接触沉积物并在其中一个表面上提供粘合剂粘合在一起，从中央点沉积物以一个辐射状阵列沿着对角线横跨基本上整个表面延伸的粘合剂。 还提供了通过上述方法获得的制品以及用于将两个表面粘合在一起的组装。 这些表面一个在另一个之上，粘合剂位于表面之间，以使粘合剂展开并覆盖表面，从而将它们粘合在一起。

公开(公告)号：US06713858B2

公开(公告)日：2004-03-30

申请号：US10404774

申请日：2003-03-31

Applicant: Ramesh R. Kodnani ,  Luis J. Matienzo ,  Son K. Tran

Inventor： Ramesh R. Kodnani ,  Luis J. Matienzo ,  Son K. Tran

IPC: H01L2302

CPC classification number: H01L24/81 ,  C08G73/0611 ,  C08G73/0627 ,  H01L21/563 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14

Abstract: An electronic module having enhanced adhesion at the chip passivation and underfill interface is disclosed. The surface of the chip passivation is chemically modified to a sufficient depth such that the cured passivation is more reactive. The modified surface is treated with a polyamine preferably having a cyclic amine group extending from a preferably aliphatic backbone. During reflow of the solder joints of the electronic module by heating, the modified passivation reacts with the polyamine at the amine functionality. Following underfill of the electronic module with a polymeric material, preferably an epoxy resin, the polyamine on the surface of the passivation reacts with the underfill material during curing of the underfill material. The resulting electronic module is more robust since the amine acts as a chemical anchoring site for both the modified passivation and the underfill material. A method of assembling an electronic module utilizing the polyamine treatment at the chip and wafer level is also disclosed.

Abstract translation: 公开了一种在芯片钝化和底部填充界面处具有增强的附着力的电子模块。 芯片钝化的表面被化学修饰到足够的深度，使得固化的钝化更具反应性。 改性表面用优选具有从优选脂肪族主链延伸的环状胺基团的多胺处理。 在通过加热回流电子模块的焊点时，改性的钝化剂在胺官能度下与多胺反应。 在具有聚合材料，优选环氧树脂的电子模块的底部填充之后，钝化剂表面上的多胺在底部填充材料的固化期间与底部填充材料反应。 所得到的电子模块更加坚固，因为胺用作修饰的钝化和底部填充材料的化学锚定位点。 还公开了利用芯片和晶片级的多胺处理来组装电子模块的方法。

公开(公告)号：US06639638B1

公开(公告)日：2003-10-28

申请号：US09385501

申请日：1999-08-27

Applicant: Ramesh R. Kodnani ,  Mark V. Pierson ,  William J. Rudik ,  David B. Stone

Inventor： Ramesh R. Kodnani ,  Mark V. Pierson ,  William J. Rudik ,  David B. Stone

IPC: G02F11335

CPC classification number: G02F1/13336 ,  G02F1/133504

Abstract: A large liquid crystal display optical structure can be created by providing a transparent substrate with a dark mesh pattern disposed thereon. A means for optical scattering is over, adjacent, or surrounding the dark mesh, with a polarizer laminated to a smooth surface of the means for optical scattering.

Abstract translation: 可以通过提供其上布置有深色网格图案的透明基板来产生大的液晶显示器光学结构。 用于光学散射的装置在黑色网格上方，相邻或围绕着，其中偏光镜层压到用于光学散射的装置的光滑表面上。

公开(公告)号：US06174406B1

公开(公告)日：2001-01-16

申请号：US09057630

申请日：1998-04-09

Applicant: Michael A. Gaynes ,  Ramesh R. Kodnani

Inventor： Michael A. Gaynes ,  Ramesh R. Kodnani

IPC: B32B3100

CPC classification number: F16B11/006 ,  B32B37/0007 ,  B32B37/1292 ,  B32B2315/08 ,  Y10T428/1059 ,  Y10T428/24802 ,  Y10T428/24826 ,  Y10T428/24843 ,  Y10T428/2852 ,  Y10T428/2891 ,  Y10T428/2896

Abstract: Two surfaces are adhesively bonded together by providing on one of the surfaces a central, single point adhesive contact deposit and providing on one of the surfaces, adhesive extending from a central point deposit in a spoke-like array diagonally across substantially the entire surface. Also provided is the article obtained by the above method as well as the assembly used for bonding the two surfaces together. The surfaces are brought together, one on top of the other, with the adhesive located between the surfaces to cause the adhesive to spread out and cover the surfaces to thereby bond them together.

Abstract translation: 两个表面通过在其中一个表面上提供中心的单点粘合剂接触沉积物并在其中一个表面上提供粘合剂粘合在一起，从中央点沉积物以一个辐射状阵列沿着对角线横跨基本上整个表面延伸的粘合剂。 还提供了通过上述方法获得的制品以及用于将两个表面粘合在一起的组装。 这些表面一个在另一个之上，粘合剂位于表面之间，以使粘合剂展开并覆盖表面，从而将它们粘合在一起。

公开(公告)号：US06770968B2

公开(公告)日：2004-08-03

申请号：US10369778

申请日：2003-02-19

Applicant: Frank D. Egitto ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Luis J. Matienzo ,  Mark V. Pierson

Inventor： Frank D. Egitto ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Luis J. Matienzo ,  Mark V. Pierson

IPC: H01L2334

CPC classification number: B29C59/14 ,  H01L21/56 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive. In particular, the film may be polytetrafluoroethylene, the adhesive may be polybutadine, and the film may be further impregnated with a metal oxide heat transfer medium, such as zinc oxide. An alternate method comprises applying the porous polymer film without plasma treatment and heat curing the film to form a proper bond.

Abstract translation: 一种用于将散热器粘合到封装的电子部件的方法包括以下步骤：（a）将形成在基底上的模制聚合物的表面暴露于等离子体; （b）允许等离子体至少部分地将表面上的含硅残余物转化为二氧化硅; 和（c）通过在制品和表面之间施加贴附物将物品粘合到表面上。 通常，含硅残渣是使用常规粘合方法和材料的硅油，脱模剂，可以防止形成粘结。 形成在模塑聚合物表面上的二氧化硅层有助于形成适当的键。 等离子体可以是氧等离子体，并且粘合剂可以选自具有金属氧化物填料的热固化的硅氧烷基糊状粘合剂或浸渍有粘合剂的热固化多孔聚合物膜。 特别地，膜可以是聚四氟乙烯，粘合剂可以是聚丁二烯，并且该膜可以进一步用金属氧化物传热介质如氧化锌浸渍。 替代方法包括在不进行等离子体处理的情况下应用多孔聚合物膜并热固化膜以形成适当的键。