公开(公告)号：US06770968B2

公开(公告)日：2004-08-03

申请号：US10369778

申请日：2003-02-19

申请人： Frank D. Egitto ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Luis J. Matienzo ,  Mark V. Pierson

发明人： Frank D. Egitto ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Luis J. Matienzo ,  Mark V. Pierson

IPC分类号： H01L2334

CPC分类号： B29C59/14 ,  H01L21/56 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive. In particular, the film may be polytetrafluoroethylene, the adhesive may be polybutadine, and the film may be further impregnated with a metal oxide heat transfer medium, such as zinc oxide. An alternate method comprises applying the porous polymer film without plasma treatment and heat curing the film to form a proper bond.

摘要翻译： 一种用于将散热器粘合到封装的电子部件的方法包括以下步骤：（a）将形成在基底上的模制聚合物的表面暴露于等离子体; （b）允许等离子体至少部分地将表面上的含硅残余物转化为二氧化硅; 和（c）通过在制品和表面之间施加贴附物将物品粘合到表面上。 通常，含硅残渣是使用常规粘合方法和材料的硅油，脱模剂，可以防止形成粘结。 形成在模塑聚合物表面上的二氧化硅层有助于形成适当的键。 等离子体可以是氧等离子体，并且粘合剂可以选自具有金属氧化物填料的热固化的硅氧烷基糊状粘合剂或浸渍有粘合剂的热固化多孔聚合物膜。 特别地，膜可以是聚四氟乙烯，粘合剂可以是聚丁二烯，并且该膜可以进一步用金属氧化物传热介质如氧化锌浸渍。 替代方法包括在不进行等离子体处理的情况下应用多孔聚合物膜并热固化膜以形成适当的键。

公开(公告)号：US06576996B2

公开(公告)日：2003-06-10

申请号：US09757159

申请日：2001-01-09

申请人： Frank D. Egitto ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Luis J. Matienzo ,  Mark V. Pierson

发明人： Frank D. Egitto ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Luis J. Matienzo ,  Mark V. Pierson

IPC分类号： H01L2334

CPC分类号： B29C59/14 ,  H01L21/56 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive. In particular, the film may be polytetrafluoroethylene, the adhesive may be polybutadine, and the film may be further impregnated with a metal oxide heat transfer medium, such as zinc oxide. An alternate method comprises applying the porous polymer film without plasma treatment and heat curing the film to form a proper bond.

公开(公告)号：US06719871B2

公开(公告)日：2004-04-13

申请号：US09757185

申请日：2001-01-09

申请人： Frank D. Egitto ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Luis J. Matienzo ,  Mark V. Pierson

发明人： Frank D. Egitto ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Luis J. Matienzo ,  Mark V. Pierson

IPC分类号： B32B3114

CPC分类号： B29C59/14 ,  H01L21/56 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive. In particular, the film may be polytetrafluoroethylene, the adhesive may be polybutadine, and the film may be further impregnated with a metal oxide heat transfer medium, such as zinc oxide. An alternate method comprises applying the porous polymer film without plasma treatment and heat curing the film to form a proper bond.

公开(公告)号：US06206997B1

公开(公告)日：2001-03-27

申请号：US09248341

申请日：1999-02-11

申请人： Frank D. Egitto ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Luis J. Matienzo ,  Mark V. Pierson

发明人： Frank D. Egitto ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Luis J. Matienzo ,  Mark V. Pierson

IPC分类号： B32B3112

CPC分类号： B29C59/14 ,  H01L21/56 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent material between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent material may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive. In particular, the film may be polytetrafluoroethylene, the adhesive may be polybutadine, and the film may be further impregnated with a metal oxide heat transfer medium, such as zinc oxide. An alternate method comprises applying the porous polymer film without plasma treatment and heat curing the film to form a proper bond.

摘要翻译： 一种用于将散热器粘合到封装的电子部件的方法包括以下步骤：（a）将形成在基底上的模制聚合物的表面暴露于等离子体; （b）允许等离子体至少部分地将表面上的含硅残余物转化为二氧化硅; 和（c）通过在制品和表面之间施加粘附材料将制品粘合到表面上。 通常，含硅残渣是使用常规粘合方法和材料的硅油，脱模剂，可以防止形成粘结。 形成在模塑聚合物表面上的二氧化硅层有助于形成适当的键。 等离子体可以是氧等离子体，并且粘附材料可以选自具有金属氧化物填料的热固化硅氧烷基糊状粘合剂或浸渍有粘合剂的热固化多孔聚合物膜。 特别地，膜可以是聚四氟乙烯，粘合剂可以是聚丁二烯，并且该膜可以进一步用金属氧化物传热介质如氧化锌浸渍。 替代方法包括在不进行等离子体处理的情况下应用多孔聚合物膜并热固化膜以形成适当的键。

公开(公告)号：US06248614B1

公开(公告)日：2001-06-19

申请号：US09272518

申请日：1999-03-19

申请人： Ramesh R. Kodnani ,  Luis J. Matienzo ,  Son K. Tran

发明人： Ramesh R. Kodnani ,  Luis J. Matienzo ,  Son K. Tran

IPC分类号： H01L2144

CPC分类号： H01L24/81 ,  C08G73/0611 ,  C08G73/0627 ,  H01L21/563 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14

摘要： An electronic module having enhanced adhesion at the chip passivation and underfill interface is disclosed. The surface of the chip passivation is chemically modified to a sufficient depth such that the cured passivation is more reactive. The modified surface is treated with a polyamine preferably having a cyclic amine group extending from a preferably aliphatic backbone. During reflow of the solder joints of the electronic module by heating, the modified passivation reacts with the polyamine at the amine functionality. Following underfill of the electronic module with a polymeric material, preferably an epoxy resin, the polyamine on the surface of the passivation reacts with the underfill material during curing of the underfill material. The resulting electronic module is more robust since the amine acts as a chemical anchoring site for both the modified passivation and the underfill material. A method of assembling an electronic module utilizing the polyamine treatment at the chip and wafer level is also disclosed.

摘要翻译： 公开了一种在芯片钝化和底部填充界面处具有增强的附着力的电子模块。 芯片钝化的表面被化学修饰到足够的深度，使得固化的钝化更具反应性。 改性表面用优选具有从优选脂肪族主链延伸的环状胺基团的多胺处理。 在通过加热回流电子模块的焊点时，改性的钝化剂在胺官能度下与多胺反应。 在具有聚合材料，优选环氧树脂的电子模块的底部填充之后，钝化剂表面上的多胺在底部填充材料的固化期间与底部填充材料反应。 所得到的电子模块更加坚固，因为胺用作修饰的钝化和底部填充材料的化学锚定位点。 还公开了利用芯片和晶片级的多胺处理来组装电子模块的方法。

公开(公告)号：US06596559B2

公开(公告)日：2003-07-22

申请号：US09822746

申请日：2001-03-30

申请人： Ramesh R. Kodnani ,  Luis J. Matienzo ,  Son K. Tran

发明人： Ramesh R. Kodnani ,  Luis J. Matienzo ,  Son K. Tran

IPC分类号： H01L2144

CPC分类号： H01L24/81 ,  C08G73/0611 ,  C08G73/0627 ,  H01L21/563 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14

摘要： An electronic module having enhanced adhesion at the chip passivation and underfill interface is disclosed. The surface of the chip passivation is chemically modified to a sufficient depth such that the cured passivation is more reactive. The modified surface is treated with a polyamine preferably having a cyclic amine group extending from a preferably aliphatic backbone. During reflow of the solder joints of the electronic module by heating, the modified passivation reacts with the polyamine at the amine functionality. Following underfill of the electronic module with a polymeric material, preferably an epoxy resin, the polyamine on the surface of the passivation reacts with the underfill material during curing of the underfill material. The resulting electronic module is more robust since the amine acts as a chemical anchoring site for both the modified passivation and the underfill material. A method of assembling an electronic module utilizing the polyamine treatment at the chip and wafer level is also disclosed.

摘要翻译： 公开了一种在芯片钝化和底部填充界面处具有增强的附着力的电子模块。 芯片钝化的表面被化学修饰到足够的深度，使得固化的钝化更具反应性。 改性表面用优选具有从优选脂肪族主链延伸的环状胺基团的多胺处理。 在通过加热回流电子模块的焊点时，改性的钝化剂在胺官能度下与多胺反应。 在具有聚合材料，优选环氧树脂的电子模块的底部填充之后，钝化剂表面上的多胺在底部填充材料的固化期间与底部填充材料反应。 所得到的电子模块更加坚固，因为胺用作修饰的钝化和底部填充材料的化学锚定位点。 还公开了利用芯片和晶片级的多胺处理来组装电子模块的方法。

公开(公告)号：US06713858B2

公开(公告)日：2004-03-30

申请号：US10404774

申请日：2003-03-31

申请人： Ramesh R. Kodnani ,  Luis J. Matienzo ,  Son K. Tran

发明人： Ramesh R. Kodnani ,  Luis J. Matienzo ,  Son K. Tran

IPC分类号： H01L2302

CPC分类号： H01L24/81 ,  C08G73/0611 ,  C08G73/0627 ,  H01L21/563 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14

摘要： An electronic module having enhanced adhesion at the chip passivation and underfill interface is disclosed. The surface of the chip passivation is chemically modified to a sufficient depth such that the cured passivation is more reactive. The modified surface is treated with a polyamine preferably having a cyclic amine group extending from a preferably aliphatic backbone. During reflow of the solder joints of the electronic module by heating, the modified passivation reacts with the polyamine at the amine functionality. Following underfill of the electronic module with a polymeric material, preferably an epoxy resin, the polyamine on the surface of the passivation reacts with the underfill material during curing of the underfill material. The resulting electronic module is more robust since the amine acts as a chemical anchoring site for both the modified passivation and the underfill material. A method of assembling an electronic module utilizing the polyamine treatment at the chip and wafer level is also disclosed.

摘要翻译： 公开了一种在芯片钝化和底部填充界面处具有增强的附着力的电子模块。 芯片钝化的表面被化学修饰到足够的深度，使得固化的钝化更具反应性。 改性表面用优选具有从优选脂肪族主链延伸的环状胺基团的多胺处理。 在通过加热回流电子模块的焊点时，改性的钝化剂在胺官能度下与多胺反应。 在具有聚合材料，优选环氧树脂的电子模块的底部填充之后，钝化剂表面上的多胺在底部填充材料的固化期间与底部填充材料反应。 所得到的电子模块更加坚固，因为胺用作修饰的钝化和底部填充材料的化学锚定位点。 还公开了利用芯片和晶片级的多胺处理来组装电子模块的方法。

公开(公告)号：US06607613B2

公开(公告)日：2003-08-19

申请号：US09775747

申请日：2001-02-01

申请人： Frank D. Egitto ,  Edmond O. Fey ,  Luis J. Matienzo ,  David L. Questad ,  Rajinder S. Rai ,  Daniel C. Van Hart

发明人： Frank D. Egitto ,  Edmond O. Fey ,  Luis J. Matienzo ,  David L. Questad ,  Rajinder S. Rai ,  Daniel C. Van Hart

IPC分类号： C22C1106

CPC分类号： C23C8/00 ,  B23K1/206 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/268 ,  B23K2101/40 ,  C23C26/00 ,  H05K3/3457 ,  H05K3/3489 ,  H05K2203/092 ,  H05K2203/095 ,  Y10T428/12 ,  Y10T428/12021 ,  Y10T428/12458 ,  Y10T428/12493 ,  Y10T428/12687

摘要： A metal alloy solder ball comprising a first metal and a second metal, the first metal having a sputtering yield greater than the second metal. The solder ball comprises a bulk portion having a bulk ratio of the first metal to the second metal, an outer surface, and a surface gradient having a depth and a gradient ratio of the first metal to the second metal that is less than the bulk ratio. The gradient ratio increases along the surface gradient depth from a minimum at the outer surface. The solder ball may be formed by the process of exposing the ball to energized ions of a sputtering gas for an effective amount of time to form the surface gradient.

摘要翻译： 一种包含第一金属和第二金属的金属合金焊球，所述第一金属的溅射产率大于所述第二金属。 焊球包括具有第一金属与第二金属的体积比的主体部分，外表面和具有小于体积比的第一金属与第二金属的深度和梯度比的表面梯度 。 梯度比沿着表面梯度深度从外表面的最小值增加。 可以通过将球暴露于溅射气体的激发离子有效时间以形成表面梯度的过程来形成焊球。

公开(公告)号：US20110260299A1

公开(公告)日：2011-10-27

申请号：US12765110

申请日：2010-04-22

申请人： Robert D. Edwards ,  Frank D. Egitto ,  Luis J. Matienzo ,  Susan Pitely ,  Daniel C. Van Hart

发明人： Robert D. Edwards ,  Frank D. Egitto ,  Luis J. Matienzo ,  Susan Pitely ,  Daniel C. Van Hart

IPC分类号： H01L23/50 ,  H05K3/00 ,  H01L21/441

CPC分类号： H05K3/0055 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K2201/015 ,  H05K2201/09509 ,  H05K2203/095 ,  H01L2924/00

摘要： A semiconductor printed circuit board assembly (PCBA) and method for making same for use in electronic packages having a core layer of copper-invar-copper (CIC) with a layer of dielectric substrate placed on the core layer. A second layer of dielectric substrate is placed on the lower surface of the core layer of CIC. The layers are laminated together. Blind vias are laser drilled into the layers of dielectric substrate. The partially completed PCBA is subjected to a reactive ion etch (RIE) plasma as a first step to clean blind vias in the PCBA. After the plasma etch, an acidic etchant liquid solution is used on the blind vias. Pre-plating cleaning of blind vias removes a majority of oxides from the blind vias. Seed copper layers are then applied to the PCBA, followed by a layer of copper plating that can be etched to meet the requirements of the PCBA.

摘要翻译： 一种半导体印刷电路板组件（PCBA）及其制造方法，用于具有放置在芯层上的介电基片层的具有铜 - 铜 - 铜（CIC）芯层的电子封装。 第二层电介质基片放置在CIC芯层的下表面上。 层叠在一起。 盲孔通过激光钻入电介质基片的层中。 部分完成的PCBA经受反应离子蚀刻（RIE）等离子体作为清洁PCBA中的盲孔的第一步骤。 在等离子体蚀刻之后，在盲孔上使用酸性蚀刻剂液体溶液。 盲孔的电镀前清洁从盲孔中除去大部分氧化物。 然后将种子铜层施加到PCBA，随后是可以被蚀刻以满足PCBA的要求的一层镀铜层。

公开(公告)号：US07307022B2

公开(公告)日：2007-12-11

申请号：US11327493

申请日：2006-01-09

申请人： Frank D. Egitto ,  Stephen Krasniak ,  John M. Lauffer ,  Voya R. Markovich ,  Luis J. Matienzo

发明人： Frank D. Egitto ,  Stephen Krasniak ,  John M. Lauffer ,  Voya R. Markovich ,  Luis J. Matienzo

IPC分类号： H01L21/44 ,  C25D5/02

CPC分类号： H05K3/384 ,  H05K1/056 ,  H05K3/386 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0353 ,  H05K2203/0723

摘要： A method of treating a conductive layer to assure enhanced adhesion of the layer to selected dielectric layers used to form a circuitized substrate. The conductive layer includes at least one surface with the appropriate roughness to enable such adhesion and also good signal passage if the layer is used as a signal layer. The method is extendible to the formation of such substrates, including to the formation of multilayered substrates having many conductive and dielectric layers. Such substrates may include one or more electrical components (e.g., semiconductor chips) mounted thereon and may also be mounted themselves onto other substrates.

摘要翻译： 一种处理导电层以确保该层对用于形成电路化基底的所选电介质层的附着力的方法。 导电层包括具有适当粗糙度的至少一个表面以实现这种粘附，并且如果该层用作信号层，则还具有良好的信号通过。 该方法可扩展到形成这种衬底，包括形成具有许多导电和电介质层的多层衬底。 这样的基板可以包括安装在其上的一个或多个电气部件（例如，半导体芯片），并且也可以将它们本身安装到其它基板上。