公开(公告)号：US06248614B1

公开(公告)日：2001-06-19

申请号：US09272518

申请日：1999-03-19

申请人： Ramesh R. Kodnani ,  Luis J. Matienzo ,  Son K. Tran

发明人： Ramesh R. Kodnani ,  Luis J. Matienzo ,  Son K. Tran

IPC分类号： H01L2144

CPC分类号： H01L24/81 ,  C08G73/0611 ,  C08G73/0627 ,  H01L21/563 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14

摘要： An electronic module having enhanced adhesion at the chip passivation and underfill interface is disclosed. The surface of the chip passivation is chemically modified to a sufficient depth such that the cured passivation is more reactive. The modified surface is treated with a polyamine preferably having a cyclic amine group extending from a preferably aliphatic backbone. During reflow of the solder joints of the electronic module by heating, the modified passivation reacts with the polyamine at the amine functionality. Following underfill of the electronic module with a polymeric material, preferably an epoxy resin, the polyamine on the surface of the passivation reacts with the underfill material during curing of the underfill material. The resulting electronic module is more robust since the amine acts as a chemical anchoring site for both the modified passivation and the underfill material. A method of assembling an electronic module utilizing the polyamine treatment at the chip and wafer level is also disclosed.

摘要翻译： 公开了一种在芯片钝化和底部填充界面处具有增强的附着力的电子模块。 芯片钝化的表面被化学修饰到足够的深度，使得固化的钝化更具反应性。 改性表面用优选具有从优选脂肪族主链延伸的环状胺基团的多胺处理。 在通过加热回流电子模块的焊点时，改性的钝化剂在胺官能度下与多胺反应。 在具有聚合材料，优选环氧树脂的电子模块的底部填充之后，钝化剂表面上的多胺在底部填充材料的固化期间与底部填充材料反应。 所得到的电子模块更加坚固，因为胺用作修饰的钝化和底部填充材料的化学锚定位点。 还公开了利用芯片和晶片级的多胺处理来组装电子模块的方法。

公开(公告)号：US06596559B2

公开(公告)日：2003-07-22

申请号：US09822746

申请日：2001-03-30

申请人： Ramesh R. Kodnani ,  Luis J. Matienzo ,  Son K. Tran

发明人： Ramesh R. Kodnani ,  Luis J. Matienzo ,  Son K. Tran

IPC分类号： H01L2144

CPC分类号： H01L24/81 ,  C08G73/0611 ,  C08G73/0627 ,  H01L21/563 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14

摘要： An electronic module having enhanced adhesion at the chip passivation and underfill interface is disclosed. The surface of the chip passivation is chemically modified to a sufficient depth such that the cured passivation is more reactive. The modified surface is treated with a polyamine preferably having a cyclic amine group extending from a preferably aliphatic backbone. During reflow of the solder joints of the electronic module by heating, the modified passivation reacts with the polyamine at the amine functionality. Following underfill of the electronic module with a polymeric material, preferably an epoxy resin, the polyamine on the surface of the passivation reacts with the underfill material during curing of the underfill material. The resulting electronic module is more robust since the amine acts as a chemical anchoring site for both the modified passivation and the underfill material. A method of assembling an electronic module utilizing the polyamine treatment at the chip and wafer level is also disclosed.

摘要翻译： 公开了一种在芯片钝化和底部填充界面处具有增强的附着力的电子模块。 芯片钝化的表面被化学修饰到足够的深度，使得固化的钝化更具反应性。 改性表面用优选具有从优选脂肪族主链延伸的环状胺基团的多胺处理。 在通过加热回流电子模块的焊点时，改性的钝化剂在胺官能度下与多胺反应。 在具有聚合材料，优选环氧树脂的电子模块的底部填充之后，钝化剂表面上的多胺在底部填充材料的固化期间与底部填充材料反应。 所得到的电子模块更加坚固，因为胺用作修饰的钝化和底部填充材料的化学锚定位点。 还公开了利用芯片和晶片级的多胺处理来组装电子模块的方法。

公开(公告)号：US06713858B2

公开(公告)日：2004-03-30

申请号：US10404774

申请日：2003-03-31

申请人： Ramesh R. Kodnani ,  Luis J. Matienzo ,  Son K. Tran

发明人： Ramesh R. Kodnani ,  Luis J. Matienzo ,  Son K. Tran

IPC分类号： H01L2302

CPC分类号： H01L24/81 ,  C08G73/0611 ,  C08G73/0627 ,  H01L21/563 ,  H01L2224/73203 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14

摘要： An electronic module having enhanced adhesion at the chip passivation and underfill interface is disclosed. The surface of the chip passivation is chemically modified to a sufficient depth such that the cured passivation is more reactive. The modified surface is treated with a polyamine preferably having a cyclic amine group extending from a preferably aliphatic backbone. During reflow of the solder joints of the electronic module by heating, the modified passivation reacts with the polyamine at the amine functionality. Following underfill of the electronic module with a polymeric material, preferably an epoxy resin, the polyamine on the surface of the passivation reacts with the underfill material during curing of the underfill material. The resulting electronic module is more robust since the amine acts as a chemical anchoring site for both the modified passivation and the underfill material. A method of assembling an electronic module utilizing the polyamine treatment at the chip and wafer level is also disclosed.

摘要翻译： 公开了一种在芯片钝化和底部填充界面处具有增强的附着力的电子模块。 芯片钝化的表面被化学修饰到足够的深度，使得固化的钝化更具反应性。 改性表面用优选具有从优选脂肪族主链延伸的环状胺基团的多胺处理。 在通过加热回流电子模块的焊点时，改性的钝化剂在胺官能度下与多胺反应。 在具有聚合材料，优选环氧树脂的电子模块的底部填充之后，钝化剂表面上的多胺在底部填充材料的固化期间与底部填充材料反应。 所得到的电子模块更加坚固，因为胺用作修饰的钝化和底部填充材料的化学锚定位点。 还公开了利用芯片和晶片级的多胺处理来组装电子模块的方法。

公开(公告)号：US06770968B2

公开(公告)日：2004-08-03

申请号：US10369778

申请日：2003-02-19

申请人： Frank D. Egitto ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Luis J. Matienzo ,  Mark V. Pierson

发明人： Frank D. Egitto ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Luis J. Matienzo ,  Mark V. Pierson

IPC分类号： H01L2334

CPC分类号： B29C59/14 ,  H01L21/56 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive. In particular, the film may be polytetrafluoroethylene, the adhesive may be polybutadine, and the film may be further impregnated with a metal oxide heat transfer medium, such as zinc oxide. An alternate method comprises applying the porous polymer film without plasma treatment and heat curing the film to form a proper bond.

摘要翻译： 一种用于将散热器粘合到封装的电子部件的方法包括以下步骤：（a）将形成在基底上的模制聚合物的表面暴露于等离子体; （b）允许等离子体至少部分地将表面上的含硅残余物转化为二氧化硅; 和（c）通过在制品和表面之间施加贴附物将物品粘合到表面上。 通常，含硅残渣是使用常规粘合方法和材料的硅油，脱模剂，可以防止形成粘结。 形成在模塑聚合物表面上的二氧化硅层有助于形成适当的键。 等离子体可以是氧等离子体，并且粘合剂可以选自具有金属氧化物填料的热固化的硅氧烷基糊状粘合剂或浸渍有粘合剂的热固化多孔聚合物膜。 特别地，膜可以是聚四氟乙烯，粘合剂可以是聚丁二烯，并且该膜可以进一步用金属氧化物传热介质如氧化锌浸渍。 替代方法包括在不进行等离子体处理的情况下应用多孔聚合物膜并热固化膜以形成适当的键。

公开(公告)号：US06576996B2

公开(公告)日：2003-06-10

申请号：US09757159

申请日：2001-01-09

申请人： Frank D. Egitto ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Luis J. Matienzo ,  Mark V. Pierson

发明人： Frank D. Egitto ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Luis J. Matienzo ,  Mark V. Pierson

IPC分类号： H01L2334

CPC分类号： B29C59/14 ,  H01L21/56 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive. In particular, the film may be polytetrafluoroethylene, the adhesive may be polybutadine, and the film may be further impregnated with a metal oxide heat transfer medium, such as zinc oxide. An alternate method comprises applying the porous polymer film without plasma treatment and heat curing the film to form a proper bond.

公开(公告)号：US06719871B2

公开(公告)日：2004-04-13

申请号：US09757185

申请日：2001-01-09

申请人： Frank D. Egitto ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Luis J. Matienzo ,  Mark V. Pierson

发明人： Frank D. Egitto ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Luis J. Matienzo ,  Mark V. Pierson

IPC分类号： B32B3114

CPC分类号： B29C59/14 ,  H01L21/56 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive. In particular, the film may be polytetrafluoroethylene, the adhesive may be polybutadine, and the film may be further impregnated with a metal oxide heat transfer medium, such as zinc oxide. An alternate method comprises applying the porous polymer film without plasma treatment and heat curing the film to form a proper bond.

公开(公告)号：US06206997B1

公开(公告)日：2001-03-27

申请号：US09248341

申请日：1999-02-11

申请人： Frank D. Egitto ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Luis J. Matienzo ,  Mark V. Pierson

发明人： Frank D. Egitto ,  Michael A. Gaynes ,  Ramesh R. Kodnani ,  Luis J. Matienzo ,  Mark V. Pierson

IPC分类号： B32B3112

CPC分类号： B29C59/14 ,  H01L21/56 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent material between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent material may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive. In particular, the film may be polytetrafluoroethylene, the adhesive may be polybutadine, and the film may be further impregnated with a metal oxide heat transfer medium, such as zinc oxide. An alternate method comprises applying the porous polymer film without plasma treatment and heat curing the film to form a proper bond.

摘要翻译： 一种用于将散热器粘合到封装的电子部件的方法包括以下步骤：（a）将形成在基底上的模制聚合物的表面暴露于等离子体; （b）允许等离子体至少部分地将表面上的含硅残余物转化为二氧化硅; 和（c）通过在制品和表面之间施加粘附材料将制品粘合到表面上。 通常，含硅残渣是使用常规粘合方法和材料的硅油，脱模剂，可以防止形成粘结。 形成在模塑聚合物表面上的二氧化硅层有助于形成适当的键。 等离子体可以是氧等离子体，并且粘附材料可以选自具有金属氧化物填料的热固化硅氧烷基糊状粘合剂或浸渍有粘合剂的热固化多孔聚合物膜。 特别地，膜可以是聚四氟乙烯，粘合剂可以是聚丁二烯，并且该膜可以进一步用金属氧化物传热介质如氧化锌浸渍。 替代方法包括在不进行等离子体处理的情况下应用多孔聚合物膜并热固化膜以形成适当的键。

公开(公告)号：US06348738B1

公开(公告)日：2002-02-19

申请号：US09371975

申请日：1999-08-11

申请人： Jean Dery ,  Frank D. Egitto ,  Luis J. Matienzo ,  Charles Ouellet ,  Luc Ouellet ,  David L. Questad ,  William J. Rudik ,  Son K. Tran

发明人： Jean Dery ,  Frank D. Egitto ,  Luis J. Matienzo ,  Charles Ouellet ,  Luc Ouellet ,  David L. Questad ,  William J. Rudik ,  Son K. Tran

IPC分类号： H01L2348

CPC分类号： H01L24/28 ,  H01L21/563 ,  H01L24/45 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  Y10S438/959 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/48

摘要： A method for forming a flip-chip-on-board assembly. An integrated circuit (IC) chip having a polyimide passivation layer is joined to a chip carrier via a plurality of solder bumps which electrically connect a plurality of contact pads on the IC chip to corresponding contacts on the chip carrier. A space is formed between a surface of the passivation layer and a surface of the chip carrier. A plasma is applied, to chemically modify the surface of the chip carrier and the passivation layer of the IC chip substantially without roughening the surface of the passivation layer. The plasma is either an O2 plasma or a microwave-generated Ar and N2O plasma. An underfill encapsulant material is applied to fill the space. The plasma treatment may be performed after the step of joining. Then, the chip and chip carrier are treated with the plasma simultaneously. Alternatively, the IC chip and chip carrier may be treated with the plasma before they are joined to one another. The plasma treatment improves adhesion between the encapsulant and the IC chip, and between the encapsulant and the chip carrier.

摘要翻译： 一种用于形成板上倒装芯片组件的方法。 具有聚酰亚胺钝化层的集成电路（IC）芯片通过将IC芯片上的多个接触焊盘电连接到芯片载体上的相应触点的多个焊料凸块而接合到芯片载体。 在钝化层的表面和芯片载体的表面之间形成空间。 施加等离子体以化学改性芯片载体的表面和IC芯片的钝化层，基本上不使钝化层的表面变粗糙。 等离子体是O2等离子体或微波产生的Ar和N2O等离子体。 应用底部填充密封材料填充空间。 等离子体处理可以在接合步骤之后进行。 然后，同时用等离子体处理芯片和芯片载体。 或者，IC芯片和芯片载体可以在彼此接合之前用等离子体处理。 等离子体处理改善了密封剂和IC芯片之间以及密封剂和芯片载体之间的粘合性。

公开(公告)号：US06306683B1

公开(公告)日：2001-10-23

申请号：US09526569

申请日：2000-03-16

申请人： Jean Dery ,  Frank D. Egitto ,  Luis J. Matienzo ,  Charles Ouellet ,  Luc Ouellet ,  David L. Questad ,  William J. Rudik ,  Son K. Tran

发明人： Jean Dery ,  Frank D. Egitto ,  Luis J. Matienzo ,  Charles Ouellet ,  Luc Ouellet ,  David L. Questad ,  William J. Rudik ,  Son K. Tran

IPC分类号： H01L2144

CPC分类号： H01L24/28 ,  H01L21/563 ,  H01L24/45 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  Y10S438/959 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/48

摘要： A method for forming a flip-chip-on-board assembly. An integrated circuit (IC) chip having a polyimide passivation layer is joined to a chip carrier via a plurality of solder bumps which electrically connect a plurality of contact pads on the IC chip to corresponding contacts on the chip carrier. A space is formed between a surface of the passivation layer and a surface of the chip carrier. A plasma is applied, to chemically modify the surface of the chip carrier and the passivation layer of the IC chip substantially without roughening the surface of the passivation layer. The plasma is either an O2 plasma or a microwave-generated Ar and N2O plasma. An underfill encapsulant material is applied to fill the space. The plasma treatment may be performed after the step of joining. Then, the chip and chip carrier are treated with the plasma simultaneously. Alternatively, the IC chip and chip carrier may be treat with the plasma before they are joined to one another. The plasma treatment improves adhesion between the encapsulant and the IC chip, and between the encapsulant and the chip carrier.

摘要翻译： 一种用于形成板上倒装芯片组件的方法。 具有聚酰亚胺钝化层的集成电路（IC）芯片通过将IC芯片上的多个接触焊盘电连接到芯片载体上的相应触点的多个焊料凸块而接合到芯片载体。 在钝化层的表面和芯片载体的表面之间形成空间。 施加等离子体以化学改性芯片载体的表面和IC芯片的钝化层，基本上不使钝化层的表面变粗糙。 等离子体是O2等离子体或微波产生的Ar和N2O等离子体。 应用底部填充密封材料填充空间。 等离子体处理可以在接合步骤之后进行。 然后，同时用等离子体处理芯片和芯片载体。 或者，IC芯片和芯片载体可以在彼此接合之前用等离子体处理。 等离子体处理改善了密封剂和IC芯片之间以及密封剂和芯片载体之间的粘合性。

公开(公告)号：US6074895A

公开(公告)日：2000-06-13

申请号：US936032

申请日：1997-09-23

申请人： Jean Dery ,  Frank D. Egitto ,  Luis J. Matienzo ,  Charles Ouellet ,  Luc Ouellet ,  David L. Questad ,  William J. Rudik ,  Son K. Tran

发明人： Jean Dery ,  Frank D. Egitto ,  Luis J. Matienzo ,  Charles Ouellet ,  Luc Ouellet ,  David L. Questad ,  William J. Rudik ,  Son K. Tran

IPC分类号： H01L21/56 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L24/28 ,  H01L21/563 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L24/45 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  Y10S438/959

摘要： A method for forming a flip-chip-on-board assembly. An integrated circuit (IC) chip having a polyimide passivation layer is joined to a chip carrier via a plurality of solder bumps which electrically connect a plurality of contact pads on the IC chip to corresponding contacts on the chip carrier. A space is formed between a surface of the passivation layer and a surface of the chip carrier. A plasma is applied, to chemically modify the a surface of the chip carrier and the passivation layer of the IC chip substantially without roughening the surface of the passivation layer. The plasma is either an O.sub.2 plasma or a microwave-generated Ar and N.sub.2 O plasma. An underfill encapsulant material is applied to fill the space. The plasma treatment may be performed after the step of joining. Then, the chip and chip carrier are treated with the plasma simultaneously. Alternatively, the IC chip and chip carrier may be treated with the plasma before they are joined to one another. The plasma treatment improves adhesion between the encapsulant and the IC chip, and between the encapsulant and the chip carrier.

摘要翻译： 一种用于形成板上倒装芯片组件的方法。 具有聚酰亚胺钝化层的集成电路（IC）芯片通过将IC芯片上的多个接触焊盘电连接到芯片载体上的相应触点的多个焊料凸块而接合到芯片载体。 在钝化层的表面和芯片载体的表面之间形成空间。 施加等离子体，以化学改性芯片载体的表面和IC芯片的钝化层，基本上不使钝化层的表面变粗糙。 等离子体是O2等离子体或微波产生的Ar和N2O等离子体。 应用底部填充密封材料填充空间。 等离子体处理可以在接合步骤之后进行。 然后，同时用等离子体处理芯片和芯片载体。 或者，IC芯片和芯片载体可以在彼此接合之前用等离子体处理。 等离子体处理改善了密封剂和IC芯片之间以及密封剂和芯片载体之间的粘合性。